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XCZU11EG-1FFVC1156I

Xilinx

XCZU11EG-1FFVC1156I by Xilinx

XCZU11EG-1FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w -40 to 100 °C. Ideal for applications requiring high performance and reliability in industrial environments.

Median Price

$5,415.045

Lifecycle Status

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7

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Mouser Electronics

USA . 2 parts In-Stock

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$5,254.380

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DigiKey

USA . 2 parts In-Stock

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$5,575.710

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Digiode

USA . 146 parts In-Stock

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$4,854.576

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Nova Conductors

Japan . 300 parts In-Stock

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$5,068.260

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VNN

France . 898 parts In-Stock

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Vyrian

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Sunrise Surplus Inc.

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AZTECH Wire

Italy . 833 parts In-Stock

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$6.811

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Semicontronic

India . 517 parts In-Stock

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$14.000

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$13.650

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$13.580

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Ampacity Inc.

Singapore . 398 parts In-Stock

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$19.000

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One Stop Electronics

USA . 156 parts In-Stock

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$28.000

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MARBEL Systems

Belgium . 23,730 parts In-Stock

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$32.093

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Texas Native Microelectronics

USA . 371 parts In-Stock

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$36.889

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$32.462

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Kenton Components

USA . 40 parts In-Stock

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$44.267

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$38.955

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Corohmni

South Africa . 86 parts In-Stock

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$60.995

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Qasali Group International

UK . 1,948 parts In-Stock

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$99.600

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$87.648

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Modulus Dynamics

Lithuania . 1,747 parts In-Stock

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$123.715

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$123.715

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Microchip USA

USA . 1,190 parts In-Stock

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$2,595.241

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Corphita

USA . 115 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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$4,966.895

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$4,768.219

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Supply Digital

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Vigor

Singapore . 489 parts In-Stock

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Kepictronics

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Overview

Unlock the power of cutting-edge technology with the XCZU11EG-1FFVC1156I by Xilinx. Known for their superior quality and innovative solutions, Xilinx delivers top-of-the-line products that redefine industry standards. This versatile microprocessor circuit is perfect for a wide range of applications, offering unmatched performance and reliability. Experience seamless operation and enhanced efficiency with this industrial-grade peripheral IC. Trust Xilinx to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY provides good thermal and electrical insulation, making the product durable and reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing overall product size.

Maximum Supply Voltage: 0.876 V

High maximum supply voltage ensures stable and reliable operation of the product under varying electrical conditions.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into different types of electronic devices or systems.

No. of Terminals: 1156

Higher number of terminals provides more connectivity options, making the product versatile and compatible with various applications.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density and compact design, optimizing PCB layout and reducing overall system size.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures the product can perform reliably in extreme environmental conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Product can withstand peak reflow temperature for a sufficient amount of time during assembly process, ensuring proper soldering and connection.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of microprocessor circuit enhances the product's processing capabilities, enabling complex functions and tasks to be performed efficiently.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of devices, making the product energy-efficient and versatile.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-1FFVC1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-1FFVC1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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