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SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 347

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
AM4377BZDNA80 by Texas Instruments

AM4377BZDNA80

Texas Instruments

AM4377BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring a supply voltage range of 1.21-1.326V and peak reflow temperature of 260°C.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4377BZDND100 by Texas Instruments

AM4377BZDND100

Texas Instruments

AM4377BZDND100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package style, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance computing in compact spaces.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4377BZDND80 by Texas Instruments

AM4377BZDND80

Texas Instruments

AM4377BZDND80 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package style, 0.65mm terminal pitch, and 1.21-1.326V supply voltage range. Ideal for industrial applications requiring high-performance computing in compact spaces.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDN100 by Texas Instruments

AM4378BZDN100

Texas Instruments

AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDN80 by Texas Instruments

AM4378BZDN80

Texas Instruments

AM4378BZDN80 by Texas Instruments is a CMOS system-on-chip with a max supply voltage of 1.326V and a min operating temperature of 0°C. It is used in applications requiring low-profile, fine-pitch grid array packages with 491 terminals.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDNA100 by Texas Instruments

AM4378BZDNA100

Texas Instruments

AM4378BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDNA80 by Texas Instruments

AM4378BZDNA80

Texas Instruments

AM4378BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. Ideal for applications requiring low profile and fine pitch package style in industrial settings.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDND100 by Texas Instruments

AM4378BZDND100

Texas Instruments

AM4378BZDND100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDND80 by Texas Instruments

AM4378BZDND80

Texas Instruments

AM4378BZDND80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 90 °C and has a supply voltage range of 1.21V to 1.326V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4379BZDNA100 by Texas Instruments

AM4379BZDNA100

Texas Instruments

AM4379BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance uPs/uCs & peripheral ICs in compact form factors.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4379BZDNA80 by Texas Instruments

AM4379BZDNA80

Texas Instruments

AM4379BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

MCIMX6G0DVM05AA by NXP Semiconductors

MCIMX6G0DVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1AVM05AA by NXP Semiconductors

MCIMX6G1AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1AVM07AA by NXP Semiconductors

MCIMX6G1AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM05AA by NXP Semiconductors

MCIMX6G2AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM07AA by NXP Semiconductors

MCIMX6G2AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1CVM05AA by NXP Semiconductors

MCIMX6G1CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

e2

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

Tin/Silver (Sn/Ag)

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2CVK05AA by NXP Semiconductors

MCIMX6G2CVK05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6G2CVM05AA by NXP Semiconductors

MCIMX6G2CVM05AA

NXP Semiconductors

MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G3CVM05AA by NXP Semiconductors

MCIMX6G3CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX7D3DVK10SC by NXP Semiconductors

MCIMX7D3DVK10SC

NXP Semiconductors

MCIMX7D3DVK10SC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage ranging from 1.045-1.25 V. With 488 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SC by NXP Semiconductors

MCIMX7D3EVK10SC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D7DVM10SC by NXP Semiconductors

MCIMX7D7DVM10SC

NXP Semiconductors

MCIMX7D7DVM10SC by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating b/w 0-95°C. It has a supply voltage range of 1.045-1.25 V and uses BALL terminal form. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

S-PBGA-B541

19 mm

3

541

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,30

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

LS1043ASE7MNLA by NXP Semiconductors

LS1043ASE7MNLA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

AM4372BZDN60 by Texas Instruments

AM4372BZDN60

Texas Instruments

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4372BZDN80 by Texas Instruments

AM4372BZDN80

Texas Instruments

AM4372BZDN80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4372BZDNA60 by Texas Instruments

AM4372BZDNA60

Texas Instruments

AM4372BZDNA60 by Texas Instruments is a System on Chip with 491 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.056V to 1.144V. Ideal for industrial applications requiring high performance and reliability in compact designs.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.144 V

1.056 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4372BZDNA80 by Texas Instruments

AM4372BZDNA80

Texas Instruments

AM4372BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.21V to 1.326V. This low profile, fine pitch GRID ARRAY package with 491 terminals is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

MCIMX6Y0CVM05AA by NXP Semiconductors

MCIMX6Y0CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6Y0DVM05AA by NXP Semiconductors

MCIMX6Y0DVM05AA

NXP Semiconductors

MCIMX6Y0DVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6Y7DVK05AA by NXP Semiconductors

MCIMX6Y7DVK05AA

NXP Semiconductors

MCIMX6Y7DVK05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

AM5716AABCDA by Texas Instruments

AM5716AABCDA

Texas Instruments

The Texas Instruments AM5716AABCDA is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCDEA by Texas Instruments

AM5716AABCDEA

Texas Instruments

AM5716AABCDEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCD by Texas Instruments

AM5716AABCD

Texas Instruments

AM5716AABCD by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, has a supply voltage range of 1.11-1.2V, and features a fine pitch grid array package style. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXA by Texas Instruments

AM5716AABCXA

Texas Instruments

AM5716AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXEA by Texas Instruments

AM5716AABCXEA

Texas Instruments

AM5716AABCXEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCX by Texas Instruments

AM5716AABCX

Texas Instruments

AM5716AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 90°C, with supply voltage ranging from 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXA by Texas Instruments

AM5718AABCXA

Texas Instruments

AM5718AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring high-speed processing in compact form factor.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCX by Texas Instruments

AM5718AABCX

Texas Instruments

AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MCIMX6Y2DVM09AA by NXP Semiconductors

MCIMX6Y2DVM09AA

NXP Semiconductors

MCIMX6Y2DVM09AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.375-1.5 V. This IC has 289 terminals in a GRID ARRAY package, suitable for various uP and uC applications.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.375 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6Y7DVM09AA by NXP Semiconductors

MCIMX6Y7DVM09AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.375 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

XC7Z007S-1CLG225C by Xilinx

XC7Z007S-1CLG225C

Xilinx

XC7Z007S-1CLG225C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95V to 1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B225

13 mm

225

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z007S-1CLG225I by Xilinx

XC7Z007S-1CLG225I

Xilinx

XC7Z007S-1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various embedded applications.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z007S-1CLG400C by Xilinx

XC7Z007S-1CLG400C

Xilinx

The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B400

17 mm

400

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z007S-2CLG225E by Xilinx

XC7Z007S-2CLG225E

Xilinx

The Xilinx XC7Z007S-2CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile and fine pitch grid array packages.

S-PBGA-B225

13 mm

225

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z007S-2CLG225I by Xilinx

XC7Z007S-2CLG225I

Xilinx

XC7Z007S-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various uPs and uCs applications.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z007S-2CLG400E by Xilinx

XC7Z007S-2CLG400E

Xilinx

The Xilinx XC7Z007S-2CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components.

S-PBGA-B400

17 mm

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z007S-2CLG400I by Xilinx

XC7Z007S-2CLG400I

Xilinx

The Xilinx XC7Z007S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low profile chip has 400 terminals and is ideal for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP