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SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z030-2FFG676I by Xilinx

XC7Z030-2FFG676I

Xilinx

Xilinx XC7Z030-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

TDA8007BHL/C4,118 by NXP Semiconductors

TDA8007BHL/C4,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G48

7 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

3.3

Not Qualified

1.6 mm

Other Microprocessor ICs

315 mA

6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

7 mm

MICROPROCESSOR CIRCUIT

XC7Z045-1FFG676I by Xilinx

XC7Z045-1FFG676I

Xilinx

XC7Z045-1FFG676I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

CC2545RGZR by Texas Instruments

CC2545RGZR

Texas Instruments

CC2545RGZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and supports I2C, SPI, UART, and USART bus compatibility. This IC has 48 terminals in a SQUARE package style suitable for industrial applications requiring a supply voltage range of 2-3.6 V.

I2C; SPI; UART; USART

0

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other uPs/uCs/Peripheral ICs

3.6 V

2 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

CC2545RGZT by Texas Instruments

CC2545RGZT

Texas Instruments

CC2545RGZT by Texas Instruments is a 48-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85°C, with a supply voltage range of 2-3.6V. This IC supports I2C, SPI, UART, and USART bus compatibility for various industrial applications.

I2C; SPI; UART; USART

0

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other uPs/uCs/Peripheral ICs

3.6 V

2 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

RF430FRL154HCRGER by Texas Instruments

RF430FRL154HCRGER

Texas Instruments

RF430FRL154HCRGER by Texas Instruments is a MICROPROCESSOR CIRCUIT with I2C and SPI compatibility. It features 24 terminals in a CHIP CARRIER package style, suitable for commercial applications with an operating temperature range of 0 to 70°C. This CMOS technology device has a very thin profile and is surface mountable.

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

I2C; SPI

0

S-PQCC-N24

e4

4 mm

2

24

70 Cel

0 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCEDF by Texas Instruments

TMS320DM369ZCEDF

Texas Instruments

TMS320DM369ZCEDF by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at temperatures from -40 to 85°C. It features 32768 RAM words, a 32-bit external data bus width, and supports Ethernet, I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCED by Texas Instruments

TMS320DM369ZCED

Texas Instruments

TMS320DM369ZCED by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features 32768 RAM words, supports Ethernet, I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile grid array package with a 0.65mm terminal pitch.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCEF by Texas Instruments

TMS320DM369ZCEF

Texas Instruments

TMS320DM369ZCEF by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. It operates at temperatures from -40 to 85 °C and supports Ethernet, I2C, SPI, UART, and USB buses. This low-profile IC in a square package is ideal for applications requiring high-speed data processing.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCE by Texas Instruments

TMS320DM369ZCE

Texas Instruments

TMS320DM369ZCE by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating b/w -40 to 85°C. It features 32768 RAM words, 0.65mm terminal pitch, and supports Ethernet, I2C, SPI, UART & USB buses. Ideal for applications requiring low profile grid array packages in CMOS technology.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

XC7Z010-1CLG225C by Xilinx

XC7Z010-1CLG225C

Xilinx

The Xilinx XC7Z010-1CLG225C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile, fine pitch grid array packages in plastic/epoxy material.

S-PBGA-B225

13 mm

225

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-1CLG225I by Xilinx

XC7Z010-1CLG225I

Xilinx

The Xilinx XC7Z010-1CLG225I is a low-profile, fine-pitch grid array IC with 225 terminals. Operating b/w -40 to 100°C, it features a CMOS technology and requires a supply voltage of 0.95V to 1.05V. Ideal for System on Chip applications due to its compact size and ball terminal form factor.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-2CLG225I by Xilinx

XC7Z010-2CLG225I

Xilinx

XC7Z010-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-3CLG225E by Xilinx

XC7Z010-3CLG225E

Xilinx

The Xilinx XC7Z010-3CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B225

13 mm

225

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z030-1FBG484C by Xilinx

XC7Z030-1FBG484C

Xilinx

XC7Z030-1FBG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0°C to 85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, making it suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B484

23 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-1FBG484I by Xilinx

XC7Z030-1FBG484I

Xilinx

The Xilinx XC7Z030-1FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 484 terminals, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-1FBG676C by Xilinx

XC7Z030-1FBG676C

Xilinx

The Xilinx XC7Z030-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. With a package style of Grid Array and 676 terminals, it's ideal for various applications in Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-1FBG676I by Xilinx

XC7Z030-1FBG676I

Xilinx

The Xilinx XC7Z030-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance computing and peripheral integration.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-1FFG676C by Xilinx

XC7Z030-1FFG676C

Xilinx

XC7Z030-1FFG676C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-2FBG484E by Xilinx

XC7Z030-2FBG484E

Xilinx

XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

S-PBGA-B484

23 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-2FBG484I by Xilinx

XC7Z030-2FBG484I

Xilinx

The Xilinx XC7Z030-2FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-2FBG676E by Xilinx

XC7Z030-2FBG676E

Xilinx

The Xilinx XC7Z030-2FBG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-2FBG676I by Xilinx

