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MCIMX283CVM4CR2

NXP Semiconductors

MCIMX283CVM4CR2 by NXP Semiconductors

MCIMX283CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. Ideal for applications requiring low profile and fine pitch grid array packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 2,399 parts In-Stock

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Digiode

USA . 1,971 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Anansix

USA . 295 parts In-Stock

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AZTECH Wire

Italy . 416 parts In-Stock

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$14.650

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One Stop Electronics

USA . 1,504 parts In-Stock

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Ampacity Inc.

Singapore . 767 parts In-Stock

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Corohmni

South Africa . 112 parts In-Stock

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Microchip USA

USA . 2,478 parts In-Stock

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UNI Independent Distributors

Spain . 5,323 parts In-Stock

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Corphita

USA . 3,438 parts In-Stock

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Netroflash

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Overview

Discover the cutting-edge innovation of the MCIMX283CVM4CR2 by NXP Semiconductors, a top-tier manufacturer renowned for its quality and reliability. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide array of applications for various industries. With a focus on value and customer benefits, this product provides exceptional performance, efficiency, and functionality that surpasses the competition. Experience the advantages firsthand and unlock new possibilities with the MCIMX283CVM4CR2.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product reliable for long-term use.

Surface Mount - YES

This allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage - 1.55 V

With a relatively high maximum supply voltage, this product can handle power fluctuations effectively.

Package Shape - SQUARE

The square shape allows for space-efficient arrangement on the circuit board, maximizing utilization of available space.

No. of Terminals - 289

Having a high number of terminals enables a wide range of connections and functionalities, making the product versatile.

Minimum Operating Temperature - -40 °C

The ability to operate at low temperatures ensures reliable performance in various environmental conditions.

Maximum Operating Temperature - 85 °C

The high maximum operating temperature range allows for usage in industrial settings where heat levels can fluctuate.

Technology - CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX283CVM4CR2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.37 mm

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX283CVM4CR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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