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PSD813F1V-15JIT

STMicroelectronics

PSD813F1V-15JIT by STMicroelectronics

STMicroelectronics' PSD813F1V-15JIT is a 52-terminal chip carrier IC with 1310720 ROM bits. Operating at 3.3V, it has a max standby current of 0.0001A and access time of 0.00000015ns. Ideal for industrial applications requiring CMOS technology and temperature range from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,360 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,360

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-

-

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Digiode

USA . 3,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,192

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Anansix

USA . 495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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495

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,222 parts In-Stock

1+ parts

$19.425

100+ parts

-

1k+ parts

-

10k+ parts

-

1,222

$19.425

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-

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IDEA Electronic Components Group

UK . 1,049 parts In-Stock

1+ parts

$70.031

100+ parts

-

1k+ parts

$63.028

10k+ parts

-

1,049

$70.031

-

$63.028

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MKK Technologies

India . 1,035 parts In-Stock

1+ parts

$131.689

100+ parts

-

1k+ parts

-

10k+ parts

-

1,035

$131.689

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-

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DigiPath Technology Company

USA . 1,035 parts In-Stock

1+ parts

$131.689

100+ parts

-

1k+ parts

-

10k+ parts

-

1,035

$131.689

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-

-

Parana Technologies

USA . 1,083 parts In-Stock

1+ parts

-

100+ parts

$83.733

1k+ parts

-

10k+ parts

-

1,083

-

$83.733

-

-

Corphita

USA . 245 parts In-Stock

1+ parts

-

100+ parts

-

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245

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Overview

Unlock new possibilities with the PSD813F1V-15JIT by STMicroelectronics. This high-quality IC offers unparalleled performance and reliability in a compact chip carrier package. Suitable for a wide range of applications, this product is designed to meet the demands of industrial environments. With its advanced technology and innovative features, the PSD813F1V-15JIT provides customers with value, efficiency, and peace of mind. Upgrade your projects with the best in class from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Package Shape: SQUARE

Efficient use of space on the PCB, compact design.

Power Supplies (V): 3.3

Operates on a common voltage supply, easily compatible with standard power sources.

No. of Terminals: 52

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER

Ensures good thermal performance and efficient heat dissipation.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high temperature requirements.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in harsh environments.

Terminal Finish: Matte Tin (Sn)

Provides good conductivity and corrosion resistance.

Technology: CMOS

Low power consumption and high noise immunity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD813F1V-15JIT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD813F1V-15JIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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