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SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
STWBCTR by STMicroelectronics

STWBCTR

STMicroelectronics

STWBCTR by STMicroelectronics is a 32-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 105 °C, suitable for INDUSTRIAL applications. This SQUARE chip carrier has a very thin profile, no lead terminal form, and nominal voltage of 5 V.

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

5 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

STWBC by STMicroelectronics

STWBC

STMicroelectronics

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

5 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

CC1310F32RHBR by Texas Instruments

CC1310F32RHBR

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

CC1310F64RGZR by Texas Instruments

CC1310F64RGZR

Texas Instruments

CC1310F64RGZR by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a compact, surface-mountable package.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

ADUCM330WDCPZ-RL by Analog Devices

ADUCM330WDCPZ-RL

Analog Devices

ADUCM330WDCPZ-RL by Analog Devices is a CMOS microprocessor circuit with 32 terminals, operating from -40 to 115 °C. It has a supply voltage range of 3.6V to 18V and is suitable for industrial applications requiring a compact square chip carrier package style.

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

ADUCM331WDCPZ-RL by Analog Devices

ADUCM331WDCPZ-RL

Analog Devices

ADUCM331WDCPZ-RL by Analog Devices is a CMOS microprocessor circuit with 32 terminals in a square chip carrier package. It operates b/w -40 to 115 °C, with supply voltage range of 3.6V to 18V. Ideal for industrial applications requiring high performance and compact design.

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

CMX7341Q3 by Cml Microcircuits

CMX7341Q3

Cml Microcircuits

CMX7341Q3 by Cml Microcircuits is a 48-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for industrial applications, it comes in a square chip carrier package style suitable for surface mount assembly.

S-XQCC-N48

6 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPNR by Texas Instruments

MSP430F67621AIPNR

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPN by Texas Instruments

MSP430F67621AIPN

Texas Instruments

MSP430F67621AIPN by Texas Instruments is an 80-terminal microprocessor circuit with 4096 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications. With a supply voltage range of 1.8-3.6V, this CMOS technology-based IC is suitable for low-profile designs requiring ADC channels and a compact form factor.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPZR by Texas Instruments

MSP430F67621AIPZR

Texas Instruments

MSP430F67621AIPZR by Texas Instruments is a 100-terminal microprocessor circuit with 4096 bytes of RAM. It operates b/w -40 to 85°C, compatible with I2C, SPI, and UART buses. This CMOS technology chip has a low profile package style suitable for industrial applications.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPZ by Texas Instruments

MSP430F67621AIPZ

Texas Instruments

MSP430F67621AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, supporting I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring low profile design and 3.3V nominal voltage.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPNR by Texas Instruments

MSP430F67641AIPNR

Texas Instruments

MSP430F67641AIPNR by Texas Instruments is a 80-terminal microprocessor circuit with 8192 bytes of RAM. Operating at temperatures from -40 to 85°C, it supports I2C, SPI, and UART bus compatibility. This CMOS technology device has a low profile package style suitable for industrial applications.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPN by Texas Instruments

MSP430F67641AIPN

Texas Instruments

MSP430F67641AIPN by Texas Instruments is an 80-terminal microprocessor circuit with 8192 bytes of RAM. It operates b/w -40 to 85°C, supporting I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring a low-profile package style with a max supply voltage of 3.6V.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPZR by Texas Instruments

MSP430F67641AIPZR

Texas Instruments

MSP430F67641AIPZR by Texas Instruments is a 100-terminal microprocessor circuit with 8-word RAM and 8192-byte RAM. It operates b/w -40 to 85 °C, compatible with I2C, SPI, UART buses for industrial applications requiring low profile design in a square package.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPZ by Texas Instruments

MSP430F67641AIPZ

Texas Instruments

MSP430F67641AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications requiring a low-profile package style with a max seated height of 1.6mm.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMS2 by Texas Instruments

66AK2L06XCMS2

Texas Instruments

The Texas Instruments 66AK2L06XCMS2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.1V. Ideal for applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA2 by Texas Instruments

