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EFR32MG1V132F256GM32-C0R

Silicon Labs

EFR32MG1V132F256GM32-C0R by Silicon Labs

EFR32MG1V132F256GM32-C0R by Silicon Labs is a 32-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.85 to 3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.

Median Price

$6.465

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DigiKey

USA . 9,800 parts In-Stock

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Verical

USA . 7,500 parts In-Stock

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Flip Electronics

USA . 9,800 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 436 parts In-Stock

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AZTECH Wire

Italy . 864 parts In-Stock

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Netroflash

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Corphita

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Overview

Discover a world of possibilities with the EFR32MG1V132F256GM32-C0R by Silicon Labs. This innovative product offers unmatched quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for various applications in the realm of Other Function uPs,uCs & Peripheral ICs, this chip carrier boasts a very thin profile and advanced CMOS technology. Experience the benefits of its wide supply voltage range, low operating temperatures, and compact square shape. Elevate your projects with the exceptional value and performance that only Silicon Labs can deliver.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure mounting on a PCB, making installation and assembly efficient.

Maximum Supply Voltage: 3.8 V

Support for a high maximum supply voltage allows for versatile applications and compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape offers efficient use of board space and easy alignment during assembly.

No. of Terminals: 32

A higher number of terminals provide greater connectivity options and flexibility for interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

These package styles offer thermal management capabilities along with a compact size, making it ideal for space-constrained applications.

Minimum Supply Voltage: 1.85 V

Support for a low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures the product can operate in extreme cold conditions without malfunctioning.

Terminal Position: QUAD

Quad terminal position provides stable and secure connection points for enhanced reliability in circuitry.

Maximum Seated Height: 0.9 mm

Low maximum seated height contributes to a slim profile and compact design, suitable for size-constrained applications.

Width: 5 mm

Compact width dimension allows for easy integration into various electronic devices or systems without occupying excessive space.

Length: 5 mm

Short length dimension contributes to a space-saving design and facilitates installation in small areas or tight spaces.

Peripheral IC Type: SoC

System-on-Chip integration simplifies the design, reduces the footprint, and enhances overall performance in various applications.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operation, and compatibility with a wide range of digital systems.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of soldering errors and enhances reliability in connectivity in modern electronic assemblies.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources in typical applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on a PCB, enabling compact designs and efficient use of space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs EFR32MG1V132F256GM32-C0R attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Silicon Labs

Specs

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.85 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

SoC

Trade Compliance

EFR32MG1V132F256GM32-C0R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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