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AX-SFUS-1-01-TX30

Onsemi

AX-SFUS-1-01-TX30 by Onsemi

AX-SFUS-1-01-TX30 by Onsemi is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.6V, making it ideal for industrial applications requiring high performance in a compact form factor.

Median Price

$12.250

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 292,674 parts In-Stock

1+ parts

-

100+ parts

$11.350

1k+ parts

$10.160

10k+ parts

$9.560

292,674

-

$11.350

$10.160

$9.560

DigiKey

USA . 288,000 parts In-Stock

1+ parts

-

100+ parts

$13.150

1k+ parts

$13.150

10k+ parts

$13.150

288,000

-

$13.150

$13.150

$13.150

Farnell

UK . 288,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$9.970

288,000

-

-

-

$9.970

Verical

USA . 282,000 parts In-Stock

1+ parts

-

100+ parts

$14.188

1k+ parts

$12.700

10k+ parts

$11.950

282,000

-

$14.188

$12.700

$11.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 696 parts In-Stock

1+ parts

$9.970

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$9.970

-

-

-

Digiode

USA . 483 parts In-Stock

1+ parts

$12.008

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$12.008

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,917 parts In-Stock

1+ parts

$11.376

100+ parts

-

1k+ parts

-

10k+ parts

-

1,917

$11.376

-

-

-

Corohmni

South Africa . 518 parts In-Stock

1+ parts

$50.878

100+ parts

-

1k+ parts

-

10k+ parts

-

518

$50.878

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$64.815

100+ parts

$58.982

1k+ parts

$53.148

10k+ parts

-

1,000

$64.815

$58.982

$53.148

-

Native Components

USA . 318 parts In-Stock

1+ parts

$68.070

100+ parts

-

1k+ parts

-

10k+ parts

$65.347

318

$68.070

-

-

$65.347

Northwest PG Solutions

USA . 1,644 parts In-Stock

1+ parts

$74.877

100+ parts

-

1k+ parts

-

10k+ parts

-

1,644

$74.877

-

-

-

Continental Prestige Electronics

USA . 288,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.970

10k+ parts

-

288,000

-

-

$9.970

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,491 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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11,491

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-

-

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Problanco Electronics

Mexico . 7,580 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,580

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-

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TANS Electronics

Latvia . 7,246 parts In-Stock

1+ parts

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100+ parts

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7,246

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-

-

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SupplyDigital Components

Austria . 5,011 parts In-Stock

1+ parts

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100+ parts

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5,011

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

-

Kulean Microsystems

USA . 4,422 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,422

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-

-

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UHIMA Technologies

Türkiye . 841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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841

-

-

-

-

Overview

Looking to elevate your electronic devices? Look no further than the AX-SFUS-1-01-TX30 by Onsemi. With a focus on quality and innovation, Onsemi is a trusted manufacturer in the industry. This product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for various applications. The AX-SFUS-1-01-TX30 offers exceptional value with its reliable performance, efficient design, and wide operating temperature range. Upgrade your devices today with this cutting-edge technology from Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and improving overall design flexibility.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage allows for compatibility with a variety of power sources and applications.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and facilitates easy integration into circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package styles offer flexibility in design and heat dissipation options for different operating conditions.

Minimum Supply Voltage: 1.8 V

Support for a low minimum supply voltage allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in industrial environments where temperatures can vary.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in harsh temperature conditions without compromising functionality.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel gold palladium terminal finish offers excellent corrosion resistance and ensures long-term reliability of the product.

Terminal Position: QUAD

Quad terminal position provides stable and secure connection points for efficient signal transmission.

Maximum Seated Height: 1 mm

Low maximum seated height enables compact design and integration in small electronic devices.

Width: 5 mm

Narrow width contributes to space-saving design considerations and compact PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperatures for an extended duration ensures reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables efficient soldering and assembly processes without compromising product integrity.

Length: 7 mm

Moderate length allows for easy integration into circuit layouts while maintaining a compact form factor.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates the product's reliability and suitability for operation in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit enhances the product's functionality and processing capabilities for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable for different use cases.

Terminal Form: NO LEAD

No-lead terminal form simplifies the manufacturing process, enhances durability, and supports RoHS compliance for environmentally friendly production.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is commonly used, ensuring compatibility with standard power sources and electronic components.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and precise connections on the PCB, enhancing overall design flexibility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX-SFUS-1-01-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX-SFUS-1-01-TX30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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