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SQUARE Other Function uPs,uCs & Peripheral ICs 1,672

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX6X1EVO10AC by NXP Semiconductors

MCIMX6X1EVO10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

MCIMX6X3EVN10AC by NXP Semiconductors

MCIMX6X3EVN10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

MCIMX6X3EVO10AC by NXP Semiconductors

MCIMX6X3EVO10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Length: 17 mm;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

MCIMX6X4EVM10AC by NXP Semiconductors

MCIMX6X4EVM10AC

NXP Semiconductors

MCIMX6X4EVM10AC by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 529 terminals. It operates b/w -20 to 105°C and has a supply voltage range of 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B529

e1

19 mm

3

529

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

SoC

DLPC3434CZVB by Texas Instruments

DLPC3434CZVB

Texas Instruments

DLPC3434CZVB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 176 terminals in a GRID ARRAY package. It features a very thin profile, fine pitch, and CMOS technology. Ideal for applications requiring high processing power in compact spaces.

S-PBGA-B176

e1

7 mm

3

176

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

7 mm

MICROPROCESSOR CIRCUIT

MIMXRT1061CVL5A by NXP Semiconductors

MIMXRT1061CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1061CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with a supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SoC

LS1043ASE7KNLB by NXP Semiconductors

LS1043ASE7KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

MCIMX6Q6AVT10ADR by NXP Semiconductors

MCIMX6Q6AVT10ADR

NXP Semiconductors

MCIMX6Q6AVT10ADR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With 624 terminals in a GRID ARRAY package style, it has a low supply voltage range of 1.35-1.5 V for power efficiency.

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

LS1046AXE8Q1A by NXP Semiconductors

LS1046AXE8Q1A

NXP Semiconductors

LS1046AXE8Q1A by NXP Semiconductors is a 780-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high performance in a compact form factor.

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SoC

AT32UC3A4256HHB-C1UR by Microchip Technology

AT32UC3A4256HHB-C1UR

Microchip Technology

Microchip AT32UC3A4256HHB-C1UR is a CMOS microprocessor with 100 terminals in a square grid array package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V. Ideal for industrial applications requiring high-performance processing in compact form factors.

S-PBGA-B100

7 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA100,10X10,25

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

3.3 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

7 mm

MICROPROCESSOR CIRCUIT

MIMXRT1064CVL5A by NXP Semiconductors

MIMXRT1064CVL5A

NXP Semiconductors

The NXP MIMXRT1064CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

10 mm

SoC

NT3H1201W0FHKH by NXP Semiconductors

NT3H1201W0FHKH

NXP Semiconductors

NT3H1201W0FHKH by NXP Semiconductors is an 8-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 95°C, with a supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring a compact chip carrier package style and surface mount compatibility.

S-PQCC-N8

1.6 mm

1

8

95 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER

260

.5 mm

3.6 V

1.7 V

YES

CMOS

INDUSTRIAL

NO LEAD

QUAD

1.6 mm

MICROPROCESSOR CIRCUIT

ATMXT224S-MAUR by Microchip Technology

ATMXT224S-MAUR

Microchip Technology

Microchip Technology's ATMXT224S-MAUR is a 56-terminal, CMOS technology capacitive touch screen controller with a supply voltage range of 1.71V to 3.47V. Operating b/w -40°C to 85°C, it is ideal for applications requiring precise touch input control in compact spaces due to its square shape and low seated height of 0.6mm.

S-XQCC-N56

6 mm

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC56,.24SQ,14

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

3.47 V

1.71 V

1.8 V

YES

CMOS

NO LEAD

.35 mm

QUAD

6 mm

CAPACITIVE TOUCH SCREEN CONTROLLERS

CC-WMX-J97C-TN by Digi International

CC-WMX-J97C-TN

Digi International

CC-WMX-J97C-TN by Digi International is a 400-terminal microprocessor circuit with CMOS technology. It operates b/w -20°C to 70°C, in a square grid array package style measuring 50mm x 50mm. Ideal for applications requiring high-performance processing in compact spaces.

