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XCZU15EG-2FFVC900I

Xilinx

XCZU15EG-2FFVC900I by Xilinx

XCZU15EG-2FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance and reliability.

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$6,864.700

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Overview

Unlock a world of endless possibilities with the XCZU15EG-2FFVC900I by Xilinx. This top-notch product from a trusted manufacturer offers unparalleled quality and reliability in the field of Other Function uPs, uCs & Peripheral ICs. Ideal for industrial applications, this cutting-edge microprocessor circuit ensures peak performance even in extreme conditions. Experience seamless operations and optimized functionality with the XCZU15EG-2FFVC900I, your ultimate solution for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount design allows for easy and convenient installation, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product is suitable for a wide range of applications, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient use of board space, making it a space-saving choice for compact designs.

No. of Terminals: 900

The high number of terminals allows for a greater number of connections, making it versatile for intricate circuitry requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers better heat dissipation and electrical performance, enhancing the overall reliability of the product.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures energy efficiency and is suitable for applications requiring low power consumption.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in extreme cold conditions, making it suitable for various environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for efficient heat dissipation and easier PCB layout, contributing to improved performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, the product is less prone to thermal stress, ensuring stable performance during assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature enables reliable soldering and avoids damage to the product during the manufacturing process.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in industrial settings with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The peripheral IC type of microprocessor circuit offers advanced functionality and processing capabilities, suitable for complex applications.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Terminal Form: BALL

The ball terminal form allows for easy installation and removal, facilitating maintenance and servicing of the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides a stable power source, ensuring consistent performance in diverse operating conditions.

Moisture Sensitivity Level (MSL): 4

With a low moisture sensitivity level, the product is resistant to moisture-induced damage, increasing its reliability in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU15EG-2FFVC900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU15EG-2FFVC900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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