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PSD813F1V-15U

STMicroelectronics

PSD813F1V-15U by STMicroelectronics

PSD813F1V-15U by STMicroelectronics is a CMOS IC with a 3.3V supply, featuring 64 terminals in a flatpack package. It operates b/w 0 °C and 70 °C, offering a max access time of just 150 ns. Ideal for various applications requiring efficient data storage and retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,272 parts In-Stock

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3,272

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Anansix

USA . 1,961 parts In-Stock

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1,961

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Digiode

USA . 1,438 parts In-Stock

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1,438

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 357 parts In-Stock

1+ parts

$25.892

100+ parts

-

1k+ parts

$23.302

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357

$25.892

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$23.302

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MKK Technologies

India . 1,487 parts In-Stock

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$48.687

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1,487

$48.687

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DigiPath Technology Company

USA . 1,487 parts In-Stock

1+ parts

$48.687

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1,487

$48.687

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Corohmni

South Africa . 4,854 parts In-Stock

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$67.065

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4,854

$67.065

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Corphita

USA . 3,283 parts In-Stock

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3,283

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Parana Technologies

USA . 139 parts In-Stock

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$30.957

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139

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$30.957

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Overview

Unlock limitless potential with the PSD813F1V-15U from STMicroelectronics, where innovation meets reliability. This high-quality IC is designed for versatility in diverse applications, ensuring top-notch performance even in demanding environments. With STMicroelectronics' commitment to excellence, you gain a trusted partner that enhances your projects while maximizing efficiency. Elevate your designs and experience the seamless integration and superior value this advanced component brings to your technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various environments, making it suitable for diverse applications.

Surface Mount: YES

Surface mount technology allows for a more compact device design and easier automated assembly, enhancing production efficiency.

Package Shape: SQUARE

The square package shape enables optimal space utilization on PCBs, facilitating more efficient layout designs.

Power Supplies (V): 3.3

Operating on a standard 3.3V power supply makes this product compatible with a wide range of modern electronic devices.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options, allowing for more complex circuit integrations and functionalities.

Package Style (Meter): FLATPACK

The flatpack style is conducive for low-profile applications, ideal for compact electronic designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures the IC can function in moderately harsh environments without performance degradation.

Minimum Operating Temperature: 0 °C

Operating from 0 °C provides versatility, making it suitable for applications in various climates and temperate conditions.

Ultraviolet Erasable: N

Not being UV erasable simplifies use cases, focusing on flash or EEPROM technologies for data retention.

Terminal Position: QUAD

Quad terminal positioning improves thermal and electrical performance, leading to better overall circuit efficiency.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this IC is a reliable choice for consumer electronics and general applications.

ROM Bits Size: 1310720 Bits

With a substantial ROM capacity, this product supports complex software applications and larger data storage needs.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making this IC energy-efficient and performant.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections, ensuring a strong electrical interface.

Nominal Supply Voltage: 3.3 V

Its nominal supply voltage of 3.3 V aligns well with contemporary digital circuits, simplifying power management.

Terminal Pitch: 0.8 mm

A 0.8 mm pitch makes the terminals suitable for modern PCB designs while maintaining a balance between density and ease of handling.

Maximum Standby Current: 0.0001 Amp

A very low standby current ensures that the device is energy-efficient, making it ideal for battery-powered applications.

Maximum Access Time: 0.00000015 ns

An exceptionally fast access time significantly improves system responsiveness and performance in high-speed applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD813F1V-15U attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other uPs/uCs/Peripheral ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD813F1V-15U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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