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PSD813F1V-15UIT

STMicroelectronics

PSD813F1V-15UIT by STMicroelectronics

STMicroelectronics' PSD813F1V-15UIT is a 64-terminal CMOS uP with 1310720 ROM bits. Operating at 3.3V, it has a max standby current of 0.0001A and access time of 0.00000015ns. Ideal for industrial applications requiring high-speed processing in temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,974

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-

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Vyrian

USA . 1,349 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,349

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-

-

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Anansix

USA . 915 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

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915

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,228 parts In-Stock

1+ parts

$33.787

100+ parts

-

1k+ parts

$30.408

10k+ parts

-

1,228

$33.787

-

$30.408

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MKK Technologies

India . 1,021 parts In-Stock

1+ parts

$63.534

100+ parts

-

1k+ parts

-

10k+ parts

-

1,021

$63.534

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-

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DigiPath Technology Company

USA . 1,021 parts In-Stock

1+ parts

$63.534

100+ parts

-

1k+ parts

-

10k+ parts

-

1,021

$63.534

-

-

-

Corohmni

South Africa . 427 parts In-Stock

1+ parts

$68.048

100+ parts

-

1k+ parts

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10k+ parts

-

427

$68.048

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-

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Corphita

USA . 3,418 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,418

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-

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Parana Technologies

USA . 1,044 parts In-Stock

1+ parts

-

100+ parts

$40.398

1k+ parts

-

10k+ parts

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1,044

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$40.398

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Overview

Unlock the potential of your electronic devices with the PSD813F1V-15UIT by STMicroelectronics. Designed with quality in mind, this versatile IC offers a wide range of applications in the world of Other Function uPs,uCs & Peripheral ICs. With a durable plastic/epoxy package body, easy surface mount installation, and a high operating temperature range, this product delivers exceptional value to customers seeking reliability and performance. Experience the advantages of STMicroelectronics technology and take your projects to the next level with the PSD813F1V-15UIT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability and ease of handling.

Surface Mount: YES

Surface mount capability allows for easy integration into PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square shape is ideal for optimizing space on the PCB and allows for efficient placement of components.

Power Supplies (V): 3.3

Stable power supply of 3.3V ensures reliable performance and compatibility with other components in the system.

No. of Terminals: 64

With 64 terminals, this product offers ample connectivity options for various peripherals and interfaces.

Package Style (Meter): FLATPACK

Flatpack style enhances thermal efficiency and provides a low-profile design for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures stable operation even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40 °C to 85°C allows for operation in extreme cold or hot environments.

ROM Bits Size: 1310720 Bits

Large ROM size of 1310720 bits enables storing complex programs and data for versatile functionality.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity for efficient processing.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering for reliable electrical connections.

Nominal Supply Voltage: 3.3 V

3.3V nominal supply voltage is common in many electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm allows for high-density mounting on the PCB, saving space and enabling compact designs.

Maximum Standby Current: 0.0001 Amp

Low standby current of 0.0001A minimizes power consumption in idle mode, enhancing energy efficiency.

Maximum Access Time: 0.00000015 ns

Ultra-fast maximum access time of 0.00000015ns ensures quick data retrieval and processing for responsive performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD813F1V-15UIT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD813F1V-15UIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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