Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX7D7DVK10SD
NXP Semiconductors
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B488
12 mm
3
488
95 Cel
0 Cel
PLASTIC/EPOXY
TFBGA
BGA488,28X28,16
SQUARE
GRID ARRAY, THIN PROFILE, FINE PITCH
260
1.1 mm
1.25 V
1.2 V
1.225 V
YES
CMOS
OTHER
BALL
.4 mm
BOTTOM
40
SYSTEM ON CHIP
MCIMX7D7DVM10SD
MCIMX7D7DVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating at 0-95°C. It features a low profile GRID ARRAY package style, 0.75mm terminal pitch, and 1.2-1.25V supply voltage range. Ideal for applications requiring high-performance computing in compact spaces.
S-PBGA-B541
19 mm
541
LFBGA
BGA541,25X25,29
GRID ARRAY, LOW PROFILE, FINE PITCH
1.42 mm
.75 mm
MCIMX6S7CVM08AD
MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.
24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
S-PBGA-B624
e1
21 mm
624
105 Cel
-40 Cel
1.6 mm
1.5 V
1.275 V
INDUSTRIAL
TIN SILVER COPPER
.8 mm
MCIMX6U7CVM08AD
MCIMX6U7CVM08AD by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105°C. It features a low profile grid array package style and CMOS technology, suitable for industrial applications requiring high performance and reliability.
MCIMX6Y2CVK08AB
MCIMX6Y2CVK08AB by NXP Semiconductors is a 272-terminal SoC with CMOS technology, operating b/w -40 to 105 °C. It has a low profile, fine pitch grid array package and supports surface mount installation. Ideal for applications requiring uPs/uCs & Peripheral ICs in compact designs.
S-PBGA-B272
9 mm
272
BGA272,17X17,20
1.23 mm
1.325 V
.5 mm
SoC
CC1312R1F3RGZT
Texas Instruments
The Texas Instruments CC1312R1F3RGZT is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities. The package style is CHIP CARRIER with 48 terminals in a SQUARE shape, suitable for surface mount assembly in compact electronic devices.
DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF
S-PQCC-N48
e4
7 mm
30
48
85 Cel
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
81920
1 mm
3.8 V
1.8 V
3 V
NICKEL PALLADIUM GOLD
NO LEAD
QUAD
MICROPROCESSOR CIRCUIT
DLPC3437CZEZ
DLPC3437CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 201 terminals in a GRID ARRAY package style, suitable for applications requiring a supply voltage range of 1.045V to 1.155V and operating temperatures from -30°C to 85°C.
S-PBGA-B201
13 mm
201
-30 Cel
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.155 V
1.045 V
1.1 V
EFR32FG12P431F1024GL125-C
Silicon Labs
EFR32FG12P431F1024GL125-C by Silicon Labs is a 125-terminal uC with CMOS tech. Operates b/w -40 to 85 °C, with supply voltage range of 1.62-3.8 V. Ideal for System on Chip applications due to its very thin profile and fine pitch grid array package style.
S-PBGA-B125
125
BGA125,13X13,20
.94 mm
1.62 V
MCIMX6Q6AVT08AE
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
125 Cel
FBGA
GRID ARRAY, FINE PITCH
2.16 mm
AUTOMOTIVE
10AS066H2F34I1HG
Intel
Intel 10AS066H2F34I1HG is a SoC with 1152 terminals in a grid array package. It operates b/w -40°C to 100°C, utilizing TSMC technology. Ideal for applications requiring high performance and compact design due to its small form factor of 35x35mm and ball terminal pitch of 1mm.
S-PBGA-B1152
35 mm
1152
100 Cel
BGA
BGA1152,34X34,40
GRID ARRAY
3.35 mm
TSMC
LS1043AXN7PQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;
ALSO OPERATES AT 1V SUPPLY NOM
S-PBGA-B621
621
250
2.07 mm
.93 V
.87 V
.9 V
LS1023AXE8PQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
S-PBGA-B780
23 mm
780
1.03 V
.97 V
1 V
LS1043AXE8PQB
LS1023AXE7PQB
LS1043AXN8PQB
LS1023AXN8PQB
LS1023AXN7PQB
LS1043AXE7PQB
LS1043AXE8QQB
LS1043AXE8QQB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.87V to 0.93V. This IC has 780 terminals in a GRID ARRAY package style and is suitable for industrial applications.
XC7Z030-1FB484I
Xilinx
PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
S-PBGA-B484
484
BGA484,22X22,40
2.54 mm
1.05 V
.95 V
PROGRAMMABLE SYSTEM ON CHIP
XC7Z030-1SB485I
The Xilinx XC7Z030-1SB485I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
S-PBGA-B485
485
BGA485,22X22,32
2.44 mm
XC7Z030-2FB484I
PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
XC7Z030-2FF676I
The Xilinx XC7Z030-2FF676I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.
S-PBGA-B676
27 mm
676
BGA676,26X26,40
XC7Z045-2FF900I
The Xilinx XC7Z045-2FF900I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
S-PBGA-B900
31 mm
900
BGA900,30X30,40
MCIMX6X4AVM08AC
MCIMX6X4AVM08AC by NXP Semiconductors is a SoC with 529 terminals, operating b/w -40 to 125 °C. It has a low profile grid array package style and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
S-PBGA-B529
529
BGA529,23X23,32
1.52 mm
MCIMX6Y1DVK05AB
SoC; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS;
MCIMX6Y1DVM05AB
SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
S-PBGA-B289
14 mm
289
BGA289,17X17,32
1.32 mm
EFR32FG12P431F1024IM48-CR
EFR32FG12P431F1024IM48-CR by Silicon Labs is a 48-terminal, CMOS technology System on Chip with a supply voltage range of 1.62V to 3.8V. It operates b/w -40°C to 125°C and is suitable for applications requiring a compact, surface-mountable chip carrier package style with no lead terminals.
