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XCZU5CG-L1SFVC784I

Xilinx

XCZU5CG-L1SFVC784I by Xilinx

XCZU5CG-L1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100°C, with a supply voltage of 0.72V. This SQUARE package has 784 terminals and is ideal for industrial applications requiring high-performance processing capabilities.

Median Price

$2,120.280

Lifecycle Status

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Nova Conductors

Japan . 81 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 173 parts In-Stock

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AZTECH Wire

Italy . 801 parts In-Stock

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Ampacity Inc.

Singapore . 969 parts In-Stock

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Corohmni

South Africa . 56 parts In-Stock

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MARBEL Systems

Belgium . 83 parts In-Stock

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Modulus Dynamics

Lithuania . 1,117 parts In-Stock

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Texas Native Microelectronics

USA . 860 parts In-Stock

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Kenton Components

USA . 5,981 parts In-Stock

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Microchip USA

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Qasali Group International

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Continental Prestige Electronics

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Netroflash

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Supply Digital

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Overview

Unleash the power of innovation with the XCZU5CG-L1SFVC784I by Xilinx, a cutting-edge solution in the field of Other Function uPs, uCs & Peripheral ICs. Crafted with precision and expertise by Xilinx, this product offers unmatched quality and reliability. From industrial applications to microprocessor circuits, this versatile device delivers exceptional performance and efficiency. Elevate your projects with the XCZU5CG-L1SFVC784I and experience the value of top-tier technology at your fingertips. Embark on a journey of limitless possibilities with this game-changing innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, making it suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 784

The high number of terminals enables connectivity with various other components, increasing functionality and versatility of the product.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout, facilitating easy integration into electronic systems.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments with elevated temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and stability of the product.

Nominal Supply Voltage: 0.72 V

The low nominal supply voltage helps in reducing power consumption while maintaining the required operational performance, enhancing energy efficiency.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product can withstand a moderate level of moisture exposure, making it suitable for applications in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5CG-L1SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU5CG-L1SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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