S-XBGA-N400

50 mm

400

70 Cel

-20 Cel

UNSPECIFIED

LGA

SQUARE

GRID ARRAY

YES

CMOS

OTHER

NO LEAD

2 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

CC-WMX-L87C-TE by Digi International

CC-WMX-L87C-TE

Digi International

CC-WMX-L87C-TE by Digi International is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 400 terminals in a SQUARE GRID ARRAY package style, suitable for INDUSTRIAL applications. Operating temperature ranges from -40 to 85°C, making it ideal for various embedded systems requiring high performance.

S-XBGA-N400

50 mm

400

85 Cel

-40 Cel

UNSPECIFIED

LGA

SQUARE

GRID ARRAY

YES

CMOS

INDUSTRIAL

NO LEAD

2 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

ST33HTPH2032AAF3 by STMicroelectronics

ST33HTPH2032AAF3

STMicroelectronics

ST33HTPH2032AAF3 by STMicroelectronics is a 32-terminal IC with CMOS technology, operating from -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for industrial applications requiring secure data processing in compact spaces.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2E32AAF0 by STMicroelectronics

ST33HTPH2E32AAF0

STMicroelectronics

ST33HTPH2E32AAF0 by STMicroelectronics is a cryptographic authenticator designed for industrial applications. It features a compact 5x5 mm size, operates b/w -40 °C to 105 °C, and runs on a nominal voltage of 1.8V. Ideal for secure device authentication in various electronic systems.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2E32AAF1 by STMicroelectronics

ST33HTPH2E32AAF1

STMicroelectronics

ST33HTPH2E32AAF1 by STMicroelectronics is a cryptographic authenticator designed for industrial applications. It operates b/w -40 °C to 105 °C, features a compact 5mm x 5mm square package with 32 terminals, and runs on a nominal voltage of 1.8V. Ideal for secure device authentication in IoT and embedded systems.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

CRYPTOGRAPHIC AUTHENTICATOR

MCIMX280CVM4CR2 by NXP Semiconductors

MCIMX280CVM4CR2

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX280DVM4CR by NXP Semiconductors

MCIMX280DVM4CR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283CVM4CR2 by NXP Semiconductors

MCIMX283CVM4CR2

NXP Semiconductors

MCIMX283CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. Ideal for applications requiring low profile and fine pitch grid array packages.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283DVM4CR2 by NXP Semiconductors

MCIMX283DVM4CR2

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286CVM4CR2 by NXP Semiconductors

MCIMX286CVM4CR2

NXP Semiconductors

MCIMX286CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286DVM4CR by NXP Semiconductors

MCIMX286DVM4CR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

XC7Z015-1CL485I by Xilinx

XC7Z015-1CL485I

Xilinx

The Xilinx XC7Z015-1CL485I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a square grid array package, it's ideal for various applications requiring low profile and fine pitch components.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

PROGRAMMABLE SYSTEM ON CHIP

MIMX8DX6AVLFZAC by NXP Semiconductors

MIMX8DX6AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8DX6AVLFZAC is a System on Chip with 609 terminals, operating temperature range of -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and is designed for automotive applications requiring high performance in a compact form factor.

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX6AVLFZAC by NXP Semiconductors

MIMX8QX6AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8QX6AVLFZAC is a System on Chip with 609 terminals, operating at -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and uses CMOS technology. Ideal for automotive applications requiring high performance in a compact grid array package style.

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

ATMXT224T-CCU027 by Microchip Technology

ATMXT224T-CCU027

Microchip Technology

CAPACITIVE TOUCH SCREEN CONTROLLERS; Terminal Form: BALL; No. of Terminals: 64; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B64

5 mm

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA64,8X8,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.6 mm

3.47 V

3 V

3.3 V

YES

CMOS

BALL

.5 mm

BOTTOM

5 mm

CAPACITIVE TOUCH SCREEN CONTROLLERS

MEC1705Q-C2-I/SZ by Microchip Technology

MEC1705Q-C2-I/SZ

Microchip Technology

MEC1705Q-C2-I/SZ by Microchip Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.71-1.89 V. This IC is ideal for industrial applications requiring very thin profile and fine pitch grid array package style.

ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE

S-PBGA-B144

9 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

9 mm

MICROPROCESSOR CIRCUIT

ATSAMA5D27-WLSOM1 by Microchip Technology

ATSAMA5D27-WLSOM1

Microchip Technology

ATSAMA5D27-WLSOM1 by Microchip: Operates at 3-5.5V, -40 to 85°C. With 188 terminals, it's a CMOS microprocessor circuit ideal for various applications requiring high-performance computing in a compact square package.

