Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6G1CVM05AA
NXP Semiconductors
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B289
e2
14 mm
3
289
105 Cel
-40 Cel
PLASTIC/EPOXY
LFBGA
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1.32 mm
1.3 V
1.15 V
YES
CMOS
INDUSTRIAL
Tin/Silver (Sn/Ag)
BALL
.8 mm
BOTTOM
40
SYSTEM ON CHIP
MCIMX6G2CVK05AA
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B272
9 mm
272
1.23 mm
.5 mm
MCIMX6G2CVM05AA
MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.
MCIMX6G3CVM05AA
BGA289,17X17,32
XA7Z030-1FBV484Q
Xilinx
The Xilinx XA7Z030-1FBV484Q is a CMOS microprocessor circuit with 484 ball terminals. It operates in automotive-grade temperatures (-40 to 125 °C) and is AEC-Q100 screened. This square grid array package is ideal for automotive applications requiring high-performance processing capabilities.
S-PBGA-B484
484
125 Cel
BGA
GRID ARRAY
AEC-Q100
AUTOMOTIVE
MICROPROCESSOR CIRCUIT
MCIMX7D3DVK10SC
MCIMX7D3DVK10SC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage ranging from 1.045-1.25 V. With 488 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.
S-PBGA-B488
12 mm
488
95 Cel
0 Cel
TFBGA
BGA488,28X28,16
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
1.25 V
1.045 V
1.1 V
OTHER
.4 mm
MCIMX7D3EVK10SC
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;
-20 Cel
MCIMX7D7DVM10SC
MCIMX7D7DVM10SC by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating b/w 0-95°C. It has a supply voltage range of 1.045-1.25 V and uses BALL terminal form. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.
S-PBGA-B541
19 mm
541
BGA541,25X25,30
1.4 mm
.75 mm
DRA744BJGABCQ1
Texas Instruments
DRA744BJGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for AUTOMOTIVE applications, it features a PLASTIC/EPOXY Package Body Material and operates b/w -40 to 125 °C temperature range.
CAN; I2C; PCI; SPI; UART; USB
32 MHz
64
S-PBGA-B760
e1
23 mm
760
FBGA
GRID ARRAY, FINE PITCH
250
2.96 mm
1000 rpm
1.2 V
1.11 V
TIN SILVER COPPER
30
DRA744BJGABCRQ1
DRA744BJGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40 to 125 °C.
DRA745BLGABCQ1
DRA745BLGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40 to 125 °C.
CAN; I2C; SPI; UART; USB
1176 rpm
DRA745BLGABCRQ1
DRA745BLGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at up to 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40°C to 125°C.
DRA746BPGABCQ1
The Texas Instruments DRA746BPGABCQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at up to 32 MHz clock frequency. Designed for AUTOMOTIVE applications, it features a package style of GRID ARRAY and supports CAN, I2C, SPI, UART, and USB bus compatibility.
1500 rpm
DRA746BPGABCRQ1
The Texas Instruments DRA746BPGABCRQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus, operating at up to 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C. This IC supports CAN, I2C, SPI, UART, and USB bus compatibility.
DRA750BJGABCRQ1
DRA750BJGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 48-bit External Data Bus Width, operating at 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C.
48
DRA752BPGABCQ1
DRA752BPGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 760 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 125 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for AUTOMOTIVE applications requiring high performance and reliability.
DRA752BPGABCRQ1
DRA752BPGABCRQ1 by Texas Instruments is an automotive-grade microprocessor circuit with a CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a grid array package, it is suitable for automotive applications requiring high performance and reliability.
DRA756BPGABCQ1
The Texas Instruments DRA756BPGABCQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C.
XCZU2CG-1SFVC784E
XCZU2CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.
S-PBGA-B784
4
784
100 Cel
.85 V
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
XCZU2CG-1SFVC784I
XCZU2CG-1SFVC784I by Xilinx is a CMOS microprocessor circuit with 784 terminals in a square grid array package. Operating b/w -40 to 100 °C, it has a peak reflow temp of 250C. Ideal for industrial applications requiring low voltage supply and high processing power.
XCZU2CG-2SFVC784I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;
XCZU2CG-L1SFVC784I
IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)
.72 V
XCZU2EG-1SFVC784E
XCZU2EG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. Ideal for applications requiring high-performance computing in compact form factors.
XCZU2EG-3SBVA484E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
.9 V
XCZU3CG-1SFVC784E
XCZU3CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.
