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SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 347

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z100-1FFG1156I by Xilinx

XC7Z100-1FFG1156I

Xilinx

The Xilinx XC7Z100-1FFG1156I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 1156 terminals, it's ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B1156

35 mm

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

GRID ARRAY

3.1 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

SYSTEM ON CHIP

XC7Z100-1FFG900I by Xilinx

XC7Z100-1FFG900I

Xilinx

The Xilinx XC7Z100-1FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-2FFG1156I by Xilinx

XC7Z100-2FFG1156I

Xilinx

XC7Z100-2FFG1156I by Xilinx is a 1156-terminal, square-shaped GRID ARRAY package with a max supply voltage of 1.05V and a min operating temperature of -40°C. It is a CMOS-based SYSTEM ON CHIP (SoC) used in Other Function uPs,uCs & Peripheral ICs applications.

S-PBGA-B1156

35 mm

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

GRID ARRAY

3.1 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

SYSTEM ON CHIP

XC7Z100-2FFG900I by Xilinx

XC7Z100-2FFG900I

Xilinx

XC7Z100-2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

OMAP3503DCUS72 by Texas Instruments

OMAP3503DCUS72

Texas Instruments

OMAP3503DCUS72 by Texas Instruments is a System on Chip with 423 terminals, operating at 0-90°C. It has a supply voltage range of 1.71-1.91V and uses CMOS technology. This IC is suitable for applications requiring low profile, fine pitch packages in various electronic devices.

S-PBGA-B423

16 mm

423

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.1,1.2,1.8,1.8/3

Not Qualified

1.4 mm

Graphics Processors

1.91 V

1.71 V

1.8 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

16 mm

SYSTEM ON CHIP

OMAP3503DCUSA by Texas Instruments

OMAP3503DCUSA

Texas Instruments

OMAP3503DCUSA by Texas Instruments is a 423-terminal IC with max supply voltage of 1.91V and operating temp up to 105°C. Ideal for industrial applications, it features a system-on-chip design, CMOS technology, and low-profile grid array package style.

S-PBGA-B423

e1

16 mm

4

423

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.1,1.2,1.8,1.8/3

Not Qualified

1.4 mm

Graphics Processors

1.91 V

1.71 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

SYSTEM ON CHIP

OMAP3515DCBBA by Texas Instruments

OMAP3515DCBBA

Texas Instruments

OMAP3515DCBBA by Texas Instruments is a System on Chip with 515 terminals, operating at -40 to 105°C. It has a supply voltage range of 1.71-1.89V and uses CMOS technology for industrial applications requiring high performance in a compact square package.

S-PBGA-B515

e1

12 mm

3

515

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA515,28X28,16

SQUARE

GRID ARRAY

260

1.1,1.2,1.8,1.8/3

Not Qualified

.9 mm

Graphics Processors

1.89 V

1.71 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

12 mm

SYSTEM ON CHIP

OMAP3515DCBC by Texas Instruments

OMAP3515DCBC

Texas Instruments

OMAP3515DCBC by Texas Instruments is a System on Chip with 515 terminals, operating at 0-90°C. It features supply voltages of 1.1V, 1.8V, and 3.3V for various applications in Other Function uPs,uCs & Peripheral ICs. The package style is grid array with a terminal pitch of 0.5mm, making it suitable for compact electronic devices.

S-PBGA-B515

e1

12 mm

3

515

90 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

BGA515,21X21,25

SQUARE

GRID ARRAY

260

1.1,1.8,3.3

Not Qualified

.9 mm

Graphics Processors

1.89 V

1.71 V

1.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

12 mm

SYSTEM ON CHIP

OMAP3515DCUS by Texas Instruments

OMAP3515DCUS

Texas Instruments

OMAP3515DCUS by Texas Instruments is a System on Chip with 423 terminals, operating at 0-90°C. It features supply voltages of 1.1V, 1.8V, and 3.3V for various applications in Other Function uPs,uCs & Peripheral ICs requiring a compact GRID ARRAY package style with 0.65mm terminal pitch.

S-PBGA-B423

16 mm

423

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY

NOT SPECIFIED

1.1,1.8,3.3

Not Qualified

1.4 mm

Graphics Processors

1.89 V

1.71 V

1.8 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

16 mm

SYSTEM ON CHIP

LS1088ASE7PTA by NXP Semiconductors

LS1088ASE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASE7Q1A by NXP Semiconductors

LS1088ASE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.025 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASN7MQA by NXP Semiconductors

LS1088ASN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.025 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASN7PTA by NXP Semiconductors

LS1088ASN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7MQA by NXP Semiconductors

LS1088AXE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7PTA by NXP Semiconductors

LS1088AXE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7Q1A by NXP Semiconductors

LS1088AXE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7MQA by NXP Semiconductors

LS1088AXN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7PTA by NXP Semiconductors

LS1088AXN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7Q1A by NXP Semiconductors

LS1088AXN7Q1A

NXP Semiconductors

LS1088AXN7Q1A by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 0.995V to 1.055V. Ideal for applications requiring high performance and compact design.

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MCIMX6G2CVK05AB by NXP Semiconductors

MCIMX6G2CVK05AB

NXP Semiconductors

MCIMX6G2CVK05AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15V to 1.3V. This IC has 272 terminals and is ideal for industrial applications requiring low profile, fine pitch components.