S-XUUC-N188

188

85 Cel

-40 Cel

UNSPECIFIED

DIE

SQUARE

UNCASED CHIP

NOT SPECIFIED

5.5 V

3 V

3.3 V

YES

CMOS

NO LEAD

UPPER

NOT SPECIFIED

MICROPROCESSOR CIRCUIT

MIMX8MN6DVTJZAA by NXP Semiconductors

MIMX8MN6DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MCIMX6S6AVM08ACR by NXP Semiconductors

MCIMX6S6AVM08ACR

NXP Semiconductors

MCIMX6S6AVM08ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with a supply voltage range of 1.275V to 1.5V. Ideal for automotive applications due to its low profile and fine pitch package style.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

XC7Z045-1FBG676CES by Xilinx

XC7Z045-1FBG676CES

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

PROGRAMMABLE SYSTEM ON CHIP

66AK2G12ABYT100 by Texas Instruments

66AK2G12ABYT100

Texas Instruments

66AK2G12ABYT100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 0.95V to 1.05V, making it ideal for automotive applications. This package features a grid array with 625 terminals in a low profile, fine pitch design for surface mount assembly.

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

DLPC900AZPC by Texas Instruments

DLPC900AZPC

Texas Instruments

DLPC900AZPC by Texas Instruments is a MICROPROCESSOR CIRCUIT with 516 terminals, operating at a max clock frequency of 20 MHz. It is used in applications requiring I2C, SPI, UART, and USB bus compatibility.

I2C; SPI; UART; USB

20 MHz

16

S-PBGA-B516

27 mm

9

516

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

2.42 mm

1.2 V

1.1 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

MCIMX286DVM4BR by NXP Semiconductors

MCIMX286DVM4BR

NXP Semiconductors

MCIMX286DVM4BR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35-1.55 V, making it ideal for low-power applications in various electronic devices.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

DRA784BSGABFQ1 by Texas Instruments

DRA784BSGABFQ1

Texas Instruments

DRA784BSGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, operating at 32 MHz clock frequency. Ideal for automotive applications, it features a max supply voltage of 1.11 V and can withstand temperatures from -40 to 125 °C.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA784BSGABFRQ1 by Texas Instruments

DRA784BSGABFRQ1

Texas Instruments

DRA784BSGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA785BSGABFQ1 by Texas Instruments

DRA785BSGABFQ1

Texas Instruments

The Texas Instruments DRA785BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Designed for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02V to 1.11V.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA785BSGABFRQ1 by Texas Instruments

DRA785BSGABFRQ1

Texas Instruments

The Texas Instruments DRA785BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA788BSGABFQ1 by Texas Instruments

DRA788BSGABFQ1

Texas Instruments

The Texas Instruments DRA788BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level. The package style is GRID ARRAY, FINE PITCH with 367 terminals in PLASTIC/EPOXY material.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA788BSGABFRQ1 by Texas Instruments

DRA788BSGABFRQ1

Texas Instruments

The Texas Instruments DRA788BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 screening level.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

ADSP-21584KBCZ-5A by Analog Devices

ADSP-21584KBCZ-5A

Analog Devices

ADSP-21584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications. With a supply voltage range of 1.05V to 1.15V, it can operate in temperatures from 0 °C to 70°C.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584BBCZ-5A by Analog Devices

ADSP-21584BBCZ-5A

Analog Devices

ADSP-21584BBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584CBCZ-5A by Analog Devices

ADSP-21584CBCZ-5A

Analog Devices

ADSP-21584CBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-5A by Analog Devices

ADSP-SC584KBCZ-5A

Analog Devices

ADSP-SC584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style with 349 terminals for various applications.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587KBCZ-5B by Analog Devices

ADSP-SC587KBCZ-5B

Analog Devices

ADSP-SC587KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style and is ideal for commercial applications requiring high-speed processing capabilities.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587BBCZ-5B by Analog Devices

ADSP-SC587BBCZ-5B

Analog Devices

ADSP-SC587BBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 85 °C, it's ideal for various embedded system designs.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT