Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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ADSP-SC589KBCZ-5B
Analog Devices
ADSP-SC589KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features a CMOS technology. Ideal for applications requiring high-speed processing in commercial-grade environments.
SPI; UART
500 MHz
S-PBGA-B349
19 mm
3
349
70 Cel
0 Cel
PLASTIC/EPOXY
LFBGA
BGA529,23X23,32
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1.5 mm
1.15 V
1.05 V
1.1 V
YES
CMOS
COMMERCIAL
BALL
.8 mm
BOTTOM
MICROPROCESSOR CIRCUIT
ADSP-SC589BBCZ-5B
ADSP-SC589BBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) and has 349 terminals in a low profile grid array package for various applications.
85 Cel
-40 Cel
INDUSTRIAL
ADSP-SC584BBCZ-5A
ADSP-SC584BBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile package style (1.5 mm height) for various applications requiring high-speed processing.
ADSP-SC584CBCZ-5A
ADSP-SC584CBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has SPI and UART bus compatibility, suitable for INDUSTRIAL applications requiring low profile, fine pitch GRID ARRAY package style.
95 Cel
EFR32MG13P732F512IM48-DR
Silicon Labs
EFR32MG13P732F512IM48-DR by Silicon Labs is a System on Chip with 48 terminals, operating from -40 to 125 °C. It has a supply voltage range of 1.62V to 3.8V and uses CMOS technology. This chip is ideal for applications requiring low power consumption in compact designs.
S-XQCC-N48
7 mm
48
125 Cel
UNSPECIFIED
HVQCCN
LCC48,.28SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.9 mm
3.8 V
1.62 V
3.3 V
NO LEAD
.5 mm
QUAD
SYSTEM ON CHIP
EFR32MG13P733F512IM48-D
EFR32MG13P733F512IM48-D by Silicon Labs is a System on Chip with 48 terminals, operating from -40 to 125°C. It has a supply voltage range of 1.62V to 3.8V and uses CMOS technology. Ideal for applications requiring low-profile, surface-mount components in various electronic devices.
e3
2
MATTE TIN
40
ECE1200-I/LD
Microchip Technology
ECE1200-I/LD by Microchip: CMOS microprocessor circuit with 40 terminals, operates b/w -40 to 85 °C. Supply voltage range of 1.71V to 1.89V, in a square chip carrier package for various applications requiring low-profile and surface mount technology.
S-PQCC-N40
5 mm
LCC40,.2SQ,16
1.89 V
1.71 V
1.8 V
.4 mm
10AS057K2F40E1HG
Intel
10AS057K2F40E1HG by Intel is a Square GRID ARRAY package with 1517 terminals, operating b/w 0-100°C. It features SoC technology from TSMC, with a terminal pitch of 1mm. Ideal for applications requiring high-performance computing in compact spaces.
S-PBGA-B1517
40 mm
1517
100 Cel
BGA
BGA1517,39X39,40
GRID ARRAY
3.5 mm
TSMC
1 mm
SoC
MCIMX233DAG4C
NXP Semiconductors
MCIMX233DAG4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -10 to 70 °C, with supply voltage range of 1-1.55 V. Ideal for applications requiring low profile, fine pitch ICs in commercial temperature grade environments.
S-PQFP-G128
14 mm
128
-10 Cel
LFQFP
QFP128,.63SQ,16
FLATPACK, LOW PROFILE, FINE PITCH
1.6 mm
1.55 V
1 V
1.35 V
TIN
GULL WING
MIMX8DX2AVLFZAC
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;
S-PBGA-B609
e2
21 mm
609
FBGA
BGA609,35X35,32
GRID ARRAY, FINE PITCH
2.52 mm
AUTOMOTIVE
TIN SILVER
MIMX8DX2AVOFZAC
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;
S-PBGA-B417
17 mm
417
BGA417,29X29,32
2.73 mm
MIMX8DX5AVLFZAC
MIMX8QX2AVLFZAC
The NXP Semiconductors MIMX8QX2AVLFZAC is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.05-1.15 V, making it ideal for automotive applications requiring high performance in a compact GRID ARRAY package.
MIMX8QX2AVOFZAC
MIMX8QX1AVLFZAC
MIMX8QX5AVLFZAC
MIMX8DX1AVOFZAC
MIMX8QX1AVOFZAC
MIMX8DX1AVLFZAC
ST33HTPH2X32AHD4
STMicroelectronics
ST33HTPH2X32AHD4 by STMicroelectronics is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105°C, has a low profile of 1mm, and requires a supply voltage of 1.8V. Ideal for secure authentication applications in compact electronic devices due to its small square chip carrier package style.
ALSO OPERATES AT 3.3V NOMINAL VOLATGE
S-XQCC-N32
32
105 Cel
LCC32,.2SQ,20
NOT SPECIFIED
CRYPTOGRAPHIC AUTHENTICATOR
XAZU7EV-1FBVB900I
Xilinx
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
CAN, I2C, SPI, UART
0
S-PBGA-B900
e1
31 mm
4
900
BGA900,30X30,40
245
2.97 mm
.85 V
TIN SILVER COPPER
30
XAZU7EV-1FBVB900Q
Xilinx XAZU7EV-1FBVB900Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in automotive grade temperature range (-40 to 125 °C) and supports CAN, I2C, SPI, UART bus compatibility. The package has 900 terminals in a GRID ARRAY style suitable for surface mount applications.
MIMXRT106ACVL5B
The NXP Semiconductors MIMXRT106ACVL5B is a low-profile, fine-pitch SoC with 196 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
S-PBGA-B196
10 mm
196
BGA196,14X14,25
1.43 mm
1.26 V
.65 mm
MIMXRT1062CVL5B
The NXP Semiconductors MIMXRT1062CVL5B is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.15-1.26V. Ideal for applications requiring high-performance microcontrollers in compact designs.
SE050D2HQ1/Z01PAZ
CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N20
e4
3 mm
1
20
LCC20,.12SQ,16
.33 mm
3.6 V
NICKEL PALLADIUM GOLD SILVER
CY8C4247AZS-M485
Infineon Technologies
CY8C4247AZS-M485 by Infineon is a 64-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.71V to 1.89V. Ideal for applications requiring low-profile, fine-pitch ICs in automotive electronics meeting AEC-Q100 standards.
S-PQFP-G64
64
QFP64,.47SQ,20
AEC-Q100
PROGRAMMABLE SoC
CY8C4246AZS-M443
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G48;
S-PQFP-G48
QFP48,.35SQ,20
MIMX8MM5DVTLZCA
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B486
486
BGA486,27X27,20
1.25 mm
.95 V
OTHER
Tin/Silver (Sn/Ag)
MIMX8MM5DVTLZDA
LS1043ASE7MNLB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
S-PBGA-B621
621
HFBGA
BGA621,25X25,32
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
250
2.07 mm
.93 V
.87 V
.9 V
LS1043ASN7MNLB
LS1043ASN8KNLB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;
S-PBGA-B780
23 mm
780
BGA780,28X28,32
LS1043ASE8KNLB
LS1043ASE8MNLB
LS1043ASN7KNLB
LS1043ASN8MNLB
CY8C4147AZE-S275T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
5.5 V
PSoC
CY8C4147AZS-S255T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;
CY8C4147LQA-S443T
PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC40,.24SQ,20;
S-XQCC-N40
6 mm
LCC40,.24SQ,20
.6 mm
CY8C4147LQE-S273T
PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;
CY8C4147LQE-S473T
PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Screening Level: AEC-Q100;
CY8C4147LQS-S263T
PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
CY8C4147LQS-S283T
CY8C4147LQS-S463T
PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Length: 6 mm;
CY8C4147AZE-S445T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
CY8C4147AZE-S465T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Screening Level: AEC-Q100;
CY8C4147LQA-S243T
PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
CY8C4147LQA-S263T
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