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PSD854F2V-90M

STMicroelectronics

PSD854F2V-90M by STMicroelectronics

PSD854F2V-90M by STMicroelectronics is a CMOS IC with a 3.3V supply, featuring 52 terminals in a flatpack package. It operates b/w 0 °C and 70°C, offering an impressive max access time of just 90 ns. Ideal for embedded applications requiring efficient data storage and retrieval.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 2,382 parts In-Stock

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Digiode

USA . 2,261 parts In-Stock

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Anansix

USA . 1,563 parts In-Stock

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Bristol Electronics

USA . 384 parts In-Stock

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AZTECH Wire

Italy . 1,116 parts In-Stock

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$12.520

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$12.520

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IDEA Electronic Components Group

UK . 740 parts In-Stock

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$34.742

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$31.268

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740

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Corohmni

South Africa . 897 parts In-Stock

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$45.619

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MKK Technologies

India . 479 parts In-Stock

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$65.330

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DigiPath Technology Company

USA . 479 parts In-Stock

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$65.330

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Microchip USA

USA . 4,015 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,578 parts In-Stock

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Kepictronics

USA . 3,188 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,091 parts In-Stock

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Metaverse IC Inc.

Canada . 413 parts In-Stock

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Corphita

USA . 282 parts In-Stock

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Parana Technologies

USA . 31 parts In-Stock

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$41.539

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Overview

Unlock the power of innovation with the PSD854F2V-90M from STMicroelectronics. Renowned for its exceptional quality, this versatile IC enhances your designs with reliability and efficiency. Ideal for a range of applications, it ensures seamless integration while delivering optimal performance in commercial environments. With STMicroelectronics' legacy of excellence, you gain not just a product, but a trusted partner in elevating your projects to new heights. Experience unmatched value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, ensuring better performance and efficiency.

Package Shape: SQUARE

The square package shape optimizes space on circuit boards, allowing for more efficient layout and effective heat dissipation.

Power Supplies (V): 3.3

The 3.3V power supply is compatible with a wide range of modern electronic devices, making it versatile for various applications.

No. of Terminals: 52

Having 52 terminals allows for extensive connections, providing flexibility in circuit design and enabling complex functionalities.

Package Style (Meter): FLATPACK

The flatpack style facilitates easy mounting and reduces overall footprint, which is advantageous for space-constrained applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in a variety of environments, enhancing product longevity.

Minimum Operating Temperature: 0 °C

Operational capability down to 0 °C makes it usable in low-temperature environments, broadening its applicability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion, improving the reliability and lifespan of the product.

Ultraviolet Erasable: N

Non-erasable specifications may offer enhanced data security, making it suitable for applications where data retention and integrity are critical.

Terminal Position: QUAD

Quad terminal position provides better connection stability and reduces parasitic inductance, improving signal integrity.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring adequate performance and compliance with industry standards.

ROM Bits Size: 2359296 Bits

The substantial ROM size supports complex program storage, making it suitable for sophisticated applications requiring large codebases.

Technology: CMOS

CMOS technology offers low power consumption and high speed, which are essential for energy-efficient and high-performance devices.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical attachment and easy soldering, ensuring reliable connections in manufacturing.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V aligns with the standards for many modern digital circuits, enhancing compatibility.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch enables high-density connections, advantageous for compact designs in advanced electronics.

Maximum Standby Current: 0.0001 Amp

The ultra-low standby current is ideal for power-sensitive applications, contributing to overall energy efficiency.

Maximum Access Time: 0.00000009 ns

An incredibly fast access time ensures high-speed operation, making this product suitable for time-critical applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs PSD854F2V-90M attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

2359296 Bits

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other uPs/uCs/Peripheral ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD854F2V-90M Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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