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PSD813F1V-15J

STMicroelectronics

PSD813F1V-15J by STMicroelectronics

PSD813F1V-15J by STMicroelectronics is a CMOS IC with a 3.3V supply, featuring 1.31M ROM bits and a max access time of 150 ns. It operates in temperatures from 0 °C to 70 °C and comes in a square chip carrier package. Ideal for various peripheral applications, it supports surface mounting with low standby current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,519 parts In-Stock

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3,519

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Vyrian

USA . 3,196 parts In-Stock

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3,196

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Anansix

USA . 2,745 parts In-Stock

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2,745

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 843 parts In-Stock

1+ parts

$33.574

100+ parts

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843

$33.574

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IDEA Electronic Components Group

UK . 627 parts In-Stock

1+ parts

$53.197

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$47.877

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627

$53.197

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$47.877

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MKK Technologies

India . 406 parts In-Stock

1+ parts

$100.034

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406

$100.034

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DigiPath Technology Company

USA . 406 parts In-Stock

1+ parts

$100.034

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406

$100.034

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Corphita

USA . 2,849 parts In-Stock

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2,849

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Parana Technologies

USA . 95 parts In-Stock

1+ parts

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$63.605

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95

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$63.605

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Overview

Unlock limitless possibilities with the PSD813F1V-15J from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality device offers robust performance in compact applications, ensuring reliability and efficiency for your projects. With its advanced technology, it supports diverse uses in consumer electronics, automotive, and industrial systems, delivering exceptional value and unmatched benefits. Elevate your designs with STMicroelectronics' commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against moisture and mechanical stress, ensuring reliable operation in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and higher circuit density, making it suitable for high-performance applications.

Package Shape: SQUARE

The square shape helps in efficient space utilization on PCB layouts, ultimately contributing to a more organized and compact design.

Power Supplies (V): 3.3

Operates at a low voltage of 3.3V, which is energy-efficient and aligns with modern low-power designs.

No. of Terminals: 52

With 52 terminals, this product offers ample connectivity options, facilitating various interfacing needs for complex applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is advantageous for thermal performance, enabling effective heat dissipation during operation.

Maximum Operating Temperature: 70 °C

The maximum operating temperature allows this IC to function reliably in a wide range of industrial environments.

Minimum Operating Temperature: 0 °C

Starting from 0 °C makes this IC suitable for use in applications that might experience low temperatures, expanding its usability.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides excellent solderability, enhancing the ease of installation and maintenance.

Ultraviolet Erasable: N

Not being ultraviolet erasable contributes to data integrity and stability, making it favorable for applications requiring permanent data storage.

Terminal Position: QUAD

Quad terminal position simplifies routing and offers flexibility in design and PCB layout, making it easier to work with.

Temperature Grade: COMMERCIAL

Designed for commercial-grade environments, this IC balances performance and reliability for typical applications.

ROM Bits Size: 1310720 Bits

A sizable ROM bit capacity allows for extensive program storage, enabling complex functionalities within a compact space.

Technology: CMOS

Using CMOS technology leads to lower power consumption and higher efficiency, ideal for battery-operated devices.

Terminal Form: J BEND

J bend terminals improve mechanical stability and electrical connectivity, enhancing the overall reliability of the connection.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3V ensures compatibility with a wide range of devices, promoting versatility in application.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch enables better spacing for easier soldering and reduces the risk of electrical shorts.

Maximum Standby Current: 0.0001 Amp

An extremely low maximum standby current signifies excellent energy efficiency, making the product suitable for power-sensitive applications.

Maximum Access Time: 0.00000015 ns

This incredibly fast access time ensures high-speed operation, meeting the demands of high-performance processing applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD813F1V-15J attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other uPs/uCs/Peripheral ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD813F1V-15J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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