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PSD813F1V-15UT

STMicroelectronics

PSD813F1V-15UT by STMicroelectronics

STMicroelectronics' PSD813F1V-15UT is a 64-terminal uC with 1310720 ROM bits, operating at 3.3V. It has a max standby current of 0.0001A and access time of 0.00000015ns. Ideal for commercial applications requiring high-speed processing in temperatures ranging from 0 to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,568 parts In-Stock

1+ parts

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10k+ parts

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3,568

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Digiode

USA . 1,080 parts In-Stock

1+ parts

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1,080

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Anansix

USA . 123 parts In-Stock

1+ parts

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123

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 874 parts In-Stock

1+ parts

$19.417

100+ parts

-

1k+ parts

-

10k+ parts

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874

$19.417

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IDEA Electronic Components Group

UK . 1,532 parts In-Stock

1+ parts

$43.991

100+ parts

-

1k+ parts

$39.592

10k+ parts

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1,532

$43.991

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$39.592

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MKK Technologies

India . 1,576 parts In-Stock

1+ parts

$82.722

100+ parts

-

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1,576

$82.722

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DigiPath Technology Company

USA . 1,576 parts In-Stock

1+ parts

$82.722

100+ parts

-

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1,576

$82.722

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Corphita

USA . 1,987 parts In-Stock

1+ parts

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1,987

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Parana Technologies

USA . 1,041 parts In-Stock

1+ parts

-

100+ parts

$52.598

1k+ parts

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10k+ parts

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1,041

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$52.598

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Overview

Unlock the potential of your electronic projects with the PSD813F1V-15UT by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-quality components that guarantee reliability and performance. This versatile IC is perfect for a wide range of applications, offering customers unmatched value and benefits. Upgrade your designs with ease and precision, thanks to the innovative features and advantages this product provides. Trust STMicroelectronics to bring your creations to life with the highest standards of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and more cost-effective compared to other materials.

Surface Mount: YES

Surface mount technology makes it easier to mount the product on a circuit board, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, enabling a compact design.

Power Supplies (V): 3.3

Operating at 3.3V makes the product compatible with a wide range of power supplies commonly used in electronic devices.

No. of Terminals: 64

With 64 terminals, this product offers a high level of connectivity, making it suitable for complex electronic applications.

Package Style (Meter): FLATPACK

The flatpack package style provides a low profile design, saving space in the overall product assembly.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperature environments.

Minimum Operating Temperature: 0 °C

The product can operate efficiently even at 0 °C, ensuring reliable performance in a wide range of conditions.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for performance and reliability in various applications.

ROM Bits Size: 1310720 Bits

With a large ROM bits size, this product can store a significant amount of data, suitable for memory-intensive tasks.

Technology: CMOS

Using CMOS technology, the product consumes less power and generates less heat, contributing to energy efficiency and improved reliability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, simplifying integration into electronic systems.

Maximum Standby Current: 0.0001 Amp

The low maximum standby current consumption helps in reducing power usage and extending the product's battery life.

Maximum Access Time: 0.00000015 ns

The ultra-fast maximum access time ensures quick data retrieval and processing, enhancing overall system performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD813F1V-15UT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD813F1V-15UT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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