XC7Z030-2FBG676I

Xilinx

The Xilinx XC7Z030-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-2FFG676E by Xilinx

XC7Z030-2FFG676E

Xilinx

XC7Z030-2FFG676E by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-100 °C with supply voltage range of 0.95-1.05 V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance computing and embedded systems.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-3FBG484E by Xilinx

XC7Z030-3FBG484E

Xilinx

The Xilinx XC7Z030-3FBG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

S-PBGA-B484

23 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-3FBG676E by Xilinx

XC7Z030-3FBG676E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-3FFG676E by Xilinx

XC7Z030-3FFG676E

Xilinx

The Xilinx XC7Z030-3FFG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FBG676C by Xilinx

XC7Z045-1FBG676C

Xilinx

The Xilinx XC7Z045-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FBG676I by Xilinx

XC7Z045-1FBG676I

Xilinx

The Xilinx XC7Z045-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FFG676C by Xilinx

XC7Z045-1FFG676C

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FFG900C by Xilinx

XC7Z045-1FFG900C

Xilinx

XC7Z045-1FFG900C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 900 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.

S-PBGA-B900

27 mm

900

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FFG900I by Xilinx

XC7Z045-1FFG900I

Xilinx

XC7Z045-1FFG900I by Xilinx is a System on Chip with 900 terminals, operating b/w -40 to 100°C. It features a supply voltage range of 0.95V to 1.05V and utilizes CMOS technology. Ideal for applications requiring high-performance processing in compact spaces, such as IoT devices and embedded systems.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FBG676E by Xilinx

XC7Z045-2FBG676E

Xilinx

XC7Z045-2FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FBG676I by Xilinx

XC7Z045-2FBG676I

Xilinx

The Xilinx XC7Z045-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing and integration capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG676E by Xilinx

XC7Z045-2FFG676E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG676I by Xilinx

XC7Z045-2FFG676I

Xilinx

The Xilinx XC7Z045-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG900E by Xilinx

XC7Z045-2FFG900E

Xilinx

The Xilinx XC7Z045-2FFG900E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 900 terminals, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG900I by Xilinx

XC7Z045-2FFG900I

Xilinx

The Xilinx XC7Z045-2FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-3FBG676E by Xilinx

XC7Z045-3FBG676E

Xilinx

XC7Z045-3FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has a grid array style and is suitable for various applications requiring high-performance processing capabilities in a compact form factor.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-3FFG676E by Xilinx

XC7Z045-3FFG676E

Xilinx

XC7Z045-3FFG676E by Xilinx is a CMOS system-on-chip with 676 terminals and a package size of 27mm x 27mm. It operates at a voltage range of 0.95V to 1.05V and has a max temperature rating of 100°C. This versatile IC is commonly used in various applications requiring high-performance processing capabilities.

S-PBGA-B676

e1

27 mm

4

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-3FFG900E by Xilinx

XC7Z045-3FFG900E

Xilinx

The Xilinx XC7Z045-3FFG900E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-1FFG1156I by Xilinx

XC7Z100-1FFG1156I

Xilinx

The Xilinx XC7Z100-1FFG1156I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 1156 terminals, it's ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B1156

35 mm

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

GRID ARRAY

3.1 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

SYSTEM ON CHIP

XC7Z100-1FFG900I by Xilinx

XC7Z100-1FFG900I

Xilinx

The Xilinx XC7Z100-1FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-2FFG1156I by Xilinx

XC7Z100-2FFG1156I

Xilinx

XC7Z100-2FFG1156I by Xilinx is a 1156-terminal, square-shaped GRID ARRAY package with a max supply voltage of 1.05V and a min operating temperature of -40°C. It is a CMOS-based SYSTEM ON CHIP (SoC) used in Other Function uPs,uCs & Peripheral ICs applications.

S-PBGA-B1156

35 mm

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

GRID ARRAY

3.1 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

SYSTEM ON CHIP

XC7Z100-2FFG900I by Xilinx

XC7Z100-2FFG900I

Xilinx

XC7Z100-2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

CP3SP33SMR/NOPB by Texas Instruments

CP3SP33SMR/NOPB

Texas Instruments

CP3SP33SMR/NOPB by Texas Instruments is a 16-bit microprocessor with 32768 RAM bytes. Operating at speeds up to 96 rpm, it has a low profile grid array package style suitable for industrial applications. With a supply voltage range of 1.62V to 1.98V and operating temperature from -40°C to 85°C, it offers high performance in compact dimensions.

16

CR16C

S-PBGA-B144

e1

10 mm

3

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

32768

1.4 mm

96 rpm

Microcontrollers

200 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAW24 by Texas Instruments

TCI6636K2HDAAW24

Texas Instruments

TCI6636K2HDAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and features a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAW2 by Texas Instruments

TCI6636K2HDAAW2

Texas Instruments

TCI6636K2HDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at a supply voltage range of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style, making it suitable for high-performance computing applications. With a compact square shape measuring 40mm x 40mm, this IC is ideal for space-constrained designs requiring advanced processing capabilities.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT