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MCIMX6X3EVN10AC

NXP Semiconductors

MCIMX6X3EVN10AC by NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 635 parts In-Stock

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635

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Distributors (In-Stock)

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Vyrian

USA . 6,246 parts In-Stock

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6,246

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Digiode

USA . 4,453 parts In-Stock

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4,453

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Anansix

USA . 1,511 parts In-Stock

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Flip Electronics

USA . 225 parts In-Stock

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225

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Distributors (Availability)

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Corohmni

South Africa . 2,863 parts In-Stock

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$66.917

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Microchip USA

USA . 2,372 parts In-Stock

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$67.688

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Component Stockers USA

USA . 176 parts In-Stock

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$443.620

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Corphita

USA . 3,217 parts In-Stock

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UNI Independent Distributors

Spain . 1,840 parts In-Stock

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1,840

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6X3EVN10AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.53 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6X3EVN10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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