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M36W216T85ZA6T

STMicroelectronics

M36W216T85ZA6T by STMicroelectronics

M36W216T85ZA6T by STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features a 1M x 16 organization and operates in temperatures from -40 °C to 85 °C, making it ideal for industrial applications. Its compact design ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,865 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,865

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Digiode

USA . 3,557 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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3,557

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Anansix

USA . 1,557 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,557

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$1.904

100+ parts

-

1k+ parts

$1.714

10k+ parts

-

1,373

$1.904

-

$1.714

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MKK Technologies

India . 1,045 parts In-Stock

1+ parts

$3.581

100+ parts

-

1k+ parts

-

10k+ parts

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1,045

$3.581

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DigiPath Technology Company

USA . 1,045 parts In-Stock

1+ parts

$3.581

100+ parts

-

1k+ parts

-

10k+ parts

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1,045

$3.581

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Corphita

USA . 3,340 parts In-Stock

1+ parts

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3,340

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Parana Technologies

USA . 1,498 parts In-Stock

1+ parts

-

100+ parts

$2.277

1k+ parts

-

10k+ parts

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1,498

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$2.277

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Overview

Unlock the potential of your designs with the M36W216T85ZA6T from STMicroelectronics—a leader in cutting-edge technology. This high-performance memory IC offers exceptional reliability and efficiency, perfect for industrial applications that demand durability under extreme temperatures. Its innovative design ensures seamless integration and superior functionality, making it an ideal choice for advanced electronic solutions. Elevate your projects with a trusted partner dedicated to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making this memory IC suitable for a wide range of industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient performance, making it ideal for space-constrained environments.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient space utilization on PCBs, aiding in the design of high-density applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for higher performance in non-blocking applications, enhancing overall system responsiveness.

Nominal Supply Voltage / Vsup: 3 V

A nominal supply voltage of 3 V aligns well with standard digital circuits, ensuring compatibility and ease of integration.

No. of Terminals: 66

A higher number of terminals provides more connections, facilitating complex interactions and integrations with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array design promotes efficient heat dissipation and low-profile packaging is advantageous for compact applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in harsh environments, making it suitable for industrial applications.

Organization: 1MX16

This memory organization supports a substantial amount of data storage, ideal for applications requiring significant memory capacity.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in extreme conditions, enhancing its suitability for outdoor and rugged applications.

Terminal Position: BOTTOM

Bottom terminal positioning improves solder accountability and assembly efficiency, resulting in more dependable connections.

Maximum Seated Height: 1.4 mm

The low seated height allows for integration into compact designs, optimizing space in product development.

Width: 8 mm

Compact width makes this memory IC suitable for a wide range of devices requiring space-efficient solutions.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V expands its compatibility with various power supply designs, enhancing versatility.

Length: 12 mm

The slim length contributes to the overall compactness, making it suitable for space-restricted applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability and performance stability in challenging environments, making it a trusted choice for critical applications.

Technology: CMOS

CMOS technology is known for low power consumption and high performance, making this memory IC efficient and effective for modern applications.

Terminal Form: BALL

Ball terminal form provides robust electrical connections, enhancing reliability and facilitating simplified PCB assembly.

No. of Words: 1048576 words

With 1,048,576 words available, this memory IC supports extensive data processing and storage, essential for complex applications.

Memory Width: 16

A 16-bit memory width strikes a good balance between data throughput and integration, making it suitable for a variety of systems.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for finer spacing in critical layouts, providing greater flexibility in design.

No. of Words Code: 1M

Supports 1M words, providing ample memory for applications requiring significant data storage and processing capabilities.

Maximum Supply Voltage (Vsup): 3.3 V

A maximum supply voltage of 3.3 V offers flexibility in modern digital circuits, ensuring compatibility with various designs.

Memory Density: 16777216 bit

A memory density of 16 megabits enhances the capacity for extensive data storage, making it an excellent option for memory-intensive applications.

Memory IC Type: MEMORY CIRCUIT

Being classified as a memory circuit signifies its essential role in data storage, making it crucial for numerous electronic devices.

Technical Specifications

Other Function Memory ICs M36W216T85ZA6T attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO CONTAINS 128K X 16 SRAM

JESD-30 Code:

R-PBGA-B66

Length:

12 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

66

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W216T85ZA6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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