Loading...

PSD813F1V-15JI

STMicroelectronics

PSD813F1V-15JI by STMicroelectronics

STMicroelectronics' PSD813F1V-15JI is a 52-terminal IC with 1310720 ROM bits, operating at 3.3V. With a max standby current of 0.0001A and access time of 0.00000015ns, it's ideal for industrial applications requiring high-speed processing in temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,549

-

-

-

-

Anansix

USA . 2,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,489

-

-

-

-

Vyrian

USA . 2,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,031

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,902 parts In-Stock

1+ parts

$28.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,902

$28.190

-

-

-

IDEA Electronic Components Group

UK . 2,132 parts In-Stock

1+ parts

$63.897

100+ parts

-

1k+ parts

$57.507

10k+ parts

-

2,132

$63.897

-

$57.507

-

MKK Technologies

India . 1,841 parts In-Stock

1+ parts

$120.154

100+ parts

-

1k+ parts

-

10k+ parts

-

1,841

$120.154

-

-

-

DigiPath Technology Company

USA . 1,841 parts In-Stock

1+ parts

$120.154

100+ parts

-

1k+ parts

-

10k+ parts

-

1,841

$120.154

-

-

-

Corphita

USA . 2,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,829

-

-

-

-

Parana Technologies

USA . 1,691 parts In-Stock

1+ parts

-

100+ parts

$76.398

1k+ parts

-

10k+ parts

-

1,691

-

$76.398

-

-

Overview

Unleash the power of innovation with the PSD813F1V-15JI by STMicroelectronics. This cutting-edge product delivers unmatched quality and reliability, backed by a renowned manufacturer in the industry. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this versatile chip carrier package offers customers exceptional value and benefits. Experience seamless performance, durability, and efficiency with this industrial-grade solution that will elevate your projects to new heights. Elevate your technology game with the PSD813F1V-15JI today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during assembly.

Power Supplies (V): 3.3

Operates on a common voltage supply, making it compatible with a wide range of systems.

No. of Terminals: 52

Offers a high number of connection points for versatile connectivity options.

Maximum Operating Temperature: 85 °C

Can withstand high-temperature environments, ideal for industrial settings.

ROM Bits Size: 1310720 Bits

Provides ample memory storage capacity for storing and executing complex programs.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable performance.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, ensuring compatibility with various power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD813F1V-15JI attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD813F1V-15JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19