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MT9M024IA3XTM-DPBR

Onsemi

MT9M024IA3XTM-DPBR by Onsemi

MT9M024IA3XTM-DPBR by Onsemi is an image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. It operates at a max supply voltage of 1.95V and is suitable for applications requiring high-quality digital imaging in various lighting conditions.

Median Price

$18.438

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 235 parts In-Stock

1+ parts

-

100+ parts

$19.630

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235

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$19.630

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Flip Electronics (Authorized)

USA . 235 parts In-Stock

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Rochester

USA . 47 parts In-Stock

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-

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$14.750

1k+ parts

$13.200

10k+ parts

$12.420

47

-

$14.750

$13.200

$12.420

Verical

USA . 47 parts In-Stock

1+ parts

-

100+ parts

$18.438

1k+ parts

$16.500

10k+ parts

$15.525

47

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$18.438

$16.500

$15.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,440 parts In-Stock

1+ parts

$15.608

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1,440

$15.608

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Vyrian

USA . 8,310 parts In-Stock

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8,310

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Flip Electronics

USA . 235 parts In-Stock

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235

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Rebound Electronics

UK . 160 parts In-Stock

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160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,013 parts In-Stock

1+ parts

$14.787

100+ parts

-

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1,013

$14.787

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Corohmni

South Africa . 129 parts In-Stock

1+ parts

$16.430

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129

$16.430

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Kulean Microsystems

USA . 7,258 parts In-Stock

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7,258

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TANS Electronics

Latvia . 5,082 parts In-Stock

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5,082

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SupplyDigital Components

Austria . 1,773 parts In-Stock

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Problanco Electronics

Mexico . 1,384 parts In-Stock

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1,384

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UHIMA Technologies

Türkiye . 702 parts In-Stock

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702

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Overview

Capture breathtaking images with the MT9M024IA3XTM-DPBR image sensor by Onsemi. Known for their top-notch quality and cutting-edge technology, Onsemi delivers superior performance and reliability in every product. Ideal for a wide range of applications, this Image Sensor offers exceptional value, providing customers with crisp and clear visuals. Experience the advantages of this sensor and elevate your imaging projects to new heights with Onsemi's innovative technology.

Feature Benefit Bullets

Pixel Size (um): 3.75

Smaller pixel size allows for capturing more detail in images.

Maximum Supply Voltage: 1.95 V

Wide supply voltage range allows for flexibility in power supply options.

Master Clock: 50 MHz

High master clock frequency ensures fast and accurate data processing.

Body Width: 9 inch

Compact body width for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology offers high image quality and low power consumption.

Minimum Operating Temperature: -30 °C

Wide operating temperature range allows for use in different environments.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies communication with external devices.

Dynamic Range: 115 dB

High dynamic range allows for capturing a wide range of light intensities in a single image.

Array Type: SINGLE FRAME

Single frame array simplifies image processing and analysis.

Mounting Feature: SURFACE MOUNT

Surface mount design makes it easy to mount the sensor on PCBs.

Technical Specifications

Image Sensors MT9M024IA3XTM-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

SINGLE FRAME

Body Width:

9 inch

Body Height:

1.35 mm

Body Length/Diameter:

9 mm

Data Rate:

700 Mbps

Dynamic Range:

115 dB

Frame Rate:

45 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

200 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensitivity (V/lx.s):

5.48 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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