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6G3CVK05AB by NXP Semiconductors

MCIMX6G3CVK05AB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6S8DVM10AD by NXP Semiconductors

MCIMX6S8DVM10AD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U5DVM10AD by NXP Semiconductors

MCIMX6U5DVM10AD

NXP Semiconductors

MCIMX6U5DVM10AD by NXP Semiconductors is a System on Chip with 624 terminals, operating at 0-95°C. It features a low profile grid array package style, 0.8mm terminal pitch, and tin silver copper finish. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U8DVM10AD by NXP Semiconductors

MCIMX6U8DVM10AD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6X1CVO08AC by NXP Semiconductors

MCIMX6X1CVO08AC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

24MHZ NOMINAL FREQUENCY AVAILABLE

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.275 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MCIMX6X3CVK08AC by NXP Semiconductors

MCIMX6X3CVK08AC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

24MHZ NOMINAL FREQUENCY AVAILABLE

S-PBGA-B400

e1

14 mm

3

400

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.5 V

1.275 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

66AK2G12ABY100 by Texas Instruments

66AK2G12ABY100

Texas Instruments

The Texas Instruments 66AK2G12ABY100 is a System on Chip with CMOS technology. It operates b/w 0-70°C, with supply voltage range of 0.95-1.05V. With 625 terminals in a low profile grid array package, it's ideal for various commercial applications requiring high performance and integration capabilities.

S-PBGA-B625

e1

21 mm

3

625

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABY60 by Texas Instruments

66AK2G12ABY60

Texas Instruments

The Texas Instruments 66AK2G12ABY60 is a System on Chip with CMOS technology. It operates b/w 0-70°C, has a supply voltage range of 0.855-0.945V, and features a grid array package with 625 terminals. Ideal for applications requiring low profile, fine pitch ICs in commercial-grade environments.

S-PBGA-B625

e1

21 mm

3

625

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA100E by Texas Instruments

66AK2G12ABYA100E

Texas Instruments

The Texas Instruments 66AK2G12ABYA100E is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.95V to 1.05V. With 625 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA100 by Texas Instruments

66AK2G12ABYA100

Texas Instruments

The Texas Instruments 66AK2G12ABYA100 is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.95V to 1.05V. With 625 terminals in a low profile grid array package, it's ideal for industrial applications requiring high performance and compact design.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA60E by Texas Instruments

66AK2G12ABYA60E

Texas Instruments

The Texas Instruments 66AK2G12ABYA60E is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.855V to 0.945V. With 625 terminals in a low profile grid array package, it's ideal for industrial applications requiring high performance and compact design.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA60 by Texas Instruments

66AK2G12ABYA60

Texas Instruments

The Texas Instruments 66AK2G12ABYA60 is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.855V to 0.945V. With 625 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

MIMXRT1052CVL5A by NXP Semiconductors

MIMXRT1052CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1052CVL5A is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. This low-profile, fine-pitch chip is ideal for industrial applications requiring high performance in a compact form factor.

24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE

S-PBGA-B196

10 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

10 mm

SYSTEM ON CHIP

MIMXRT1052CVL5B by NXP Semiconductors

MIMXRT1052CVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT1052CVL5B is a System on Chip with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SYSTEM ON CHIP

AX8052F151-2-TX30 by Onsemi

AX8052F151-2-TX30

Onsemi

AX8052F151-2-TX30 by Onsemi is a 40-terminal IC with supply voltage range of 2.2V to 3.6V, operating temperature from -40 °C to 85°C. It features CMOS technology, no-lead terminal form, and is ideal for industrial applications requiring system-on-chip peripherals in a compact square package style.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F151-3-TX30 by Onsemi

AX8052F151-3-TX30

Onsemi

AX8052F151-3-TX30 by Onsemi is a 40-terminal chip carrier with CMOS technology, operating at -40 to 85 °C. It has a supply voltage range of 2.2V to 3.6V and is ideal for industrial applications requiring a system on chip peripheral IC in a compact square package style.

R-PQCC-N40

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

SYSTEM ON CHIP

MIMXRT1051CVJ5B by NXP Semiconductors

MIMXRT1051CVJ5B

NXP Semiconductors

NXP Semiconductors' MIMXRT1051CVJ5B is a System on Chip with CMOS technology, operating at -40 to 105 °C. It features 196 terminals in a low profile grid array package style. Ideal for industrial applications requiring uPs and uCs with a supply voltage range of 1.15V to 1.26V.

S-PBGA-B196

e2

12 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX280CVM4C by NXP Semiconductors

MCIMX280CVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX280DVM4C by NXP Semiconductors

MCIMX280DVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX281AVM4C by NXP Semiconductors

MCIMX281AVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

AEC-Q100

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283CVM4C by NXP Semiconductors

MCIMX283CVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283DVM4C by NXP Semiconductors

MCIMX283DVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX285AVM4C by NXP Semiconductors

MCIMX285AVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

AEC-Q100

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286CVM4C by NXP Semiconductors

MCIMX286CVM4C

NXP Semiconductors

MCIMX286CVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance and compact design.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286DVM4C by NXP Semiconductors

MCIMX286DVM4C

NXP Semiconductors

MCIMX286DVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35V to 1.55V. This low-profile, fine-pitch IC with 289 terminals is ideal for various applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX287CVM4C by NXP Semiconductors

MCIMX287CVM4C

NXP Semiconductors

MCIMX287CVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35V to 1.55V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX7D5EVK10SD by NXP Semiconductors

MCIMX7D5EVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.2 V;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MIMX8MN1CVTIZAA by NXP Semiconductors

MIMX8MN1CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

e2

3

260

TIN SILVER

40

SYSTEM ON CHIP