Loading...

SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 347

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX280DVM4CR by NXP Semiconductors

MCIMX280DVM4CR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283CVM4CR2 by NXP Semiconductors

MCIMX283CVM4CR2

NXP Semiconductors

MCIMX283CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. Ideal for applications requiring low profile and fine pitch grid array packages.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283DVM4CR2 by NXP Semiconductors

MCIMX283DVM4CR2

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286CVM4CR2 by NXP Semiconductors

MCIMX286CVM4CR2

NXP Semiconductors

MCIMX286CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286DVM4CR by NXP Semiconductors

MCIMX286DVM4CR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MIMX8DX6AVLFZAC by NXP Semiconductors

MIMX8DX6AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8DX6AVLFZAC is a System on Chip with 609 terminals, operating temperature range of -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and is designed for automotive applications requiring high performance in a compact form factor.

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX6AVLFZAC by NXP Semiconductors

MIMX8QX6AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8QX6AVLFZAC is a System on Chip with 609 terminals, operating at -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and uses CMOS technology. Ideal for automotive applications requiring high performance in a compact grid array package style.

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6S6AVM08ACR by NXP Semiconductors

MCIMX6S6AVM08ACR

NXP Semiconductors

MCIMX6S6AVM08ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with a supply voltage range of 1.275V to 1.5V. Ideal for automotive applications due to its low profile and fine pitch package style.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

66AK2G12ABYT100 by Texas Instruments

66AK2G12ABYT100

Texas Instruments

66AK2G12ABYT100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 0.95V to 1.05V, making it ideal for automotive applications. This package features a grid array with 625 terminals in a low profile, fine pitch design for surface mount assembly.

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

MCIMX286DVM4BR by NXP Semiconductors

MCIMX286DVM4BR

NXP Semiconductors

MCIMX286DVM4BR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35-1.55 V, making it ideal for low-power applications in various electronic devices.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

EFR32MG13P732F512IM48-DR by Silicon Labs

EFR32MG13P732F512IM48-DR

Silicon Labs

EFR32MG13P732F512IM48-DR by Silicon Labs is a System on Chip with 48 terminals, operating from -40 to 125 °C. It has a supply voltage range of 1.62V to 3.8V and uses CMOS technology. This chip is ideal for applications requiring low power consumption in compact designs.

S-XQCC-N48

7 mm

48

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.62 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SYSTEM ON CHIP

EFR32MG13P733F512IM48-D by Silicon Labs

EFR32MG13P733F512IM48-D

Silicon Labs

EFR32MG13P733F512IM48-D by Silicon Labs is a System on Chip with 48 terminals, operating from -40 to 125°C. It has a supply voltage range of 1.62V to 3.8V and uses CMOS technology. Ideal for applications requiring low-profile, surface-mount components in various electronic devices.

S-XQCC-N48

e3

7 mm

2

48

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.8 V

1.62 V

3.3 V

YES

CMOS

MATTE TIN

NO LEAD

.5 mm

QUAD

40

7 mm

SYSTEM ON CHIP

MCIMX233DAG4C by NXP Semiconductors

MCIMX233DAG4C

NXP Semiconductors

MCIMX233DAG4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -10 to 70 °C, with supply voltage range of 1-1.55 V. Ideal for applications requiring low profile, fine pitch ICs in commercial temperature grade environments.

S-PQFP-G128

e3

14 mm

3

128

70 Cel

-10 Cel

PLASTIC/EPOXY

LFQFP

QFP128,.63SQ,16

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

1.55 V

1 V

1.35 V

YES

CMOS

COMMERCIAL

TIN

GULL WING

.4 mm

QUAD

40

14 mm

SYSTEM ON CHIP

MIMX8DX2AVLFZAC by NXP Semiconductors

MIMX8DX2AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8DX2AVOFZAC by NXP Semiconductors

MIMX8DX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8DX5AVLFZAC by NXP Semiconductors

MIMX8DX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX2AVLFZAC by NXP Semiconductors

MIMX8QX2AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8QX2AVLFZAC is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.05-1.15 V, making it ideal for automotive applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX2AVOFZAC by NXP Semiconductors

MIMX8QX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8QX1AVLFZAC by NXP Semiconductors

MIMX8QX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX5AVLFZAC by NXP Semiconductors

MIMX8QX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8DX1AVOFZAC by NXP Semiconductors

MIMX8DX1AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8QX1AVOFZAC by NXP Semiconductors

MIMX8QX1AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8DX1AVLFZAC by NXP Semiconductors

MIMX8DX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

EFR32MG22C224F512GN32-C by Silicon Labs

EFR32MG22C224F512GN32-C

Silicon Labs

SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD;

e4

2

260

NICKEL PALLADIUM GOLD

40

SYSTEM ON CHIP

LS1043ASE7MNLB by NXP Semiconductors

LS1043ASE7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN7MNLB by NXP Semiconductors

LS1043ASN7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8KNLB by NXP Semiconductors

LS1043ASN8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8KNLB by NXP Semiconductors

LS1043ASE8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8MNLB by NXP Semiconductors

LS1043ASE8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASN7KNLB by NXP Semiconductors

LS1043ASN7KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8MNLB by NXP Semiconductors

LS1043ASN8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ABE9MQB by NXP Semiconductors

LS1043ABE9MQB

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ACE9MQB by NXP Semiconductors

LS1043ACE9MQB

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

EFR32MG21B010F512IM32-B by Silicon Labs

EFR32MG21B010F512IM32-B

Silicon Labs

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

4 mm

32

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.16SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.71 V

3 V

YES

CMOS

AUTOMOTIVE

NO LEAD

.4 mm

QUAD

4 mm

SYSTEM ON CHIP

MCIMX536AVP8C2 by NXP Semiconductors

MCIMX536AVP8C2

NXP Semiconductors

MCIMX536AVP8C2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.05V to 1.15V. Ideal for automotive applications due to AEC-Q100 screening level and fine pitch grid array package style.

S-PBGA-B529

e2

19 mm

3

529

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

AEC-Q100

1.85 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX6U6AVM08ADR by NXP Semiconductors

MCIMX6U6AVM08ADR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMXRT105SCVL5B by NXP Semiconductors

MIMXRT105SCVL5B

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE; Width: 10 mm;

S-PBGA-B196

10 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.52 mm

1.26 V

1.15 V

YES

CMOS

BALL

.65 mm

BOTTOM

10 mm

SYSTEM ON CHIP

MIMXRT1051CVJ5BR by NXP Semiconductors

MIMXRT1051CVJ5BR

NXP Semiconductors

The NXP Semiconductors MIMXRT1051CVJ5BR is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring a low profile, fine pitch package style and grid array configuration.

S-PBGA-B196

12 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

SYSTEM ON CHIP

CYW54907KWBGT by Infineon Technologies

CYW54907KWBGT

Infineon Technologies

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 316; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;

MINIMUM BUMP PITCH IS CONSIDERED

R-PBGA-B316

5.848 mm

316

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

BGA316(UNSPEC)

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.33 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

BALL

.2 mm

BOTTOM

4.907 mm

SYSTEM ON CHIP

ATSAM4C16CB-AUT by Microchip Technology

ATSAM4C16CB-AUT

Microchip Technology

Microchip Technology's ATSAM4C16CB-AUT is a 100-terminal uC with CMOS tech. Operates b/w -40 to 85 °C, with supply voltage range of 1.08-1.32 V. Ideal for System on Chip applications due to its thin profile and fine pitch design.

S-PQFP-G100

14 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.2 mm

1.32 V

1.08 V

1.2 V

YES

CMOS

GULL WING

.5 mm

QUAD

14 mm

SYSTEM ON CHIP

ATSAM4C8CB-AUT by Microchip Technology

ATSAM4C8CB-AUT

Microchip Technology

Microchip Technology's ATSAM4C8CB-AUT is a 100-terminal, CMOS System on Chip with 1.08-1.32 V supply range and -40 to 85°C operating temp. Ideal for applications requiring a thin profile, fine pitch package such as IoT devices and embedded systems.

S-PQFP-G100

14 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.2 mm

1.32 V

1.08 V

1.2 V

YES

CMOS

GULL WING

.5 mm

QUAD

14 mm

SYSTEM ON CHIP

ATSAM4C16CB-AUTR by Microchip Technology

ATSAM4C16CB-AUTR

Microchip Technology

Microchip Technology's ATSAM4C16CB-AUTR is a 100-terminal, CMOS technology System on Chip with 1.08-1.32 V supply voltage range. Ideal for applications requiring high performance in a compact form factor with operating temperatures from -40 to 85 °C.

S-PQFP-G100

14 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.2 mm

1.32 V

1.08 V

1.2 V

YES

CMOS

GULL WING

.5 mm

QUAD

14 mm

SYSTEM ON CHIP

ATSAM4C8CB-AUTR by Microchip Technology

ATSAM4C8CB-AUTR

Microchip Technology

Microchip Technology's ATSAM4C8CB-AUTR is a SYSTEM ON CHIP with 100 terminals in a FLATPACK package. It operates b/w -40 to 85 °C with supply voltage range of 1.08V to 1.32V, making it ideal for low-power applications in various electronic devices.

S-PQFP-G100

14 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.2 mm

1.32 V

1.08 V

1.2 V

YES

CMOS

GULL WING

.5 mm

QUAD

14 mm

SYSTEM ON CHIP

AM6421BSFGHAALV by Texas Instruments

AM6421BSFGHAALV

Texas Instruments

AM6421BSFGHAALV by Texas Instruments is a System on Chip with 441 terminals in a fine pitch grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring high-performance microcontrollers in compact designs.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

17.2 mm

SYSTEM ON CHIP

AM6441BSFFHAALV by Texas Instruments

AM6441BSFFHAALV

Texas Instruments

AM6441BSFFHAALV by Texas Instruments is a SYSTEM ON CHIP with 441 terminals in a GRID ARRAY package. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch and CMOS technology.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6442BSFGHAALV by Texas Instruments

AM6442BSFGHAALV

Texas Instruments

AM6442BSFGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates at speeds up to 1000 rpm and has a max supply voltage of 0.79 V. This IC is ideal for applications requiring high performance in a compact form factor, such as mobile devices and IoT products.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

1000 rpm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6411BKCGHAALV by Texas Instruments

AM6411BKCGHAALV

Texas Instruments

AM6411BKCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring fine pitch and ball terminal form technology.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP

AM6412BSCGHAALV by Texas Instruments

AM6412BSCGHAALV

Texas Instruments

AM6412BSCGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 441 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance in compact spaces.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

S-PBGA-B441

17.2 mm

3

441

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA441,21X21,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.652 mm

.79 V

.715 V

.75 V

YES

CMOS

BALL

.8 mm

BOTTOM

17.2 mm

SYSTEM ON CHIP