S-XQCC-N48
UNSPECIFIED
LCC48,.27SQ,20
.9 mm
EFR32FG12P231F1024GM68-C
EFR32FG12P231F1024GM68-C by Silicon Labs is a System on Chip with 68 terminals, operating from -40 to 85°C. It features a supply voltage range of 1.62V to 3.8V and utilizes CMOS technology. Ideal for applications requiring low-profile, surface-mount solutions in various industries.
S-XQCC-N68
8 mm
68
LCC68,.32SQ,16
EFR32FG12P231F512GM68-C
EFR32FG12P231F512GM68-C by Silicon Labs is a System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.62V to 3.8V. With 68 terminals in a square package style, it's ideal for IoT and wireless applications.
EFR32FG12P431F1024GM68-CR
EFR32FG12P431F1024GM68-CR by Silicon Labs is a System on Chip with 68 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.62-3.8V and uses CMOS technology. Ideal for applications requiring low-profile, surface-mount components in various electronic systems.
EFR32FG12P431F1024GM68-C
EFR32FG12P431F1024GM68-C by Silicon Labs is a System on Chip with 68 terminals, operating from -40 to 85°C. It features a supply voltage range of 1.62V to 3.8V and a compact square package style suitable for IoT devices and wireless applications.
EFR32FG12P433F1024GM68-C
EFR32FG12P433F1024GM68-C by Silicon Labs is a System on Chip with 68 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1.62V to 3.8V and uses CMOS technology. Ideal for applications requiring low-profile, surface-mount components in various electronic systems.
EFR32BG12P432F1024GM48-CR
EFR32BG12P432F1024GM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.62V to 3.8V and utilizes CMOS technology. Ideal for applications requiring low-profile, surface-mountable chips in various electronic devices.
AX8052F143-2-TX30
Onsemi
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
R-PQCC-N40
1
LCC40,.2X.28,20
3.6 V
NICKEL GOLD PALLADIUM
5 mm
AWR1642ABIGABLQ1
AWR1642ABIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and TIN SILVER COPPER finish.
S-PBGA-B161
10.4 mm
161
1572864
AEC-Q100
1.17 mm
1.32 V
1.14 V
.65 mm
AWR1642ABISABLQ1
AWR1642ABISABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14-1.32 V, making it ideal for AUTOMOTIVE applications requiring high performance in a compact GRID ARRAY package.
AWR1642ABISABLRQ1
AWR1642ABISABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package style is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and 0.65 mm pitch.
Tin/Silver/Copper (Sn/Ag/Cu)
NOT SPECIFIED
LS1088ASE7MQA
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;
BGA780,28X28,32
2.61 mm
1.055 V
.995 V
1.025 V
AX8052F131-2-TB05
AX8052F131-2-TB05 by Onsemi is a System on Chip (SoC) with a max supply voltage of 3.6V and a min supply voltage of 2.2V. It is used in industrial applications and has a package style of CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG.
S-PQCC-N28
28
LCC28,.35X.55
CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG
2.2 V
Nickel/Palladium/Gold (Ni/Pd/Au)
AX8052F131-3-TB05
AX8052F131-3-TB05 by Onsemi is a 28-terminal IC with max supply voltage of 3.6V and min of 2.2V, operating b/w -40 to 85 °C. It's a CMOS System on Chip suitable for industrial applications due to its compact size (7x5mm) and no-lead terminal form.
AX8052F131-3-TX30
The Onsemi AX8052F131-3-TX30 is a CMOS System on Chip with 40 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1.8V to 3.6V and is ideal for industrial applications requiring very thin profile ICs in a square package style.
MCIMX6Y2CVM05AAR
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
DLPC230TZDQQ1
DLPC230TZDQQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range of -40 to 105°C, with a supply voltage ranging from 1.045V to 1.155V. This device comes in a square GRID ARRAY package and is suitable for various applications requiring high-performance microprocessor circuits.
S-PBGA-B324
324
2.352 mm
MIMXRT1051CVL5A
The NXP Semiconductors MIMXRT1051CVL5A is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. With a grid array package style and 196 terminals, it's ideal for industrial applications requiring low profile and fine pitch components.
S-PBGA-B196
10 mm
196
BGA196,14X14,25
1.43 mm
1.26 V
1.15 V
AX8052F151-2-TB05
AX8052F151-2-TB05 by Onsemi is a 40-terminal IC with max supply voltage of 3.6V and min of 2.2V. Ideal for industrial applications, it operates b/w -40 to 85°C, featuring CMOS technology and system-on-chip design for compact solutions in various electronic systems.
MCIMX283DVM4BR2
MCIMX283DVM4BR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C, with supply voltage range of 1.35-1.55 V. Ideal for applications requiring low profile and fine pitch grid array packages.
IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V
70 Cel
-20 Cel
1.37 mm
1.55 V
1.35 V
1.45 V
COMMERCIAL
A7101CHTK2/T0BC2VJ
NXP Semiconductors A7101CHTK2/T0BC2VJ is a cryptographic authenticator IC with 8 terminals, operating b/w -25 to 85 °C. It has a supply voltage range of 1.62-1.98 V and CMOS technology, suitable for secure authentication applications in compact designs.
ALSO AVAILABLE WITH 3.3V NOM SUPPLY
S-PDSO-N8
4 mm
8
-25 Cel
HVSON
SOLCC8,.16,32
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
1.98 V
DUAL
CRYPTOGRAPHIC AUTHENTICATOR
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