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MCIMX233DAG4C

NXP Semiconductors

MCIMX233DAG4C by NXP Semiconductors

MCIMX233DAG4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -10 to 70 °C, with supply voltage range of 1-1.55 V. Ideal for applications requiring low profile, fine pitch ICs in commercial temperature grade environments.

Median Price

$16.796

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 393 parts In-Stock

1+ parts

$15.690

100+ parts

$10.130

1k+ parts

$10.120

10k+ parts

-

393

$15.690

$10.130

$10.120

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Arrow

USA . 50 parts In-Stock

1+ parts

$16.796

100+ parts

$11.643

1k+ parts

$10.867

10k+ parts

-

50

$16.796

$11.643

$10.867

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Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$16.937

100+ parts

$9.866

1k+ parts

-

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50

$16.937

$9.866

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DigiKey

USA . 500 parts In-Stock

1+ parts

$17.670

100+ parts

$12.114

1k+ parts

$11.389

10k+ parts

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500

$17.670

$12.114

$11.389

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EBV Elektronik

Germany . 180 parts In-Stock

1+ parts

-

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180

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Verical

USA . 50 parts In-Stock

1+ parts

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100+ parts

$9.860

1k+ parts

$9.827

10k+ parts

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50

-

$9.860

$9.827

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$12.086

100+ parts

-

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31

$12.086

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Digiode

USA . 419 parts In-Stock

1+ parts

$16.090

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419

$16.090

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Chip Stock

USA . 4,200 parts In-Stock

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4,200

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Vyrian

USA . 3,202 parts In-Stock

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3,202

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Anansix

USA . 2,592 parts In-Stock

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2,592

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Flip Electronics

USA . 301 parts In-Stock

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301

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TME

Poland . 180 parts In-Stock

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100+ parts

$12.790

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180

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$12.790

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,220 parts In-Stock

1+ parts

$12.086

100+ parts

-

1k+ parts

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10k+ parts

$11.845

2,220

$12.086

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-

$11.845

Netroflash

USA . 50 parts In-Stock

1+ parts

$12.086

100+ parts

-

1k+ parts

$11.482

10k+ parts

$11.240

50

$12.086

-

$11.482

$11.240

Ampacity Inc.

Singapore . 128 parts In-Stock

1+ parts

$13.340

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128

$13.340

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Corphita

USA . 1,086 parts In-Stock

1+ parts

$15.243

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1,086

$15.243

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$25.016

100+ parts

$22.765

1k+ parts

$20.513

10k+ parts

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5,000

$25.016

$22.765

$20.513

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Corohmni

South Africa . 50 parts In-Stock

1+ parts

$27.410

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50

$27.410

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Microchip USA

USA . 1,552 parts In-Stock

1+ parts

$50.456

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1,552

$50.456

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iodParts Technologies Inc.

India . 7,500 parts In-Stock

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7,500

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 4,296 parts In-Stock

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4,296

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UNI Independent Distributors

Spain . 1,839 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Experience innovation like never before with the MCIMX233DAG4C by NXP Semiconductors. As a leader in the semiconductor industry, NXP has crafted a cutting-edge System on Chip that offers unparalleled performance and reliability. From smart home devices to automotive applications, this versatile product is designed to meet a wide range of needs. With a focus on quality and efficiency, the MCIMX233DAG4C delivers incredible value and benefits to customers looking for top-notch solutions. Discover the endless possibilities with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.55 V

The high maximum supply voltage allows for flexibility in power requirements, accommodating a wide range of applications.

Package Shape: SQUARE

The square package shape saves space on the PCB and provides a neat and organized layout for efficient design.

No. of Terminals: 128

Having a high number of terminals allows for a greater level of connectivity and functionality in the device.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design with precise terminal spacing, enhancing overall performance and reliability.

Minimum Supply Voltage: 1 V

The low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature allows for reliable operation in cold environments, expanding the product's usability range.

Terminal Finish: TIN

The use of tin as the terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position offers a balanced distribution of connections for efficient signal routing and connectivity.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a slim profile and space-saving design, especially important in compact devices.

Width: 14 mm

The compact width dimension enables easy integration into various PCB layouts while saving space.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature ensures proper soldering and rework processes, contributing to reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering during manufacturing, ensuring strong and durable connections.

Length: 14 mm

The compact length dimension contributes to a space-efficient design without compromising functionality.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this temperature grade meets standard operating conditions for reliable performance in typical environments.

Peripheral IC Type: SYSTEM ON CHIP

The integration of peripheral IC type as a system-on-chip enhances overall device functionality and performance for versatile applications.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, ensuring optimal performance and efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and easier soldering connections for improved durability and reliability.

Nominal Supply Voltage: 1.35 V

The specified nominal supply voltage ensures stable and consistent power delivery for reliable operation in various applications.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for dense packing of terminals on the PCB, maximizing connectivity and functionality in a limited space.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX233DAG4C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX233DAG4C Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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