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XCZU11EG-2FFVB1517I

Xilinx

XCZU11EG-2FFVB1517I by Xilinx

XCZU11EG-2FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$6,970.498

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 750 parts In-Stock

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Vyrian

USA . 6,717 parts In-Stock

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Digiode

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Ampacity Inc.

Singapore . 1,235 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 644 parts In-Stock

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MARBEL Systems

Belgium . 450 parts In-Stock

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Texas Native Microelectronics

USA . 87 parts In-Stock

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$21.155

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Corohmni

South Africa . 465 parts In-Stock

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$26.181

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Kenton Components

USA . 100 parts In-Stock

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Semicontronic

India . 708 parts In-Stock

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One Stop Electronics

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Modulus Dynamics

Lithuania . 1,525 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,890 parts In-Stock

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Qasali Group International

UK . 4,333 parts In-Stock

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Advanced Electronics

New Zealand . 4,546 parts In-Stock

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Microchip USA

USA . 1,190 parts In-Stock

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$3,635.604

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Continental Prestige Electronics

USA . 5,538 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 373 parts In-Stock

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$6,900.793

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$6,831.088

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$6,761.383

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Supply Digital

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Vigor

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Corphita

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Overview

Experience the cutting-edge technology of Xilinx with the XCZU11EG-2FFVB1517I, a high-quality microprocessor circuit designed for industrial applications. With a wide operating temperature range and superior performance, this product offers unmatched reliability and efficiency. Whether you're looking to enhance your automation systems or improve data processing capabilities, Xilinx delivers exceptional value and innovation. Trust Xilinx to provide advanced solutions that meet your unique needs and propel your projects to success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

Suitable for low power applications, reducing energy consumption and heat generation.

Package Shape: RECTANGULAR

Fits well with standard PCB layouts, making it compatible with a wide range of electronic devices.

No. of Terminals: 1517

Provides a high level of connectivity options for interfacing with other components, allowing for versatile functionality.

Package Style (Meter): GRID ARRAY

Facilitates efficient heat dissipation and electrical performance, enhancing the overall reliability of the product.

Minimum Operating Temperature: -40 °C

Can operate in harsh environmental conditions, making it suitable for industrial applications where temperature extremes are common.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables complex data processing and control capabilities, expanding the potential applications of the product.

Moisture Sensitivity Level (MSL): 4

Can withstand exposure to moderate levels of moisture, providing reliability in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-2FFVB1517I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-2FFVB1517I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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