Loading...

SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 347

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z012S-1CLG485C by Xilinx

XC7Z012S-1CLG485C

Xilinx

The Xilinx XC7Z012S-1CLG485C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring 485 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B485

19 mm

485

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z012S-1CLG485I by Xilinx

XC7Z012S-1CLG485I

Xilinx

XC7Z012S-1CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z012S-2CLG485E by Xilinx

XC7Z012S-2CLG485E

Xilinx

The Xilinx XC7Z012S-2CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 485 terminals in a low profile grid array package, it's ideal for embedded applications requiring high processing power in compact form factors.

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z012S-2CLG485I by Xilinx

XC7Z012S-2CLG485I

Xilinx

XC7Z012S-2CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a low profile grid array package, it's ideal for various embedded applications.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z014S-1CLG400C by Xilinx

XC7Z014S-1CLG400C

Xilinx

The Xilinx XC7Z014S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 400 terminals in a low profile grid array package, it's ideal for various embedded applications.

S-PBGA-B400

17 mm

400

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z014S-1CLG400I by Xilinx

XC7Z014S-1CLG400I

Xilinx

XC7Z014S-1CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile, fine pitch grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z014S-1CLG484C by Xilinx

XC7Z014S-1CLG484C

Xilinx

XC7Z014S-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. This low profile chip in a square package is ideal for various applications requiring high performance and compact design.

S-PBGA-B484

19 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z014S-1CLG484I by Xilinx

XC7Z014S-1CLG484I

Xilinx

XC7Z014S-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With a grid array package style, it's ideal for applications requiring low profile and fine pitch components.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z014S-2CLG400E by Xilinx

XC7Z014S-2CLG400E

Xilinx

The Xilinx XC7Z014S-2CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B400

17 mm

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z014S-2CLG400I by Xilinx

XC7Z014S-2CLG400I

Xilinx

The Xilinx XC7Z014S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z014S-2CLG484E by Xilinx

XC7Z014S-2CLG484E

Xilinx

The Xilinx XC7Z014S-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and integration capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z014S-2CLG484I by Xilinx

XC7Z014S-2CLG484I

Xilinx

XC7Z014S-2CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. This package, measuring 19mm x 19mm, features a grid array style and is ideal for various applications requiring low profile, fine pitch ICs.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

MCIMX6Q4AVT08AE by NXP Semiconductors

MCIMX6Q4AVT08AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6D5EYM12AE by NXP Semiconductors

MCIMX6D5EYM12AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6Q5EYM12AE by NXP Semiconductors

MCIMX6Q5EYM12AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

AM5716AABCXEQ1 by Texas Instruments

AM5716AABCXEQ1

Texas Instruments

AM5716AABCXEQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. With 760 terminals in a GRID ARRAY package style, it has a supply voltage range of 1.11V to 1.2V for versatile usage.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXQ1 by Texas Instruments

AM5716AABCXQ1

Texas Instruments

AM5716AABCXQ1 by Texas Instruments is a 760-terminal SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.11V to 1.2V, it features a fine pitch grid array package style for surface mount assembly.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXEQ1 by Texas Instruments

AM5718AABCXEQ1

Texas Instruments

The Texas Instruments AM5718AABCXEQ1 is a SYSTEM ON CHIP with CMOS technology, operating at -40 to 125 °C. It features 760 terminals in a GRID ARRAY package style, suitable for automotive applications due to AEC-Q100 screening and low supply voltage of 1.11 V.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXQ1 by Texas Instruments

AM5718AABCXQ1

Texas Instruments

AM5718AABCXQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates at 1.11-1.2V, suitable for automotive applications. With 760 terminals in a GRID ARRAY package style, it offers high performance at temperatures ranging from -40 to 125°C.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MCIMX7D2DVK12SD by NXP Semiconductors

MCIMX7D2DVK12SD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

85 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D2DVM12SD by NXP Semiconductors

MCIMX7D2DVM12SD

NXP Semiconductors

MCIMX7D2DVM12SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.2-1.25 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.

S-PBGA-B541

19 mm

3

541

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,29

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX7D3DVK10SD by NXP Semiconductors

MCIMX7D3DVK10SD

NXP Semiconductors

MCIMX7D3DVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating at 0-95°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring thin profile, fine pitch grid arrays in plastic/epoxy packages.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SD by NXP Semiconductors

MCIMX7D3EVK10SD

NXP Semiconductors

MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D5EVM10SD by NXP Semiconductors

MCIMX7D5EVM10SD

NXP Semiconductors

MCIMX7D5EVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C and has a supply voltage range of 1.2V to 1.25V. With 541 terminals in a GRID ARRAY package, it's ideal for applications requiring low profile and fine pitch components.

S-PBGA-B541

19 mm

3

541

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,29

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX7D7DVK10SD by NXP Semiconductors

MCIMX7D7DVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D7DVM10SD by NXP Semiconductors

MCIMX7D7DVM10SD

NXP Semiconductors

MCIMX7D7DVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating at 0-95°C. It features a low profile GRID ARRAY package style, 0.75mm terminal pitch, and 1.2-1.25V supply voltage range. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B541

19 mm

3

541

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,29

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX6S7CVM08AD by NXP Semiconductors

MCIMX6S7CVM08AD

NXP Semiconductors

MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U7CVM08AD by NXP Semiconductors

MCIMX6U7CVM08AD

NXP Semiconductors

MCIMX6U7CVM08AD by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105°C. It features a low profile grid array package style and CMOS technology, suitable for industrial applications requiring high performance and reliability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

EFR32FG12P431F1024GL125-C by Silicon Labs

EFR32FG12P431F1024GL125-C

Silicon Labs

EFR32FG12P431F1024GL125-C by Silicon Labs is a 125-terminal uC with CMOS tech. Operates b/w -40 to 85 °C, with supply voltage range of 1.62-3.8 V. Ideal for System on Chip applications due to its very thin profile and fine pitch grid array package style.

