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PSD854F2V-90J

STMicroelectronics

PSD854F2V-90J by STMicroelectronics

PSD854F2V-90J by STMicroelectronics is a CMOS IC with a 3.3V supply, featuring 52 terminals in a square chip carrier package. It operates b/w 0 °C and 70°C, with an impressive access time of just 90 ns. Ideal for various embedded applications requiring efficient data storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,953 parts In-Stock

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3,953

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Digiode

USA . 1,052 parts In-Stock

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1,052

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Anansix

USA . 637 parts In-Stock

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637

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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Microchip USA

USA . 449 parts In-Stock

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$18.486

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449

$18.486

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AZTECH Wire

Italy . 816 parts In-Stock

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$20.380

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816

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Corohmni

South Africa . 336 parts In-Stock

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$41.577

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336

$41.577

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IDEA Electronic Components Group

UK . 2,356 parts In-Stock

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$50.237

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$45.213

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$50.237

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$45.213

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MKK Technologies

India . 1,603 parts In-Stock

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$94.467

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DigiPath Technology Company

USA . 1,603 parts In-Stock

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$94.467

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Corphita

USA . 2,900 parts In-Stock

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2,900

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Parana Technologies

USA . 933 parts In-Stock

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$60.066

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$60.066

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Overview

Unlock the potential of your projects with the PSD854F2V-90J from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile and reliable IC enhances efficiency in various applications, delivering exceptional performance while maintaining low power consumption. With STMicroelectronics' commitment to quality and cutting-edge technology, this component ensures optimal results for embedded systems, smart devices, and more—empowering you to elevate your designs with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robustness and reliability in various environments, making it a suitable choice for diverse applications.

Surface Mount: YES

Surface mount technology enables compact designs and efficient PCB layouts, which is ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape facilitates easy integration into electronic systems, maximizing design flexibility.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V is compatible with modern low-voltage digital circuits, minimizing power consumption.

No. of Terminals: 52

With 52 terminals, this product offers plenty of connectivity options, supporting complex functionalities and integration.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for efficient heat dissipation and is commonly used in high-performance applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures stable performance in moderately high-temperature environments, enhancing reliability.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can function in a wide range of ambient conditions, adding versatility.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish enhances solderability and reduces oxidation, promoting long-term reliability in connections.

Ultraviolet Erasable: N

Not being ultraviolet erasable means data integrity is maintained over time, minimizing the risk of data loss in applications.

Terminal Position: QUAD

Quad terminal position provides excellent layout options on PCBs, facilitating effective wiring and reducing signal interference.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates suitability for a broad range of applications, ensuring consistent performance.

ROM Bits Size: 2359296 Bits

A ROM size of 2,359,296 bits provides ample storage for firmware and application code, supporting complex functionality.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it ideal for battery-powered and portable devices.

Terminal Form: J BEND

J bend terminal form allows for ease of soldering and effective electrical connections to PCBs.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V is industry-standard for digital electronics, ensuring compatibility and ease of integration.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of soldering, making it user-friendly for assemblers.

Maximum Standby Current: 0.0001 Amp

A low maximum standby current of 0.0001 A ensures energy efficiency, prolonging the battery life in portable applications.

Maximum Access Time: 0.00000009 ns

An extremely fast maximum access time of 90 ps allows for high-speed data processing, making this product suitable for demanding applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD854F2V-90J attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

2359296 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other uPs/uCs/Peripheral ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD854F2V-90J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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