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MT9M031I12STM-DPBR

Onsemi

MT9M031I12STM-DPBR by Onsemi

MT9M031I12STM-DPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 pixels, 3.75um pixel size, and 50MHz master clock. It operates at -30 to 70 °C, has a dynamic range of 64dB, and outputs digital voltage. Ideal for applications requiring high-resolution imaging in various lighting conditions.

Median Price

$18.770

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 934 parts In-Stock

1+ parts

-

100+ parts

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$17.230

934

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$17.230

DigiKey

USA . 934 parts In-Stock

1+ parts

-

100+ parts

$21.750

1k+ parts

$21.750

10k+ parts

$21.750

934

-

$21.750

$21.750

$21.750

Rochester

USA . 884 parts In-Stock

1+ parts

-

100+ parts

$18.770

1k+ parts

$16.800

10k+ parts

$15.810

884

-

$18.770

$16.800

$15.810

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,440 parts In-Stock

1+ parts

$19.864

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2,440

$19.864

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Vyrian

USA . 3,951 parts In-Stock

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3,951

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 432 parts In-Stock

1+ parts

$17.230

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432

$17.230

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Corphita

USA . 397 parts In-Stock

1+ parts

$18.819

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397

$18.819

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Problanco Electronics

Mexico . 5,666 parts In-Stock

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5,666

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TANS Electronics

Latvia . 5,113 parts In-Stock

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5,113

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SupplyDigital Components

Austria . 3,995 parts In-Stock

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3,995

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Kulean Microsystems

USA . 2,160 parts In-Stock

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2,160

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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520

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Overview

Capture life's moments in stunning clarity with the MT9M031I12STM-DPBR image sensor by Onsemi. As a trusted manufacturer of cutting-edge technology, Onsemi delivers superior quality and reliability. This image sensor, with its high pixel resolution and advanced features, is perfect for a wide range of applications, from security cameras to medical imaging equipment. Customers can expect exceptional value, performance, and versatility with this product, making it the ideal choice for all their imaging needs. Trust Onsemi to bring your vision to life with the MT9M031I12STM-DPBR.

Feature Benefit Bullets

Pixel Size (um): 3.75

Small pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 1.95 V

Efficient power consumption and compatibility with standard voltage levels.

Master Clock: 50 MHz

High clock frequency enables fast data processing and improved performance.

Body Width: 10 inch

Compact size for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology offers low power consumption and high image quality.

Minimum Operating Temperature: -30 °C

Wide operating temperature range for versatility in different environments.

Output Interface Type: 2-WIRE INTERFACE

Simple and efficient interface for easy connectivity.

Frame Rate: 60 fps

High frame rate for smooth video recording and fast capturing of moving objects.

Sensitivity (V/lx.s): 5.3 V/lx.s

High sensitivity for better low-light performance and improved image clarity.

Mounting Feature: SURFACE MOUNT

Convenient mounting option for easy installation and integration.

Technical Specifications

Image Sensors MT9M031I12STM-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.38 mm

Body Length/Diameter:

10 mm

Dynamic Range:

64 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

55 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensitivity (V/lx.s):

5.3 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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