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XCZU11EG-L1FFVF1517I

Xilinx

XCZU11EG-L1FFVF1517I by Xilinx

XCZU11EG-L1FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1517 terminals in a GRID ARRAY package style. Suitable for industrial applications, it features a supply voltage range of 0.698V to 0.742V.

Median Price

$6,089.032

Lifecycle Status

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4

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1k+

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VNN

France . 872 parts In-Stock

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$5,966.033

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Nova Conductors

Japan . 37 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 591 parts In-Stock

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$7.247

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Semicontronic

India . 396 parts In-Stock

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$14.000

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$13.650

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Ampacity Inc.

Singapore . 1,371 parts In-Stock

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$28.000

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One Stop Electronics

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MARBEL Systems

Belgium . 1,041 parts In-Stock

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$69.911

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Corohmni

South Africa . 493 parts In-Stock

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$75.811

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Texas Native Microelectronics

USA . 390 parts In-Stock

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$80.357

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$77.143

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Kenton Components

USA . 277 parts In-Stock

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Modulus Dynamics

Lithuania . 1,545 parts In-Stock

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Advanced Electronics

New Zealand . 3,155 parts In-Stock

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Microchip USA

USA . 1,360 parts In-Stock

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Qasali Group International

UK . 605 parts In-Stock

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$208.285

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$190.928

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Corphita

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Supply Digital

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Netroflash

USA . 50 parts In-Stock

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$6,087.789

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$5,901.428

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$5,777.188

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$5,777.188

Overview

Unlock the power of cutting-edge technology with the XCZU11EG-L1FFVF1517I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality Other Function uPs,uCs & Peripheral ICs that excel in a variety of applications. Designed for efficiency and reliability, this product offers unparalleled value to customers seeking advanced solutions. Experience seamless performance and innovative features with the XCZU11EG-L1FFVF1517I, setting new standards in the field of microprocessor circuits. Elevate your projects with Xilinx today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the internal components of the IC, making it durable and long-lasting.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of the IC onto circuit boards, saving space and improving overall product reliability.

Maximum Supply Voltage: 0.742 V

The maximum supply voltage of 0.742 V ensures safe operation and prevents damage to the IC, making it reliable for various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration onto circuit boards and efficient use of space in electronic devices.

No. of Terminals: 1517

Having a high number of terminals allows for the IC to handle complex functions and interact with multiple external components, making it versatile and suitable for advanced applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient heat dissipation and electrical connections, ensuring stable performance and reliability of the IC.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 100°C allows for reliable performance in various environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the IC.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-L1FFVF1517I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-L1FFVF1517I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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