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XCZU15EG-2FFVB1156I

Xilinx

XCZU15EG-2FFVB1156I by Xilinx

XCZU15EG-2FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$8,337.190

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DigiKey

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

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Modulus Dynamics

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Corohmni

South Africa . 3,109 parts In-Stock

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Qasali Group International

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Vigor

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One Stop Electronics

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Ampacity Inc.

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Continental Prestige Electronics

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Argo Parts USA

USA . 3,293 parts In-Stock

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Semicontronic

India . 2 parts In-Stock

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Singapore . 58 parts In-Stock

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Overview

Discover the cutting-edge XCZU15EG-2FFVB1156I by Xilinx, a top-tier manufacturer known for its high-quality products. This versatile microprocessor circuit offers endless possibilities in various applications, from automotive to industrial automation. With Xilinx's reputation for innovation and reliability, customers can trust in the value and benefits this product delivers. Experience superior performance, efficiency, and flexibility with the XCZU15EG-2FFVB1156I, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and a more compact design, making it suitable for space-constrained environments.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for a wide range of power options, making it versatile for different power requirements.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into circuit designs and provides a standardized form factor for compatibility with various devices.

No. of Terminals: 1156

With a high number of terminals, this product can support complex circuit configurations and connections for enhanced functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers a secure and stable mounting solution, ensuring reliability in harsh operating conditions.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage allows for efficient power consumption, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand extreme conditions, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of climates and conditions, making it versatile for various applications.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term reliability.

Terminal Position: BOTTOM

The terminal position on the bottom allows for easy PCB mounting and efficient heat dissipation, enhancing overall performance and durability.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the product can withstand reflow processes without compromising its functionality, making it suitable for manufacturing processes.

Peak Reflow Temperature °C: 245

With a high peak reflow temperature, this product can endure high-temperature soldering processes, ensuring robust construction and longevity.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designates the product for use in industrial applications, ensuring reliable performance in demanding conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

This type of peripheral IC offers advanced processing capabilities, making it ideal for applications requiring high computational power.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable for various applications.

Terminal Form: BALL

The ball terminal form offers secure connections and easy mounting, ensuring stable and durable performance in various operating conditions.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides a standard power level for consistent performance, making this product easy to integrate into existing systems.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product is suitable for use in environments with moderate humidity levels, ensuring long-term reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU15EG-2FFVB1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU15EG-2FFVB1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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