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SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
SI8250-IQ by Silicon Labs

SI8250-IQ

Silicon Labs

SI8250-IQ by Silicon Labs is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 2.25-2.75 V, making it suitable for automotive applications requiring low profile, surface-mountable ICs.

S-PQFP-G32

7 mm

32

125 Cel

-40 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

NOT SPECIFIED

Not Qualified

1.6 mm

2.75 V

2.25 V

2.5 V

YES

CMOS

AUTOMOTIVE

GULL WING

.8 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

SI8251-IQ by Silicon Labs

SI8251-IQ

Silicon Labs

SI8251-IQ by Silicon Labs is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 2.25V to 2.75V, it comes in a square flatpack package ideal for surface mount assembly.

S-PQFP-G32

7 mm

32

125 Cel

-40 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

NOT SPECIFIED

Not Qualified

1.6 mm

2.75 V

2.25 V

2.5 V

YES

CMOS

AUTOMOTIVE

GULL WING

.8 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUT7 by Texas Instruments

TMS320DM6467CZUT7

Texas Instruments

TMS320DM6467CZUT7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 0-85°C, it has a supply voltage range of 1.14-3.3V and peak reflow temperature of 245°C. Ideal for applications requiring high processing power in compact designs.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUTAV by Texas Instruments

TMS320DM6467CZUTAV

Texas Instruments

TMS320DM6467CZUTAV by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It has a package style of GRID ARRAY, FINE PITCH and terminal finish of TIN SILVER COPPER. Ideal for industrial applications requiring high processing power in compact form factor.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUTD7 by Texas Instruments

TMS320DM6467CZUTD7

Texas Instruments

TMS320DM6467CZUTD7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it has a max supply voltage of 1.26 V and supports power supplies of 1.2, 1.8, and 3.3 V. Ideal for industrial applications requiring a high-performance microprocessor circuit in a compact square package style with grid array terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUT by Texas Instruments

TMS320DM6467CZUT

Texas Instruments

TMS320DM6467CZUT by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and package style of grid array, fine pitch. Ideal for applications requiring high processing power in compact designs.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCE21 by Texas Instruments

TMS320DM365ZCE21

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCE30 by Texas Instruments

TMS320DM365ZCE30

Texas Instruments

TMS320DM365ZCE30 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.42V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCEF by Texas Instruments

TMS320DM365ZCEF

Texas Instruments

TMS320DM365ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 85 °C and supports I2C, SPI, UART, and USB buses. This industrial-grade chip has a package style of grid array with low profile and fine pitch terminals.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM365BZCE by Texas Instruments

TMX320DM365BZCE

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B338

13 mm

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUT1 by Texas Instruments

TMS320DM6467TZUT1

Texas Instruments

TMS320DM6467TZUT1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85 °C. It has a max supply voltage of 1.365 V and is suitable for MICROPROCESSOR CIRCUIT applications due to its CMOS technology and fine pitch package style.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUTD1 by Texas Instruments

TMS320DM6467TZUTD1

Texas Instruments

TMS320DM6467TZUTD1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it has a max supply voltage of 1.365 V and is ideal for industrial applications requiring MICROPROCESSOR CIRCUIT technology.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

PSD854F2V-90M by STMicroelectronics

PSD854F2V-90M

STMicroelectronics

PSD854F2V-90M by STMicroelectronics is a CMOS IC with a 3.3V supply, featuring 52 terminals in a flatpack package. It operates b/w 0 °C and 70°C, offering an impressive max access time of just 90 ns. Ideal for embedded applications requiring efficient data storage and retrieval.

.00000009 ns

S-PQFP-G52

e4

52

70 Cel

0 Cel

PLASTIC/EPOXY

QFP

QFP52,.52SQ

SQUARE

FLATPACK

3.3

Not Qualified

2359296 Bits

.0001 Amp

Other uPs/uCs/Peripheral ICs

3.3 V

YES

CMOS

COMMERCIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.635 mm

QUAD

N

PSD854F2V-90J by STMicroelectronics

PSD854F2V-90J

STMicroelectronics

PSD854F2V-90J by STMicroelectronics is a CMOS IC with a 3.3V supply, featuring 52 terminals in a square chip carrier package. It operates b/w 0 °C and 70°C, with an impressive access time of just 90 ns. Ideal for various embedded applications requiring efficient data storage.

