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SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
AM4372BZDN80 by Texas Instruments

AM4372BZDN80

Texas Instruments

AM4372BZDN80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4372BZDNA60 by Texas Instruments

AM4372BZDNA60

Texas Instruments

AM4372BZDNA60 by Texas Instruments is a System on Chip with 491 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.056V to 1.144V. Ideal for industrial applications requiring high performance and reliability in compact designs.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.144 V

1.056 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4372BZDNA80 by Texas Instruments

AM4372BZDNA80

Texas Instruments

AM4372BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.21V to 1.326V. This low profile, fine pitch GRID ARRAY package with 491 terminals is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

MCIMX6Y0CVM05AA by NXP Semiconductors

MCIMX6Y0CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6Y0DVM05AA by NXP Semiconductors

MCIMX6Y0DVM05AA

NXP Semiconductors

MCIMX6Y0DVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6Y1CVK05AA by NXP Semiconductors

MCIMX6Y1CVK05AA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SoC

MCIMX6Y1CVM05AA by NXP Semiconductors

MCIMX6Y1CVM05AA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

e1

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y1DVK05AA by NXP Semiconductors

MCIMX6Y1DVK05AA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

SoC

MCIMX6Y1DVM05AA by NXP Semiconductors

MCIMX6Y1DVM05AA

NXP Semiconductors

MCIMX6Y1DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w 0-95°C, with supply voltage ranging from 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y2DVM05AA by NXP Semiconductors

MCIMX6Y2DVM05AA

NXP Semiconductors

MCIMX6Y2DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating b/w 0-95°C, it supports a supply voltage range of 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y7DVK05AA by NXP Semiconductors

MCIMX6Y7DVK05AA

NXP Semiconductors

MCIMX6Y7DVK05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MEC1418-I/SZ by Microchip Technology

MEC1418-I/SZ

Microchip Technology

MEC1418-I/SZ by Microchip: 144-terminal IC with CMOS tech, 2-3.6V supply, -40 to 85°C temp range. Ideal for industrial microprocessor circuits due to its very thin profile and fine pitch grid array package style.

S-PBGA-B144

e1

9 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

3.6 V

2 V

3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

9 mm

MICROPROCESSOR CIRCUIT

MKW21Z256VHT4 by NXP Semiconductors

MKW21Z256VHT4

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;

S-XQCC-N48

e4

3

48

105 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

3.6 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

QUAD

40

MICROPROCESSOR CIRCUIT

MKW31Z512VHT4R by NXP Semiconductors

MKW31Z512VHT4R

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;

S-XQCC-N48

e4

3

48

105 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

3.6 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

QUAD

40

MICROPROCESSOR CIRCUIT

MKW41Z256VHT4 by NXP Semiconductors

MKW41Z256VHT4

NXP Semiconductors

The NXP Semiconductors MKW41Z256VHT4 is a microprocessor circuit with CMOS technology. It operates b/w -40 to 105°C, with a supply voltage range of 1.71-3.6V. Ideal for industrial applications requiring a surface-mount square package with 48 terminals and nickel gold finish.

S-XQCC-N48

e4

3

48

105 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

3.6 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

QUAD

40

MICROPROCESSOR CIRCUIT

MKW41Z512VHT4 by NXP Semiconductors

MKW41Z512VHT4

NXP Semiconductors

The NXP Semiconductors MKW41Z512VHT4 is a CMOS microprocessor circuit with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.71 to 3.6 V. Ideal for industrial applications requiring high-performance uPs and uCs in surface-mount configurations.

S-XQCC-N48

e4

3

48

105 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

3.6 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

QUAD

40

MICROPROCESSOR CIRCUIT

UCD3138ARJAR by Texas Instruments

UCD3138ARJAR

Texas Instruments

UCD3138ARJAR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3-3.6V and ADC channels, it's ideal for various peripheral IC functions in compact designs.

YES

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

UCD3138ARJAT by Texas Instruments

UCD3138ARJAT

Texas Instruments

UCD3138ARJAT by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 3-3.6 V. Ideal for automotive applications, it features ADC channels, quad terminal position, and nickel/palladium/gold/silver finish.

YES

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-4A by Analog Devices

ADSP-SC584BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

EFR32MG1V132F256GM32-C0R by Silicon Labs

EFR32MG1V132F256GM32-C0R

Silicon Labs

EFR32MG1V132F256GM32-C0R by Silicon Labs is a 32-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.85 to 3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.

S-XQCC-N32

5 mm

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.85 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

5 mm

SoC

STWBC-WATR by STMicroelectronics

STWBC-WATR

STMicroelectronics

STWBC-WATR by STMicroelectronics is a compact microprocessor circuit designed for industrial applications, operating b/w -40 °C and 105 °C. It features a max supply voltage of 5.5V, 32 terminals in a very thin profile package. Ideal for space-constrained environments, it ensures reliable performance with low power consumption.

