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XCZU11EG-1FFVC1760I

Xilinx

XCZU11EG-1FFVC1760I by Xilinx

XCZU11EG-1FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs & Peripheral ICs.

Median Price

$6,243.623

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Nova Conductors

Japan . 91 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 843 parts In-Stock

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Aztec Data Supply Inc.

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Ampacity Inc.

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AZTECH Wire

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Corohmni

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 490 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Netroflash

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Qasali Group International

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Vigor

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Overview

Unleash the power of innovation with the XCZU11EG-1FFVC1760I by Xilinx. Known for their top-quality products, Xilinx delivers cutting-edge solutions in the category of Other Function uPs,uCs & Peripheral ICs. This versatile microprocessor circuit boasts a package style of GRID ARRAY with 1760 terminals, making it ideal for industrial applications. With a wide operating temperature range and advanced CMOS technology, customers can trust in the reliability and performance of this product. Elevate your designs with the XCZU11EG-1FFVC1760I and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to various environmental factors, making the product long-lasting and reliable.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage ensures stable and reliable performance under various operating conditions.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB designs, making it easy to integrate into existing systems.

No. of Terminals: 1760

High number of terminals allow for efficient connection with other components, increasing the versatility and functionality of the product.

Package Style (Meter): GRID ARRAY

Grid array package style offers a compact form factor, saving space on the PCB and enabling high-density designs.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures performance in both extreme cold and hot environments, making it suitable for a variety of applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/silver/copper terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections over time.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of damage to the product during assembly, ensuring product reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type offers advanced processing capabilities, enabling complex operations and high performance in various applications.

Nominal Supply Voltage: 0.85 V

Stable and reliable nominal supply voltage ensures consistent performance over the product's lifespan, reducing the risk of malfunctions.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates a low moisture sensitivity, allowing for extended storage and handling time without compromising product quality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-1FFVC1760I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-1FFVC1760I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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