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PSD813F1V-15JT

STMicroelectronics

PSD813F1V-15JT by STMicroelectronics

STMicroelectronics' PSD813F1V-15JT is a 3.3V CMOS chip carrier IC with 1310720 ROM bits. With 52 terminals in a square package, it operates b/w 0 to 70 °C and has a standby current of 0.0001A. Ideal for commercial applications requiring high-speed access times in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,379 parts In-Stock

1+ parts

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4,379

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Vyrian

USA . 3,817 parts In-Stock

1+ parts

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3,817

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Anansix

USA . 492 parts In-Stock

1+ parts

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492

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 858 parts In-Stock

1+ parts

$21.107

100+ parts

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10k+ parts

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858

$21.107

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IDEA Electronic Components Group

UK . 123 parts In-Stock

1+ parts

$25.767

100+ parts

-

1k+ parts

$23.191

10k+ parts

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123

$25.767

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$23.191

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MKK Technologies

India . 2,175 parts In-Stock

1+ parts

$48.454

100+ parts

-

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2,175

$48.454

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DigiPath Technology Company

USA . 2,175 parts In-Stock

1+ parts

$48.454

100+ parts

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2,175

$48.454

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Corphita

USA . 3,849 parts In-Stock

1+ parts

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3,849

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Parana Technologies

USA . 334 parts In-Stock

1+ parts

-

100+ parts

$30.809

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334

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$30.809

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Overview

Unleash the power of innovation with the PSD813F1V-15JT by STMicroelectronics. Crafted with precision and quality, this product offers unmatched reliability and performance in the realm of Other Function uPs, uCs & Peripheral ICs. From its durable plastic/epoxy package body to its sleek square shape, this chip carrier is designed to exceed expectations. With a nominal supply voltage of 3.3V and a maximum operating temperature of 70 °C, this versatile component is perfect for a variety of applications. Elevate your projects with the cutting-edge technology and exceptional value that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, enabling compact designs.

Power Supplies (V): 3.3

Compatible with common voltage standards, making it versatile for a variety of applications.

No. of Terminals: 52

Sufficient number of terminals for connecting to other components, providing flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers thermal performance and protection for the integrated circuits, ensuring reliable operation.

Maximum Operating Temperature: 70 °C

Capable of operating in a wide range of temperatures, suitable for different environments and conditions.

Minimum Operating Temperature: 0 °C

Can function in low temperature conditions, making it suitable for applications in cold environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and conductivity, ensuring stable connections with other components.

Ultraviolet Erasable: N

Not ultraviolet erasable, ensuring data and programming integrity is maintained.

Terminal Position: QUAD

Quad terminal position allows for easy integration into circuit boards, simplifying installation and maintenance.

Temperature Grade: COMMERCIAL

Commercial temperature grade suitable for standard operating conditions, providing reliability in typical usage scenarios.

ROM Bits Size: 1310720 Bits

Large ROM bits size allows for storage of extensive programming and data, enabling complex functions and features.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and stable operation.

Terminal Form: J BEND

J Bend terminal form facilitates easy connection to external components, enhancing usability and compatibility.

Nominal Supply Voltage: 3.3 V

Matches common supply voltage standards, ensuring compatibility with various power sources and systems.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for efficient routing and connections, allowing for compact design and high-density integration.

Maximum Standby Current: 0.0001 Amp

Low standby current consumption, enhancing energy efficiency and reducing power costs during idle periods.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time for retrieving data, enabling quick and responsive operation for high-performance applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD813F1V-15JT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD813F1V-15JT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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