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PSD813F1V-15MI

STMicroelectronics

PSD813F1V-15MI by STMicroelectronics

STMicroelectronics' PSD813F1V-15MI is a 3.3V CMOS uC with 1310720 ROM bits. It features 52 terminals in a square flatpack package, suitable for industrial applications. With a temperature range of -40 to 85 °C, it offers low standby current and fast access time for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,715 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,715

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-

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Vyrian

USA . 1,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,785

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-

-

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Anansix

USA . 1,516 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,516

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,047 parts In-Stock

1+ parts

$20.971

100+ parts

-

1k+ parts

$18.874

10k+ parts

-

2,047

$20.971

-

$18.874

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MKK Technologies

India . 1,063 parts In-Stock

1+ parts

$39.435

100+ parts

-

1k+ parts

-

10k+ parts

-

1,063

$39.435

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-

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DigiPath Technology Company

USA . 1,063 parts In-Stock

1+ parts

$39.435

100+ parts

-

1k+ parts

-

10k+ parts

-

1,063

$39.435

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-

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Corohmni

South Africa . 936 parts In-Stock

1+ parts

$51.290

100+ parts

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1k+ parts

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10k+ parts

-

936

$51.290

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-

-

Parana Technologies

USA . 1,016 parts In-Stock

1+ parts

-

100+ parts

$25.074

1k+ parts

-

10k+ parts

-

1,016

-

$25.074

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-

Corphita

USA . 55 parts In-Stock

1+ parts

-

100+ parts

-

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55

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Overview

Upgrade your electronic designs with the high-quality PSD813F1V-15MI from STMicroelectronics. This versatile microcontroller offers unparalleled performance and reliability, making it ideal for a wide range of applications in the electronics industry. With advanced technology and innovative features, this product ensures seamless operation and efficient functionality. Trust STMicroelectronics to deliver cutting-edge solutions for all your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easier and more efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3

Operates at a standard voltage level, making it compatible with a wide range of systems and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable performance.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, ensuring stability and reliability in various operating environments.

ROM Bits Size: 1310720 Bits

Large ROM capacity allows for storing extensive program data, enabling versatile functionality and customization.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD813F1V-15MI attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD813F1V-15MI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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