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SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX286CVM4C by NXP Semiconductors

MCIMX286CVM4C

NXP Semiconductors

MCIMX286CVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance and compact design.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286DVM4C by NXP Semiconductors

MCIMX286DVM4C

NXP Semiconductors

MCIMX286DVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35V to 1.55V. This low-profile, fine-pitch IC with 289 terminals is ideal for various applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX287CVM4C by NXP Semiconductors

MCIMX287CVM4C

NXP Semiconductors

MCIMX287CVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35V to 1.55V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

AWR1443FQIGABLQ1 by Texas Instruments

AWR1443FQIGABLQ1

Texas Instruments

AWR1443FQIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

589824

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

AWR1443FQIGABLRQ1 by Texas Instruments

AWR1443FQIGABLRQ1

Texas Instruments

AWR1443FQIGABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

589824

AEC-Q100

1.2 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

A7102CLTK2/T0BC2AJ by NXP Semiconductors

A7102CLTK2/T0BC2AJ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

S-PDSO-N8

4 mm

8

90 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.16,32

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.8 mm

DUAL

4 mm

CRYPTOGRAPHIC AUTHENTICATOR

A7102CLTK2/T0BC2XJ by NXP Semiconductors

A7102CLTK2/T0BC2XJ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

S-PDSO-N8

4 mm

8

90 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.16,32

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.8 mm

DUAL

4 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATWINC1500B-MU-Y by Microchip Technology

ATWINC1500B-MU-Y

Microchip Technology

Microchip Technology's ATWINC1500B-MU-Y is a 40-terminal chip carrier with a clock frequency of 48 MHz. Ideal for industrial applications, it operates b/w -40 to 85 °C and supports network controller technology. With a supply voltage range of 2.7V to 3.6V, this CMOS device is surface mountable and has a terminal pitch of 0.4 mm.

48 MHz

S-PQCC-N40

e3

5 mm

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

5 mm

NETWORK CONTROLLER

ATWINC1510B-MU-Y by Microchip Technology

ATWINC1510B-MU-Y

Microchip Technology

ATWINC1510B-MU-Y by Microchip operates at 48 MHz with a supply voltage range of 2.7V to 3.6V, suitable for industrial applications. It features a network controller in a compact chip carrier package with matte tin finish and quad terminals, ideal for surface mount assembly. This CMOS technology device has an operating temperature range from -40°C to 85°C, making it versatile for various electronic designs.

48 MHz

S-PQCC-N40

e3

5 mm

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

5 mm

NETWORK CONTROLLER

MIMX8MM1DVTLZAA by NXP Semiconductors

MIMX8MM1DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM1DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM2DVTLZAA by NXP Semiconductors

MIMX8MM2DVTLZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM3DVTLZAA by NXP Semiconductors

MIMX8MM3DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM3DVTLZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM4DVTLZAA by NXP Semiconductors

MIMX8MM4DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM4DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM5DVTLZAA by NXP Semiconductors

MIMX8MM5DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM5DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM1CVTKZAA by NXP Semiconductors

MIMX8MM1CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM1CVTKZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w -40 to 105°C, it has a supply voltage range of 0.9-1V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM3CVTKZAA by NXP Semiconductors

MIMX8MM3CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM3CVTKZAA is a SoC with 486 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 0.9V to 1V and uses CMOS technology. This low-profile, fine-pitch IC is suitable for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MCIMX7D5EVK10SD by NXP Semiconductors

MCIMX7D5EVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.2 V;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

EFR32BG13P532F512GM48-DR by Silicon Labs

EFR32BG13P532F512GM48-DR

Silicon Labs

EFR32BG13P532F512GM48-DR by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.8V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in the Other Function uPs,uCs category.

S-XQCC-N48

7 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SoC

MIMX8MN1DVTJZAA by NXP Semiconductors

MIMX8MN1DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN1DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN2DVTJZAA by NXP Semiconductors

MIMX8MN2DVTJZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN3DVTJZAA by NXP Semiconductors

MIMX8MN3DVTJZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN4DVTJZAA by NXP Semiconductors

MIMX8MN4DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN4DVTJZAA is a SoC with 486 terminals in a low profile, fine pitch grid array package. It operates b/w 0-95°C with supply voltage range of 0.95-1.05 V. Ideal for applications requiring high performance and compact design in various electronic devices.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN5DVTJZAA by NXP Semiconductors

MIMX8MN5DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN5DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN6DVTJZCA by NXP Semiconductors

MIMX8MN6DVTJZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

14 mm

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

14 mm

SoC

MIMX8MN6DVTJZDA by NXP Semiconductors

MIMX8MN6DVTJZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

14 mm

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

14 mm

SoC

MCIMX6Z0DVM09ABR by NXP Semiconductors

MCIMX6Z0DVM09ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.375 V;

S-PBGA-B289

14 mm

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.32 mm

1.5 V

1.375 V

YES

CMOS

BALL

.8 mm

BOTTOM

14 mm

SoC

CEC1712H-S2-I/SX by Microchip Technology

CEC1712H-S2-I/SX

Microchip Technology

CEC1712H-S2-I/SX by Microchip Technology is a MICROPROCESSOR CIRCUIT with 84 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, compatible with I2C, QSPI, UART buses. With a low supply voltage range of 1.71-1.89 V, it's ideal for INDUSTRIAL applications requiring high performance in compact spaces.