.00000009 ns

S-PQCC-J52

e3

52

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

LDCC52,.8SQ

SQUARE

CHIP CARRIER

3.3

Not Qualified

2359296 Bits

.0001 Amp

Other uPs/uCs/Peripheral ICs

3.3 V

YES

CMOS

COMMERCIAL

Matte Tin (Sn)

J BEND

1.27 mm

QUAD

N

TMS320DM6433ZDU4 by Texas Instruments

TMS320DM6433ZDU4

Texas Instruments

TMS320DM6433ZDU4 by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. Operating at 1.14-1.26V, it supports I2C, SPI, UART buses and CMOS technology. Ideal for applications requiring MICROPROCESSOR CIRCUIT in a compact GRID ARRAY package measuring 23x23mm with 376 terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; SPI; UART

FIXED POINT

S-PBGA-B376

e1

23 mm

3

376

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA376,22X22,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.2,1.8,3.3

Not Qualified

20480

2.48 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

LH79520N0M000B1 by NXP Semiconductors

LH79520N0M000B1

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: QFP; Package Shape: SQUARE;

S-PQFP-G176

176

70 Cel

0 Cel

PLASTIC/EPOXY

QFP

QFP176,.87SQ,16

SQUARE

FLATPACK

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

GULL WING

.4 mm

QUAD

LH7A400N0E000B3A by NXP Semiconductors

LH7A400N0E000B3A

NXP Semiconductors

NXP Semiconductors' LH7A400N0E000B3A is a ceramic package IC with 256 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 1.8V and 3.3V, suitable for various applications requiring fine pitch grid array style packaging in commercial-grade environments.

S-XBGA-B256

256

70 Cel

0 Cel

CERAMIC

FBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

LH7A404N0E000B0A by NXP Semiconductors

LH7A404N0E000B0A

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;

S-XBGA-B324

324

70 Cel

0 Cel

CERAMIC

FBGA

BGA324,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

DM355SDZCE135 by Texas Instruments

DM355SDZCE135

Texas Instruments

The Texas Instruments DM355SDZCE135 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE216 by Texas Instruments

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE270 by Texas Instruments

DM355SDZCE270

Texas Instruments

The Texas Instruments DM355SDZCE270 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile, fine pitch package styles in surface mount configurations.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCEA216 by Texas Instruments

DM355SDZCEA216

Texas Instruments

DM355SDZCEA216 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.365V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355CZCE216 by Texas Instruments

TMS320DM355CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355CZCEA21 by Texas Instruments

TMS320DM355CZCEA21

Texas Instruments

TMS320DM355CZCEA21 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at -40 to 100 °C. It features a 1.3 V nominal voltage, I2C, SPI, UART, USB compatibility and is ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a SQUARE package with PLASTIC/EPOXY body material.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCE216 by Texas Instruments

TMS320DM355DZCE216

Texas Instruments

TMS320DM355DZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at 1.3V nominal voltage and supports I2C, SPI, UART, and USB buses. Ideal for applications requiring low profile, fine pitch package style in the temperature range of 0-85°C.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCE270 by Texas Instruments

TMS320DM355DZCE270

Texas Instruments

TMS320DM355DZCE270 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85 °C and supports I2C, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT has a package style of GRID ARRAY and is suitable for various applications requiring low profile and fine pitch components.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCEA21 by Texas Instruments

TMS320DM355DZCEA21

Texas Instruments

TMS320DM355DZCEA21 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 100°C and supports I2C, SPI, UART, and USB buses. This industrial-grade IC has a package style of grid array with low profile and fine pitch for various applications.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM355ZCE216 by Texas Instruments

TMX320DM355ZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B337

13 mm

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM355ZCE270 by Texas Instruments

TMX320DM355ZCE270

Texas Instruments

Texas Instruments TMX320DM355ZCE270 is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.365V and RAM words of 32768, suitable for MICROPROCESSOR CIRCUIT applications in various industries.

32

FIXED POINT

S-PBGA-B337

13 mm

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

SM32DM355GCEM216EP by Texas Instruments

SM32DM355GCEM216EP

Texas Instruments

Texas Instruments SM32DM355GCEM216EP is a 32-bit microprocessor with 8192 RAM words. It operates b/w -55 to 125 °C and supports I2C, SPI, UART, USB buses. Ideal for military-grade applications due to its CMOS technology and low profile grid array package style.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e0

13 mm

3

337

125 Cel

-55 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

MILITARY

TIN LEAD

BALL

.65 mm

BOTTOM

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6441AZWT by Texas Instruments

TMS320DM6441AZWT

Texas Instruments

TMS320DM6441AZWT by Texas Instruments is a 32-bit microprocessor with 16384 RAM words, operating at temperatures from 0 to 85°C. It features a package style of grid array, low profile, fine pitch and supports bus compatibility with Ethernet, I2C, SPI, UART, and USB. Ideal for applications requiring high-performance processing in compact spaces.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG225Q by Xilinx

XA7Z010-1CLG225Q

Xilinx

XA7Z010-1CLG225Q by Xilinx is a MICROPROCESSOR CIRCUIT with 225 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Featuring CMOS technology, it has a 0.8 mm terminal pitch and TIN SILVER COPPER finish.