S-PBGA-B125

7 mm

125

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA125,13X13,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.94 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

BALL

.5 mm

BOTTOM

7 mm

SYSTEM ON CHIP

MCIMX6Q6AVT08AE by NXP Semiconductors

MCIMX6Q6AVT08AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

LS1043AXN7PQB by NXP Semiconductors

LS1043AXN7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1023AXE8PQB by NXP Semiconductors

LS1023AXE8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043AXE8PQB by NXP Semiconductors

LS1043AXE8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXE7PQB by NXP Semiconductors

LS1023AXE7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXN8PQB by NXP Semiconductors

LS1043AXN8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXN8PQB by NXP Semiconductors

LS1023AXN8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXN7PQB by NXP Semiconductors

LS1023AXN7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXE7PQB by NXP Semiconductors

LS1043AXE7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXE8QQB by NXP Semiconductors

LS1043AXE8QQB

NXP Semiconductors

LS1043AXE8QQB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.87V to 0.93V. This IC has 780 terminals in a GRID ARRAY package style and is suitable for industrial applications.

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

EFR32FG12P431F1024IM48-CR by Silicon Labs

EFR32FG12P431F1024IM48-CR

Silicon Labs

EFR32FG12P431F1024IM48-CR by Silicon Labs is a 48-terminal, CMOS technology System on Chip with a supply voltage range of 1.62V to 3.8V. It operates b/w -40°C to 125°C and is suitable for applications requiring a compact, surface-mountable chip carrier package style with no lead terminals.

S-XQCC-N48

7 mm

48

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SYSTEM ON CHIP

EFR32FG12P231F1024GM68-C by Silicon Labs

EFR32FG12P231F1024GM68-C

Silicon Labs

EFR32FG12P231F1024GM68-C by Silicon Labs is a System on Chip with 68 terminals, operating from -40 to 85°C. It features a supply voltage range of 1.62V to 3.8V and utilizes CMOS technology. Ideal for applications requiring low-profile, surface-mount solutions in various industries.

S-XQCC-N68

8 mm

68

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC68,.32SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

8 mm

SYSTEM ON CHIP

EFR32FG12P231F512GM68-C by Silicon Labs

EFR32FG12P231F512GM68-C

Silicon Labs

EFR32FG12P231F512GM68-C by Silicon Labs is a System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.62V to 3.8V. With 68 terminals in a square package style, it's ideal for IoT and wireless applications.

S-XQCC-N68

8 mm

68

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC68,.32SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

8 mm

SYSTEM ON CHIP

EFR32FG12P431F1024GM68-CR by Silicon Labs

EFR32FG12P431F1024GM68-CR

Silicon Labs

EFR32FG12P431F1024GM68-CR by Silicon Labs is a System on Chip with 68 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.62-3.8V and uses CMOS technology. Ideal for applications requiring low-profile, surface-mount components in various electronic systems.

S-XQCC-N68

8 mm

3

68

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC68,.32SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

30

8 mm

SYSTEM ON CHIP

EFR32FG12P431F1024GM68-C by Silicon Labs

EFR32FG12P431F1024GM68-C

Silicon Labs

EFR32FG12P431F1024GM68-C by Silicon Labs is a System on Chip with 68 terminals, operating from -40 to 85°C. It features a supply voltage range of 1.62V to 3.8V and a compact square package style suitable for IoT devices and wireless applications.

S-XQCC-N68

8 mm

68

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC68,.32SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

8 mm

SYSTEM ON CHIP

EFR32FG12P433F1024GM68-C by Silicon Labs

EFR32FG12P433F1024GM68-C

Silicon Labs

EFR32FG12P433F1024GM68-C by Silicon Labs is a System on Chip with 68 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1.62V to 3.8V and uses CMOS technology. Ideal for applications requiring low-profile, surface-mount components in various electronic systems.

S-XQCC-N68

8 mm

68

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC68,.32SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

8 mm

SYSTEM ON CHIP

EFR32BG12P432F1024GM48-CR by Silicon Labs

EFR32BG12P432F1024GM48-CR

Silicon Labs

EFR32BG12P432F1024GM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.62V to 3.8V and utilizes CMOS technology. Ideal for applications requiring low-profile, surface-mountable chips in various electronic devices.

S-XQCC-N48

7 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SYSTEM ON CHIP

AX8052F143-2-TB05 by Onsemi

AX8052F143-2-TB05

Onsemi

AX8052F143-2-TB05 by Onsemi is a CMOS System on Chip with 40 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 2.2V to 3.6V and is suitable for industrial applications requiring a very thin profile, heat sink package style. This chip carrier supports surface mount technology and features nickel/palladium/gold terminal finish.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC28,.35X.55

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F143-2-TX30 by Onsemi

AX8052F143-2-TX30

Onsemi

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

R-PQCC-N40

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

SYSTEM ON CHIP