66AK2L06XCMSA2

Texas Instruments

The Texas Instruments 66AK2L06XCMSA2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.1V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA by Texas Instruments

66AK2L06XCMSA

Texas Instruments

The Texas Instruments 66AK2L06XCMSA is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.1V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMS by Texas Instruments

66AK2L06XCMS

Texas Instruments

The Texas Instruments 66AK2L06XCMS is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.95-1.1 V. This IC, in GRID ARRAY package style, is ideal for applications requiring high processing power in compact designs.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

DLPC3439ZEZ by Texas Instruments

DLPC3439ZEZ

Texas Instruments

DLPC3439ZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 201 terminals in a GRID ARRAY package style, suitable for applications requiring low power consumption and operating temperatures b/w -30 to 85 °C. The IC operates at supply voltages ranging from 1.045V to 1.155V, making it ideal for compact electronic devices.

S-PBGA-B201

13 mm

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

13 mm

MICROPROCESSOR CIRCUIT

DLPC410ZYR by Texas Instruments

DLPC410ZYR

Texas Instruments

DLPC410ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

3 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROPROCESSOR CIRCUIT

UCD3138ARGCR by Texas Instruments

UCD3138ARGCR

Texas Instruments

UCD3138ARGCR by Texas Instruments is a 64-terminal microprocessor circuit with a max clock frequency of 2 MHz. It operates in automotive-grade temperatures from -40 to 125 °C and supports I2C and UART bus compatibility. This chip carrier package with a very thin profile is suitable for applications requiring high-performance control in harsh environments.

YES

I2C; UART

2 MHz

0

S-PQCC-N64

e4

9 mm

2

64

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

9 mm

MICROPROCESSOR CIRCUIT

X430FRL152HCRGER by Texas Instruments

X430FRL152HCRGER

Texas Instruments

X430FRL152HCRGER by Texas Instruments is a CMOS microprocessor circuit with 24 terminals in a square chip carrier package. It operates b/w 0 to 70 °C and has a supply voltage range of 1.45V to 1.65V, making it suitable for various commercial applications requiring low power consumption and compact design.

S-PQCC-N24

4 mm

24

70 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.65 V

1.45 V

1.5 V

YES

CMOS

COMMERCIAL

NO LEAD

.5 mm

QUAD

4 mm

MICROPROCESSOR CIRCUIT

UCD3138ARGCT by Texas Instruments

UCD3138ARGCT

Texas Instruments

UCD3138ARGCT by Texas Instruments is a 64-terminal microprocessor circuit with CMOS technology. It operates at 3-3.6V, -40 to 125°C, and supports I2C and UART bus compatibility. Ideal for automotive applications due to its compact square package style and low profile design.

YES

I2C; UART

2 MHz

0

S-PQCC-N64

e4

9 mm

2

64

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

9 mm

MICROPROCESSOR CIRCUIT

UCD3138ARMHR by Texas Instruments

UCD3138ARMHR

Texas Instruments

UCD3138ARMHR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates at a max clock frequency of 2 MHz and supports I2C and UART bus compatibility. Ideal for automotive applications, it has a temperature range from -40 to 125 °C and a supply voltage of 3-3.6 V.

YES

I2C; UART

2 MHz

0

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

UCD3138ARMHT by Texas Instruments

UCD3138ARMHT

Texas Instruments

UCD3138ARMHT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 40 terminals, operating at -40 to 125 °C. It has a max clock frequency of 2 MHz and supports I2C and UART bus compatibility. Ideal for automotive applications due to its low profile CHIP CARRIER package style.

YES

I2C; UART

2 MHz

0

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

CC1310F32RGZT by Texas Instruments

CC1310F32RGZT

Texas Instruments

CC1310F32RGZT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates at -40 to 85 °C, with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a compact, surface-mountable package style.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

CC1310F32RHBT by Texas Instruments

CC1310F32RHBT

Texas Instruments

CC1310F32RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes. It operates b/w -40 to 85 °C, with supply voltage range of 1.8-3.8 V. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

CC1310F32RSMT by Texas Instruments

CC1310F32RSMT

Texas Instruments

CC1310F32RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C, with a supply voltage range of 1.8-3.8 V. This MICROPROCESSOR CIRCUIT is ideal for industrial applications requiring low power consumption and compact design.