S-PBGA-B225

e1

13 mm

3

225

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1,1.8

Not Qualified

AEC-Q100

1.5 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

N

13 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG400I by Xilinx

XA7Z010-1CLG400I

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA400,20X20,32;

S-PBGA-B400

e1

17 mm

3

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG400Q by Xilinx

XA7Z010-1CLG400Q

Xilinx

XA7Z010-1CLG400Q by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The CMOS technology, low profile design, and fine pitch make it ideal for compact electronic systems.

S-PBGA-B400

e1

17 mm

3

400

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG400I by Xilinx

XA7Z020-1CLG400I

Xilinx

XA7Z020-1CLG400I by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates at 1-1.8V, CMOS technology, and has a terminal pitch of 0.8mm. Ideal for applications requiring low profile and fine pitch components in automotive electronics or industrial control systems.

S-PBGA-B400

e1

17 mm

3

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG400Q by Xilinx

XA7Z020-1CLG400Q

Xilinx

XA7Z020-1CLG400Q by Xilinx is an automotive-grade microprocessor circuit with 400 terminals in a low-profile grid array package. Operating b/w -40 to 125°C, it features power supplies of 1V and 1.8V, making it ideal for automotive applications requiring high-performance computing capabilities.

S-PBGA-B400

e1

17 mm

3

400

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG484Q by Xilinx

XA7Z020-1CLG484Q

Xilinx

XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.

S-PBGA-B484

e1

19 mm

3

484

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

N

19 mm

MICROPROCESSOR CIRCUIT

XA7Z030-1FBG484I by Xilinx

XA7Z030-1FBG484I

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Ultraviolet Erasable: N;

S-PBGA-B484

e1

23 mm

4

484

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

250

1,1.8

Not Qualified

AEC-Q100

2.54 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

N

23 mm

MICROPROCESSOR CIRCUIT

XA7Z030-1FBG484Q by Xilinx

XA7Z030-1FBG484Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e1

23 mm

4

484

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

250

1,1.8

Not Qualified

AEC-Q100

2.54 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

N

23 mm

MICROPROCESSOR CIRCUIT

TMS320DM6446BZWTA by Texas Instruments

TMS320DM6446BZWTA

Texas Instruments

TMS320DM6446BZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features a max operating temperature of 105°C and supports I2C, SPI, UART, and USB bus compatibility.

32

I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TDA8002CG/C1,518 by NXP Semiconductors

TDA8002CG/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G32

e3

5 mm

3

32

85 Cel

-25 Cel

PLASTIC/EPOXY

LFQFP

QFP32,.28SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3/5

Not Qualified

1.6 mm

Other Microprocessor ICs

140 mA

6.5 V

3 V

3.3 V

YES

CMOS

OTHER

TIN

GULL WING

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

TDA8007BHL/C2,118 by NXP Semiconductors

TDA8007BHL/C2,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G48

e4

7 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3/5

Not Qualified

1.6 mm

Other Microprocessor ICs

315 mA

6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

SILVER

GULL WING

.5 mm

QUAD

7 mm

MICROPROCESSOR CIRCUIT

TDA8007BHL/C3,118 by NXP Semiconductors

TDA8007BHL/C3,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G48

e3

7 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

3.3

Not Qualified

1.6 mm

Other Microprocessor ICs

315 mA

6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

Tin (Sn)

GULL WING

.5 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

FT245BM by FTDI

FT245BM

FTDI

FT245BM by FTDI is a 32-terminal peripheral IC with supply voltage range of 4.35V to 5.25V, operating temperature from 0°C to 70°C. It features GULL WING terminals, CMOS technology, and is ideal for MICROPROCESSOR CIRCUIT applications requiring low profile FLATPACK packaging.

S-PQFP-G32

e0

7 mm

3

32

70 Cel

0 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

250

Not Qualified

1.6 mm

5.25 V

4.35 V

5 V

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

.8 mm

QUAD

7 mm

MICROPROCESSOR CIRCUIT

TCI6630K2LCMSA2 by Texas Instruments

TCI6630K2LCMSA2

Texas Instruments

TCI6630K2LCMSA2 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and can withstand peak reflow temperature of 245°C for up to 30s. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LCMS by Texas Instruments

TCI6630K2LCMS

Texas Instruments

TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA2 by Texas Instruments

TCI6630K2LDCMSA2

Texas Instruments

TCI6630K2LDCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA by Texas Instruments

TCI6630K2LDCMSA

Texas Instruments

Texas Instruments TCI6630K2LDCMSA is a CMOS MICROPROCESSOR CIRCUIT with 900 BALL terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, with a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT