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XCZU11EG-1FFVF1517I

Xilinx

XCZU11EG-1FFVF1517I by Xilinx

XCZU11EG-1FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package with 1517 terminals is ideal for industrial applications requiring high-performance processing capabilities.

Median Price

$5,546.670

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 37 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 1,459 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 850 parts In-Stock

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Semicontronic

India . 674 parts In-Stock

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$16.490

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Modulus Dynamics

Lithuania . 975 parts In-Stock

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$22.053

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Ampacity Inc.

Singapore . 371 parts In-Stock

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Corohmni

South Africa . 838 parts In-Stock

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MARBEL Systems

Belgium . 3,757 parts In-Stock

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Texas Native Microelectronics

USA . 50 parts In-Stock

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Kenton Components

USA . 550 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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$5,391.055

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$5,282.145

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Supply Digital

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Qasali Group International

UK . 10 parts In-Stock

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$159.836

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$146.516

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Overview

Get ready to elevate your projects with the XCZU11EG-1FFVF1517I by Xilinx. Known for their superior quality and cutting-edge technology, Xilinx delivers top-notch Other Function uPs,uCs & Peripheral ICs that are perfect for a wide range of applications. This product offers unmatched value, benefits, and advantages to customers looking to take their designs to the next level. With a maximum operating temperature of 100°C and a minimum supply voltage of 0.825V, the XCZU11EG-1FFVF1517I is the reliable solution you've been searching for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and shock resistance, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for automated assembly processes, reducing production time and cost.

Maximum Supply Voltage: 0.876 V

High maximum supply voltage ensures stable and consistent performance under varying input conditions.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into various electronic designs and layouts.

No. of Terminals: 1517

Large number of terminals provide flexibility in connectivity options and enable complex circuit designs.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density mounting, saving space and allowing for compact device designs.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function reliably in extreme environmental conditions.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures the product can withstand elevated temperatures without degradation of performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Multiple terminal finish options provide good electrical conductivity and corrosion resistance, enhancing product longevity.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product is suitable for use in harsh industrial environments with temperature fluctuations.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-1FFVF1517I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-1FFVF1517I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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