Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;
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Other Function uPs,uCs & Peripheral ICs LS1088ASE7MQA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
LS1088ASE7MQA Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - LS1088A 05/Jun/2021
PCN Packaging - Mult Dev Pkg Seal 15/Dec/2020 All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
BAV99
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
FDLL4148
National Semiconductor
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
Itt Semiconductor
Fairchild Semiconductor
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
SMBJ18CA
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MCIMX6X1AVO08AB
MCIMX6X1AVO08AB by NXP Semiconductors is a System on Chip with 400 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.275V to 1.5V and uses CMOS technology. Ideal for automotive applications due to its low profile, fine pitch grid array package style.
MKW41Z512VHT4
The NXP Semiconductors MKW41Z512VHT4 is a CMOS microprocessor circuit with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.71 to 3.6 V. Ideal for industrial applications requiring high-performance uPs and uCs in surface-mount configurations.
ATECC608A-SSHCZ-T
Microchip Technology
Microchip ATECC608A-SSHCZ-T is a cryptographic authenticator IC with 2-5.5V supply, -40 to 85°C temp range, and TS16949 screening. Ideal for secure applications in industrial settings due to its small size and CMOS technology.
XC7Z020-2CLG484E
Xilinx
The Xilinx XC7Z020-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.
XC7Z045-1FFG900I
XC7Z045-1FFG900I by Xilinx is a System on Chip with 900 terminals, operating b/w -40 to 100°C. It features a supply voltage range of 0.95V to 1.05V and utilizes CMOS technology. Ideal for applications requiring high-performance processing in compact spaces, such as IoT devices and embedded systems.
MIMX8MQ6DVAJZAB
SoC; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3;
MCIMX357CJQ5CR2
MCIMX357CJQ5CR2 by NXP Semiconductors is a 400-terminal GRID ARRAY uP with 1.22-1.47 V supply range, ideal for SYSTEM ON CHIP applications in industrial settings. It features a low profile design, operates b/w -40 to 85 °C, and has a peak reflow temp of 260 C.
LTC4263CS#PBF
Analog Devices
LTC4263CS#PBF by Analog Devices is a CMOS microprocessor circuit with 14 terminals, operating b/w 0-70°C. It has a supply voltage range of 4.5-5.5V and peak reflow temperature of 260°C. Ideal for various applications requiring small outline surface mount packages.
XC7Z100-2FFG1156I
XC7Z100-2FFG1156I by Xilinx is a 1156-terminal, square-shaped GRID ARRAY package with a max supply voltage of 1.05V and a min operating temperature of -40°C. It is a CMOS-based SYSTEM ON CHIP (SoC) used in Other Function uPs,uCs & Peripheral ICs applications.
XC7Z010-2CLG400I
XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
FT800Q-R
FTDI
FTDI's FT800Q-R is a 48-terminal chip carrier IC with CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications. With a supply voltage range of 2.97-3.63 V, it is ideal for microprocessor circuits requiring a compact form factor and low power consumption.
CP2108-B02-GM
Silicon Labs
CP2108-B02-GM by Silicon Labs is a 64-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 3-3.6 V, making it ideal for industrial applications requiring high performance in a compact square package. With surface mount capability and a low seated height of 0.9 mm, this chip carrier suits space-constrained designs.
MSP430F6779IPZR
Texas Instruments
MSP430F6779IPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. Operating at a max frequency of 25 MHz, it's ideal for industrial applications requiring low power consumption and high performance. With I2C, SPI, and UART compatibility, this microprocessor offers versatile connectivity options in a compact FLATPACK package.
ATECC608B-MAHCZ-T
Microchip ATECC608B-MAHCZ-T is a cryptographic authenticator IC with 8 terminals, 1-Wire bus compatibility, and CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications requiring secure authentication. Package style: Small Outline, Heat Sink/Slug, Very Thin Profile.
DS8007-ENG+
Maxim Integrated
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MCIMX286CVM4BR2
MCIMX286CVM4BR2 by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.35-1.55V and uses CMOS technology. This low-profile, fine-pitch IC is ideal for industrial applications requiring high performance in a compact form factor.
ATWINC1500-MR210PB1952-T
Microchip's ATWINC1500-MR210PB1952-T is a CMOS network controller with 28 terminals, operating at 2.7-3.6V, ideal for industrial applications. With a compact rectangular package style and surface mount design, it offers a wide temperature range from -40 to 85°C for versatile use in various electronic systems.
CC2540F256RHAR
CC2540F256RHAR by Texas Instruments is a 40-terminal microprocessor circuit with 8192 RAM bytes. Operating at -40 to 85 °C, it supports SPI, USART, and USB bus compatibility. Ideal for industrial applications requiring comparators and timers in a compact square chip carrier package.
SE050A1HQ1/Z01SGZ
SE050A1HQ1/Z01SGZ by NXP Semiconductors is a cryptographic authenticator IC with CMOS technology. It operates b/w -25°C to 85°C, with supply voltage ranging from 1.62V to 3.6V. This quad-terminal chip carrier is ideal for secure applications requiring high-level authentication and encryption.
XC7Z014S-2CLG400I
The Xilinx XC7Z014S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.
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LS1021AXN7KQB
LS1021AXN7KQB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates b/w 0.97V to 1.03V, featuring CMOS technology and a peak reflow temperature of 260°C. Ideal for applications requiring high performance and compact design.
Freescale Semiconductor
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
LS1021ASN7KQB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;
LS1021AXE7KQB
LS1021AXE7KQB by NXP Semiconductors is a microprocessor circuit with a package style of grid array and heat sink/slug. It has a max supply voltage of 1.03V and a min supply voltage of 0.97V. This IC is commonly used in applications requiring high-performance processing capabilities.
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
LS1046AXE8Q1A
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
LS1021ASE7HNB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 2.07 mm;
LS1043AXE8QQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
LS1043AXE7MQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Terminal Finish: TIN SILVER COPPER;
LS1023ASN7KQB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
LS1023AXE7MQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; Maximum Operating Temperature: 105 Cel;
LS1023AXE7PQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;
LS1021AXE7HNB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
LS1023AXE7QQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Width: 21 mm;
LS1018A
SYSTEM ON CHIP;
LS1021ASE7KQB
LS1023AXE8PQB
LS1017A
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