CORTEX-M3

S-PQCC-N32

e4

4 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

4 mm

MICROPROCESSOR CIRCUIT

CC1310F64RGZT by Texas Instruments

CC1310F64RGZT

Texas Instruments

CC1310F64RGZT by Texas Instruments is a 48-terminal microprocessor circuit with a Cortex-M3 CPU, operating at -40 to 85°C. It features 28,672 RAM bytes and a CMOS technology with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

CC1310F64RHBT by Texas Instruments

CC1310F64RHBT

Texas Instruments

CC1310F64RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes, operating at -40 to 85 °C. It features a CORTEX-M3 CPU Family, 32 terminals in a SQUARE package style, and supports supply voltages from 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

CC1310F64RSMT by Texas Instruments

CC1310F64RSMT

Texas Instruments

CC1310F64RSMT by Texas Instruments is a microprocessor circuit with a Cortex-M3 CPU family. It has 32 terminals and operates at temperatures ranging from -40 to 85°C. With a max supply voltage of 3.8V, it is suitable for industrial applications requiring a very thin profile.

CORTEX-M3

S-PQCC-N32

e4

4 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

4 mm

MICROPROCESSOR CIRCUIT

DLPC910ZYR by Texas Instruments

DLPC910ZYR

Texas Instruments

DLPC910ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring I2C and USB bus compatibility in a compact 27x27mm grid array package.

I2C; USB

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

3 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

MSP430F6749IPZR by Texas Instruments

MSP430F6749IPZR

Texas Instruments

MSP430F6749IPZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 100 terminals, operating at up to 25 MHz. It has a supply voltage range of 1.8V to 3.6V and is ideal for industrial applications requiring I2C, SPI, and UART bus compatibility. The package style is FLATPACK with low profile and fine pitch design, suitable for compact electronic devices.

I2C; SPI; UART

25 MHz

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

DLPC3438CZEZ by Texas Instruments

DLPC3438CZEZ

Texas Instruments

DLPC3438CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage ranging from 1.045V to 1.155V. Ideal for applications requiring high performance and low power consumption.

S-PBGA-B201

e1

13 mm

3

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DLPC3439CZEZ by Texas Instruments

DLPC3439CZEZ

Texas Instruments

DLPC3439CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 1.045V to 1.155V, making it ideal for applications requiring high performance and low power consumption.

S-PBGA-B201

e1

13 mm

3

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

MCIMX6G0DVM05AA by NXP Semiconductors

MCIMX6G0DVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6DP4AVT8AA by NXP Semiconductors

MCIMX6DP4AVT8AA

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP5EYM1AA by NXP Semiconductors

MCIMX6DP5EYM1AA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AA by NXP Semiconductors

MCIMX6DP6AVT8AA

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP7CVT8AA by NXP Semiconductors

MCIMX6DP7CVT8AA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP5EYM1AA by NXP Semiconductors

MCIMX6QP5EYM1AA

NXP Semiconductors

MCIMX6QP5EYM1AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates b/w -20°C to 105°C, with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP7CVT8AA by NXP Semiconductors

MCIMX6QP7CVT8AA

NXP Semiconductors

MCIMX6QP7CVT8AA by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

EM341-RTR by Silicon Labs

EM341-RTR

Silicon Labs

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N48

e3

7 mm

2

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.9 V

1.18 V

1.25 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MICROPROCESSOR CIRCUIT

MCIMX6G1AVM05AA by NXP Semiconductors

MCIMX6G1AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1AVM07AA by NXP Semiconductors

MCIMX6G1AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM05AA by NXP Semiconductors

MCIMX6G2AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM07AA by NXP Semiconductors

MCIMX6G2AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP