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AX-SFUS-API-1-01-TB05

Onsemi

AX-SFUS-API-1-01-TB05 by Onsemi

AX-SFUS-API-1-01-TB05 by Onsemi is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.6V, making it ideal for INDUSTRIAL applications requiring high performance in compact spaces.

Median Price

$1.929

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$1.660

100+ parts

-

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1,000

$1.660

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Arrow

USA . 1,000 parts In-Stock

1+ parts

$1.989

100+ parts

$1.869

1k+ parts

$1.778

10k+ parts

-

1,000

$1.989

$1.869

$1.778

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.869

1k+ parts

$1.778

10k+ parts

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1,000

-

$1.869

$1.778

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Farnell

UK . 500 parts In-Stock

1+ parts

-

100+ parts

$2.280

1k+ parts

$2.050

10k+ parts

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500

-

$2.280

$2.050

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Flip Electronics (Authorized)

USA . 500 parts In-Stock

1+ parts

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500

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Distributors (In-Stock)

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Digiode

USA . 2,138 parts In-Stock

1+ parts

$1.027

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2,138

$1.027

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$1.269

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450

$1.269

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Vyrian

USA . 3,338 parts In-Stock

1+ parts

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3,338

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Bristol Electronics

USA . 972 parts In-Stock

1+ parts

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972

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Dan-Mar Components

USA . 972 parts In-Stock

1+ parts

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972

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Flip Electronics

USA . 500 parts In-Stock

1+ parts

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500

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ACDS - Activité Composants Distribution Service

France . 500 parts In-Stock

1+ parts

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500

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VNN

France . 109 parts In-Stock

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109

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Goldney Electronics S.L.

Spain . 60 parts In-Stock

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60

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Distributors (Availability)

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Andel Nordic

Denmark . 3,914 parts In-Stock

1+ parts

$0.090

100+ parts

-

1k+ parts

$0.061

10k+ parts

$0.061

3,914

$0.090

-

$0.061

$0.061

Ampacity Inc.

Singapore . 542 parts In-Stock

1+ parts

$0.860

100+ parts

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542

$0.860

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Semicontronic

India . 362 parts In-Stock

1+ parts

$0.860

100+ parts

$0.838

1k+ parts

$0.834

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362

$0.860

$0.838

$0.834

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Corphita

USA . 359 parts In-Stock

1+ parts

$0.973

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359

$0.973

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Corohmni

South Africa . 475 parts In-Stock

1+ parts

$1.015

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475

$1.015

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Continental Prestige Electronics

USA . 500 parts In-Stock

1+ parts

$1.180

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500

$1.180

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Argo Parts USA

USA . 2,987 parts In-Stock

1+ parts

$1.269

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2,987

$1.269

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.269

100+ parts

$1.244

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1,000

$1.269

$1.244

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AZTECH Wire

Italy . 905 parts In-Stock

1+ parts

$21.530

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905

$21.530

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QUARKTWIN TECHNOLOGY LTD

USA . 11,662 parts In-Stock

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SupplyDigital Components

Austria . 6,088 parts In-Stock

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Problanco Electronics

Mexico . 5,233 parts In-Stock

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UHIMA Technologies

Türkiye . 768 parts In-Stock

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768

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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TANS Electronics

Latvia . 243 parts In-Stock

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243

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Kulean Microsystems

USA . 205 parts In-Stock

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205

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Overview

Elevate your projects with the AX-SFUS-API-1-01-TB05 by Onsemi. Manufactured by a trusted name in the industry, this cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, boasting high-quality surface mount technology and a wide range of applications. With its exceptional value and benefits, customers can expect top-notch performance, reliability, and efficiency in their designs. Upgrade your tech game with the AX-SFUS-API-1-01-TB05 today!

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient mounting onto a PCB, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making the product versatile in various applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and provides stability and ease of handling during assembly and installation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX-SFUS-API-1-01-TB05 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX-SFUS-API-1-01-TB05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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