XCZU3CG-1SFVC784I
XCZU3CG-1SFVC784I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 784 BALL terminals. It operates in industrial temperature range (-40 to 100 °C) and has a supply voltage of 0.85 V. Ideal for applications requiring high-performance computing in harsh environments.
XCZU3CG-2SFVC784I
XCZU3CG-L1SFVC784I
XCZU3CG-L1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C and has a supply voltage of 0.72 V. This device comes in a GRID ARRAY package with 784 terminals, suitable for various applications requiring high-performance processing capabilities.
XCZU3EG-3SFVC784E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;
XCZU4CG-1SFVC784E
XCZU4CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.
XCZU4CG-1SFVC784I
XCZU4CG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with a supply voltage of 0.85 V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
XCZU4CG-2SFVC784I
XCZU4CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100°C, featuring 784 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring a 0.85V supply voltage and capable of peak reflow at 250°C within 30s.
XCZU4CG-L1SFVC784I
Xilinx XCZU4CG-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with 0.72 V supply voltage. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high-performance processing capabilities.
XCZU4CG-L2SFVC784E
XCZU4CG-L2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 784 terminals in a GRID ARRAY package style. Operating at 0.72V, it's ideal for various applications requiring high-performance computing and processing capabilities.
XCZU4EG-3SFVC784E
XCZU5CG-1SFVC784E
XCZU5CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance processing in compact form factors.
XCZU5CG-1SFVC784I
XCZU5CG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature grade range from -40 to 100 °C. The package has 784 terminals, a GRID ARRAY style, and uses Tin/Silver/Copper terminal finish for various applications.
XCZU5CG-2SFVC784I
XCZU5CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a nominal voltage of 0.85 V. This device, featuring a GRID ARRAY package style, is suitable for various applications requiring high-performance processing capabilities.
XCZU5CG-L1SFVC784I
XCZU5CG-L1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100°C, with a supply voltage of 0.72V. This SQUARE package has 784 terminals and is ideal for industrial applications requiring high-performance processing capabilities.
XCZU5CG-L2SFVC784E
XCZU5CG-L2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY package style. Suitable for applications requiring low supply voltage of 0.72 V and high peak reflow temperature of 250°C, making it ideal for advanced electronic systems.
XCZU5EG-3SFVC784E
XCZU5EG-3SFVC784E by Xilinx is a 784-terminal programmable SoC with CMOS technology. Operating b/w 0-100 °C, it has a supply voltage range of 0.873-0.927 V. Ideal for various applications requiring high-performance computing in a compact form factor.
BGA784,28X28,32
3.32 mm
.927 V
.873 V
PROGRAMMABLE SoC
XCZU5EV-3SFVC784E
XCZU5EV-3SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.9V. With 784 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance processing in compact spaces.
UCD3138128APFCR
UCD3138128APFCR by Texas Instruments is an 80-terminal microprocessor circuit with a clock frequency of 2MHz. It operates in automotive-grade temperatures (-40 to 125°C) and supports I2C, SPI, and UART bus compatibility. This thin-profile IC is ideal for applications requiring ADC channels and a supply voltage range of 3-3.6V.
I2C; SPI; UART
2 MHz
0
S-PQFP-G80
e4
80
TFQFP
FLATPACK, THIN PROFILE, FINE PITCH
1.2 mm
3.6 V
3 V
3.3 V
NICKEL PALLADIUM GOLD
GULL WING
QUAD
UCD3138128APFC
UCD3138128APFC by Texas Instruments is an 80-terminal microprocessor circuit with a clock frequency of 2MHz. It operates in automotive-grade temperatures (-40 to 125°C) and supports I2C, SPI, and UART bus compatibility. The package style is flatpack with a thin profile and fine pitch, making it suitable for various applications requiring high-performance processing in compact spaces.
EFR32MG1B132F256GM32-C0
Silicon Labs
SoC; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC32,.2SQ,20;
S-XQCC-N32
5 mm
32
85 Cel
UNSPECIFIED
HVQCCN
LCC32,.2SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.9 mm
3.8 V
1.85 V
NO LEAD
SoC
EFR32MG1V132F256GM32-C0
EFR32MG1V132F256GM32-C0 by Silicon Labs is a 32-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.85-3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
LS1043ASE7MNLA
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
S-PBGA-B621
21 mm
621
HFBGA
BGA621,25X25,32
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
2.07 mm
.93 V
.87 V
AM4372BZDN60
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B491
17 mm
491
90 Cel
BGA491,25X25,25
1.3 mm
1.144 V
1.056 V
.65 mm
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