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

5.5 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

STWBC-WA by STMicroelectronics

STWBC-WA

STMicroelectronics

STWBC-WA by STMicroelectronics is a compact microprocessor circuit with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 105 °C. Its 32 terminals and very thin profile make it ideal for industrial applications. This CMOS device ensures efficient performance in space-constrained designs.

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

5.5 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

FT245BL-REEL by FTDI

FT245BL-REEL

FTDI

FT245BL-REEL by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V, operating temperature of 0-70°C, and peak reflow temp of 260°C. Ideal for microprocessor circuits, it features CMOS technology and Gull Wing terminal form in a low-profile flatpack package style.

S-PQFP-G32

e3

7 mm

3

32

70 Cel

0 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

260

1.6 mm

5.25 V

4.35 V

5 V

YES

CMOS

COMMERCIAL

MATTE TIN

GULL WING

.8 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

AM5716AABCDA by Texas Instruments

AM5716AABCDA

Texas Instruments

The Texas Instruments AM5716AABCDA is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCDEA by Texas Instruments

AM5716AABCDEA

Texas Instruments

AM5716AABCDEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCD by Texas Instruments

AM5716AABCD

Texas Instruments

AM5716AABCD by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, has a supply voltage range of 1.11-1.2V, and features a fine pitch grid array package style. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXA by Texas Instruments

AM5716AABCXA

Texas Instruments

AM5716AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXEA by Texas Instruments

AM5716AABCXEA

Texas Instruments

AM5716AABCXEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCX by Texas Instruments

AM5716AABCX

Texas Instruments

AM5716AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 90°C, with supply voltage ranging from 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXA by Texas Instruments

AM5718AABCXA

Texas Instruments

AM5718AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring high-speed processing in compact form factor.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCX by Texas Instruments

AM5718AABCX

Texas Instruments

AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

ADSP-21583BBCZ-4A by Analog Devices

ADSP-21583BBCZ-4A

Analog Devices

ADSP-21583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals on a 19x19 mm square body, making it ideal for high-performance applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583CBCZ-4A by Analog Devices

ADSP-21583CBCZ-4A

Analog Devices

ADSP-21583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583KBCZ-4A by Analog Devices

ADSP-21583KBCZ-4A

Analog Devices

ADSP-21583KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals in a GRID ARRAY package. It operates at up to 500 MHz, with supply voltage range of 1.05V to 1.15V. Ideal for SPI and UART bus applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584BBCZ-4A by Analog Devices

ADSP-21584BBCZ-4A

Analog Devices

ADSP-21584BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals, 0.8 mm pitch, and measures 19x19 mm for various applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584CBCZ-4A by Analog Devices

ADSP-21584CBCZ-4A

Analog Devices

ADSP-21584CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile grid array package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584KBCZ-4A by Analog Devices

ADSP-21584KBCZ-4A

Analog Devices

ADSP-21584KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582BBCZ-4A by Analog Devices

ADSP-SC582BBCZ-4A

Analog Devices

ADSP-SC582BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device comes in a low profile GRID ARRAY package with 349 terminals on a 19mm square body.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582CBCZ-4A by Analog Devices

ADSP-SC582CBCZ-4A

Analog Devices

ADSP-SC582CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582KBCZ-4A by Analog Devices

ADSP-SC582KBCZ-4A

Analog Devices

ADSP-SC582KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C with a supply voltage range of 1.05V to 1.15V, making it ideal for commercial applications requiring high-speed processing in a compact GRID ARRAY package.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-3A by Analog Devices

ADSP-SC583BBCZ-3A

Analog Devices

ADSP-SC583BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC features SPI and UART bus compatibility in a square package with 349 terminals.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-4A by Analog Devices

ADSP-SC583BBCZ-4A

Analog Devices

ADSP-SC583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-3A by Analog Devices

ADSP-SC583CBCZ-3A

Analog Devices

ADSP-SC583CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency. It operates in industrial temperature range (-40 to 95 °C) and supports SPI and UART bus compatibility. The package has 349 terminals in a GRID ARRAY style, making it suitable for various applications requiring high performance and low profile design.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-4A by Analog Devices

ADSP-SC583CBCZ-4A

Analog Devices

ADSP-SC583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 95 °C and has a supply voltage range of 1.05V to 1.15V. This SQUARE package IC features 349 terminals in a GRID ARRAY style, making it ideal for SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-3A by Analog Devices

ADSP-SC583KBCZ-3A

Analog Devices

ADSP-SC583KBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. The package style is GRID ARRAY, LOW PROFILE, FINE PITCH, making it ideal for compact electronic applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-4A by Analog Devices

ADSP-SC583KBCZ-4A

Analog Devices

ADSP-SC583KBCZ-4A by Analog Devices is a 500 MHz microprocessor circuit with SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. Ideal for applications requiring low profile, fine pitch grid array packages in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-3A by Analog Devices

ADSP-SC584BBCZ-3A

Analog Devices

ADSP-SC584BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device features a low profile grid array package with 349 terminals in a square shape.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-3A by Analog Devices

ADSP-SC584CBCZ-3A

Analog Devices

ADSP-SC584CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 95 °C, it offers high performance in various environments.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT