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M36W0R6040B0ZAQE

STMicroelectronics

M36W0R6040B0ZAQE by STMicroelectronics

M36W0R6040B0ZAQE by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and PSRAM in a compact 88-terminal grid array package. Ideal for applications requiring efficient asynchronous access with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,750 parts In-Stock

1+ parts

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3,750

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Vyrian

USA . 2,848 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,848

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Anansix

USA . 1,381 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,381

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,153 parts In-Stock

1+ parts

$5.039

100+ parts

-

1k+ parts

$4.535

10k+ parts

-

1,153

$5.039

-

$4.535

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MKK Technologies

India . 1,937 parts In-Stock

1+ parts

$9.475

100+ parts

-

1k+ parts

-

10k+ parts

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1,937

$9.475

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DigiPath Technology Company

USA . 1,937 parts In-Stock

1+ parts

$9.475

100+ parts

-

1k+ parts

-

10k+ parts

-

1,937

$9.475

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-

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Corphita

USA . 4,425 parts In-Stock

1+ parts

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4,425

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Parana Technologies

USA . 1,616 parts In-Stock

1+ parts

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100+ parts

$6.025

1k+ parts

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1,616

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$6.025

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Overview

Unlock the potential of your designs with the M36W0R6040B0ZAQE from STMicroelectronics—a leader in innovative memory solutions. This advanced memory IC seamlessly blends FLASH and PSRAM technology, ensuring both speed and efficiency for applications ranging from IoT devices to edge computing. Enjoy enhanced performance with a compact design that fits perfectly into modern electronics, delivering reliability and value that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stress, making this IC reliable in various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and simplifies the manufacturing process, leading to lower production costs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and assembly on PCBs, making it suitable for compact designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation offers faster access times without the need for clock signals, improving system efficiency.

Mixed Memory Type: FLASH+PSRAM

Combining FLASH and PSRAM provides flexibility and efficiency, facilitating both fast read access and large storage capacity.

Nominal Supply Voltage / Vsup: 1.8 V

Low nominal supply voltage enhances energy efficiency, making it ideal for battery-operated devices.

Power Supplies (V): 1.8

Consistent with modern low-power designs, allowing for reduced energy consumption in applications.

No. of Terminals: 88

A higher terminal count allows for increased connectivity options, enabling more versatile circuit designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Thin profile and fine pitch designs are ideal for high-density applications, saving space and improving performance.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability in various environments, making it suitable for demanding applications.

Organization: 4MX16

This organization supports efficient data handling and management, crucial for high-performance applications.

Minimum Operating Temperature: -30 °C

The wide temperature range allows the device to function effectively in harsh climates, enhancing its versatility.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish improves solderability and overall reliability, boosting the longevity of connections.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better thermal management and optimal performance in various applications.

Maximum Seated Height: 1.2 mm

A low seated height enables more compact designs, which is advantageous for space-constrained products.

Width: 8 mm

A narrow width makes this memory IC suitable for small-form-factor devices, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 1.7 V

The minimum supply voltage allows for flexibility in power supply designs, accommodating various application needs.

Length: 10 mm

Short length supports compact layouts on PCBs, beneficial for devices where space is at a premium.

Technology: CMOS

CMOS technology supports low power consumption and high density, making it ideal for modern memory solutions.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and enhances the overall assembly process, promoting reliability.

Maximum Supply Current: 45 mA

A manageable maximum supply current ensures compatibility with a wide range of power supply designs without excessive drain.

No. of Words: 4194304 words

This substantial word count allows for significant data storage, ideal for applications requiring large memory capacity.

Memory Width: 16

A memory width of 16 bits allows for efficient data transfer, supporting high-speed operations.

Terminal Pitch: 0.8 mm

A smaller terminal pitch promotes high-density layout on PCBs, accommodating advanced compact designs.

No. of Words Code: 4M

The 4M word coding indicates ample data handling capability, suitable for complex memory requirements.

Maximum Supply Voltage (Vsup): 1.95 V

The max supply voltage provides a buffer for varying operational conditions, ensuring stable performance.

Memory Density: 67108864 bit

High memory density allows extensive data storage, making this IC apt for applications needing large memory footprints.

Memory IC Type: MEMORY CIRCUIT

Being a memory circuit allows for integration into broader systems catering to diverse processing needs.

Maximum Standby Current: 0.00011 Amp

Extremely low standby current optimizes energy usage, making this IC effective for battery-powered applications.

Maximum Access Time: 70 ns

The quick access time enhances system efficiency, particularly in applications that demand rapid data retrieval.

Technical Specifications

Other Function Memory ICs M36W0R6040B0ZAQE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

PSRAM IS ORGANIZED AS 1M X 16

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+PSRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00011 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W0R6040B0ZAQE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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