3.3V NOM SUPPLY ALSO AVAILABLE

I2C, QSPI, UART

S-PBGA-B84

7 mm

84

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA84,10X10,25

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

7 mm

MICROPROCESSOR CIRCUIT

MCIMX6DP4AVT8AAR by NXP Semiconductors

MCIMX6DP4AVT8AAR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP4AVT8ABR by NXP Semiconductors

MCIMX6DP4AVT8ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA624,25X25,32;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AAR by NXP Semiconductors

MCIMX6DP6AVT8AAR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.4 V;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8ABR by NXP Semiconductors

MCIMX6DP6AVT8ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.4 V;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6X4AVM08ABR by NXP Semiconductors

MCIMX6X4AVM08ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B529

e1

19 mm

3

529

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.5 V

1.275 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

SoC

EFR32ZG23A010F512GM40-C by Silicon Labs

EFR32ZG23A010F512GM40-C

Silicon Labs

EFR32ZG23A010F512GM40-C by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.

S-XQCC-N40

5 mm

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.71 V

3.3 V

YES

CMOS

NO LEAD

.4 mm

QUAD

5 mm

SoC

DLPC2607ZVB by Texas Instruments

DLPC2607ZVB

Texas Instruments

DLPC2607ZVB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 176 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high performance and low power consumption.

S-PBGA-B176

e1

3

176

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

DLPC6401ZFF by Texas Instruments

DLPC6401ZFF

Texas Instruments

DLPC6401ZFF by Texas Instruments is a CMOS microprocessor circuit with 419 terminals in a square grid array package. It operates b/w 0-55°C, with supply voltage range of 1.116-1.26V. Ideal for applications requiring high-performance processing in commercial-grade environments.

S-PBGA-B419

23 mm

419

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.36 mm

1.26 V

1.116 V

1.2 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT

DLPC900ZPC by Texas Instruments

DLPC900ZPC

Texas Instruments

DLPC900ZPC by Texas Instruments is a 516-terminal microprocessor circuit with CMOS technology. It operates b/w 0-55°C, supports I2C, SPI, UART, and USB buses, and has a clock frequency of up to 20 MHz. Ideal for applications requiring a low-voltage supply and high data bus width in a compact grid array package.

I2C; SPI; UART; USB

20 MHz

16

S-PBGA-B516

27 mm

9

516

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

2.42 mm

1.2 V

1.1 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

XC7Z010-L1CLG225I by Xilinx

XC7Z010-L1CLG225I

Xilinx

XC7Z010-L1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package features a grid array style with 225 terminals and is ideal for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-L1CLG400I by Xilinx

XC7Z010-L1CLG400I

Xilinx

XC7Z010-L1CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. It operates b/w -40°C to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile, fine-pitch IC is ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z015-1CLG485C by Xilinx

XC7Z015-1CLG485C

Xilinx

XC7Z015-1CLG485C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B485

19 mm

485

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-1CLG485I by Xilinx

XC7Z015-1CLG485I

Xilinx

The Xilinx XC7Z015-1CLG485I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 485 terminals, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-2CLG485E by Xilinx

XC7Z015-2CLG485E

Xilinx

The Xilinx XC7Z015-2CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 485 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities in compact designs.

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-2CLG485I by Xilinx

XC7Z015-2CLG485I

Xilinx

Xilinx XC7Z015-2CLG485I is a CMOS System on Chip with 485 terminals in a low profile grid array package. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-3CLG485E by Xilinx

XC7Z015-3CLG485E

Xilinx

The Xilinx XC7Z015-3CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-L1CLG485I by Xilinx

XC7Z015-L1CLG485I

Xilinx

XC7Z015-L1CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package style features a grid array, low profile design ideal for various applications in the electronics industry.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-L1CLG400I by Xilinx

XC7Z020-L1CLG400I

Xilinx

The Xilinx XC7Z020-L1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-L1CLG484I by Xilinx

XC7Z020-L1CLG484I

Xilinx

XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-1SBG485C by Xilinx

XC7Z030-1SBG485C

Xilinx

XC7Z030-1SBG485C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 485 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.

S-PBGA-B485

19 mm

485

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-1SBG485I by Xilinx

XC7Z030-1SBG485I

Xilinx

XC7Z030-1SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. With 485 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP