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MCIMX283DVM4BR2

NXP Semiconductors

MCIMX283DVM4BR2 by NXP Semiconductors

MCIMX283DVM4BR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C, with supply voltage range of 1.35-1.55 V. Ideal for applications requiring low profile and fine pitch grid array packages.

Median Price

$16.088

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,634 parts In-Stock

1+ parts

$25.050

100+ parts

$17.510

1k+ parts

$16.151

10k+ parts

-

1,634

$25.050

$17.510

$16.151

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Future Electronics

Canada . 2,000 parts In-Stock

1+ parts

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$13.600

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2,000

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$13.600

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Rochester

USA . 1,000 parts In-Stock

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-

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$14.300

1k+ parts

$12.790

10k+ parts

$12.040

1,000

-

$14.300

$12.790

$12.040

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$17.875

1k+ parts

$15.988

10k+ parts

$15.050

1,000

-

$17.875

$15.988

$15.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,480 parts In-Stock

1+ parts

$12.588

100+ parts

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4,480

$12.588

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-

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Nova Conductors

Japan . 600 parts In-Stock

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$15.160

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600

$15.160

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Chip Stock

USA . 23,042 parts In-Stock

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23,042

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Vyrian

USA . 4,007 parts In-Stock

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Anansix

USA . 2,251 parts In-Stock

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2,251

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IBS Electronics

USA . 2,000 parts In-Stock

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$19.074

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$19.074

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NAC Semi

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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$17.270

10k+ parts

$16.120

2,000

-

-

$17.270

$16.120

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 676 parts In-Stock

1+ parts

$11.260

100+ parts

$10.978

1k+ parts

$10.922

10k+ parts

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676

$11.260

$10.978

$10.922

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Corphita

USA . 2,678 parts In-Stock

1+ parts

$11.925

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2,678

$11.925

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Continental Prestige Electronics

USA . 2,007 parts In-Stock

1+ parts

$15.160

100+ parts

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10k+ parts

$14.857

2,007

$15.160

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$14.857

Corohmni

South Africa . 122 parts In-Stock

1+ parts

$15.835

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122

$15.835

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Ampacity Inc.

Singapore . 685 parts In-Stock

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$24.510

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685

$24.510

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Microchip USA

USA . 3,877 parts In-Stock

1+ parts

$38.988

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3,877

$38.988

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Aztec Data Supply Inc.

USA . 1,828 parts In-Stock

1+ parts

$42.904

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1,828

$42.904

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Lixinc

USA . 19,131 parts In-Stock

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Perfect Parts

USA . 13,440 parts In-Stock

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UNI Independent Distributors

Spain . 7,860 parts In-Stock

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Argo Parts USA

USA . 4,577 parts In-Stock

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4,577

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$14.857

1k+ parts

$14.402

10k+ parts

$14.099

1,000

-

$14.857

$14.402

$14.099

Overview

Enhance your electronic designs with the MCIMX283DVM4BR2 by NXP Semiconductors, a cutting-edge peripheral IC that offers unparalleled performance and reliability. Manufactured by industry leader NXP Semiconductors, this versatile system on chip caters to a wide range of applications, providing customers with unmatched value and innovation. With its advanced technology and high-quality components, the MCIMX283DVM4BR2 ensures optimal functionality and seamless integration, making it the ideal choice for your next project. Experience the difference with NXP Semiconductors and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for mass production at a lower cost.

Surface Mount: YES

This feature allows for easier and more efficient PCB assembly, saving time and reducing labor costs.

Maximum Supply Voltage: 1.55 V

With a high maximum supply voltage, this product can handle a wide range of power input levels, making it versatile for various applications.

Package Shape: SQUARE

The square shape allows for efficient use of board space, maximizing the number of components that can be placed on a PCB.

No. of Terminals: 289

The high number of terminals provides extensive connectivity options, making the product suitable for complex circuit designs.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style ensures a compact design, reducing the overall size of the product and enabling it to fit in smaller devices.

Minimum Supply Voltage: 1.35 V

With a low minimum supply voltage, this product can operate efficiently even with limited power sources, making it energy-efficient.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions, increasing its durability.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the product to function in cold environments without performance issues.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections for the product.

Terminal Position: BOTTOM

The terminal position at the bottom of the package simplifies the PCB layout and allows for easier routing of traces.

Maximum Seated Height: 1.37 mm

The low seated height saves space on the PCB, making the product ideal for compact electronic devices.

Width: 14 mm

The width of 14mm offers a balance between size and functionality, making the product versatile for a variety of applications.

Maximum Time At Peak Reflow Temperature (s): 40

This specification ensures precise soldering during assembly, resulting in reliable connections and improved product performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust solder joints, increasing the product's reliability in extreme conditions.

Length: 14 mm

The length of 14mm complements the width and height dimensions, maintaining a compact form factor for the product.

Temperature Grade: COMMERCIAL

This temperature grade ensures the product meets industry standards for commercial applications, making it a reliable choice for various projects.

Peripheral IC Type: SYSTEM ON CHIP

This advanced type of peripheral IC integrates multiple functions onto a single chip, simplifying the design and reducing the overall footprint of the product.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Terminal Form: BALL

The ball terminal form provides secure electrical connections, minimizing the risk of signal loss or intermittent faults in the product.

Nominal Supply Voltage: 1.45 V

The nominal supply voltage is optimized for efficient performance, ensuring stable operation without compromising power efficiency.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density packaging, enabling more components to be placed on the PCB for advanced functionality.

Moisture Sensitivity Level (MSL): 3

This moisture sensitivity level indicates the product can withstand moderate exposure to humidity without compromising its reliability, making it suitable for various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX283DVM4BR2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.37 mm

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX283DVM4BR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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