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M36W0R5020T0ZAQF

STMicroelectronics

M36W0R5020T0ZAQF by STMicroelectronics

M36W0R5020T0ZAQF by STMicroelectronics is a versatile memory IC featuring 2M words of FLASH+SRAM with a max access time of 70 ns. It operates asynchronously at a nominal voltage of 1.8V, suitable for industrial applications. Its compact design (8x10 mm) ensures efficient space utilization in devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,176 parts In-Stock

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Vyrian

USA . 1,323 parts In-Stock

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1,323

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Anansix

USA . 551 parts In-Stock

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551

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$3.201

100+ parts

-

1k+ parts

$2.881

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1,356

$3.201

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$2.881

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MKK Technologies

India . 298 parts In-Stock

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$6.019

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298

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DigiPath Technology Company

USA . 298 parts In-Stock

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$6.019

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298

$6.019

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Corphita

USA . 1,582 parts In-Stock

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Parana Technologies

USA . 625 parts In-Stock

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$3.827

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625

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$3.827

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Overview

Unlock exceptional performance with the M36W0R5020T0ZAQF from STMicroelectronics, a leader in innovative memory solutions. This versatile FLASH+SRAM memory IC excels in demanding environments, offering reliability and efficiency for diverse applications—from industrial automation to consumer electronics. With its compact design and low power consumption, it ensures seamless operation while maximizing your device's potential. Trust STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern circuit boards.

Package Shape: RECTANGULAR

A rectangular package shape is efficient for space management in circuit design, optimizing layout options.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster response times, enhancing overall system performance.

Mixed Memory Type: FLASH+SRAM

Combining FLASH and SRAM allows for both long-term data storage and fast access, providing versatility in memory use.

Nominal Supply Voltage / Vsup (V): 1.8

A nominal supply voltage of 1.8V supports low-power consumption, ideal for battery-operated devices.

Power Supplies (V): 1.8

Consistent power supply requirements simplify the design process and improve compatibility with modern low-voltage systems.

No. of Terminals: 88

A large number of terminals allows for greater connectivity options, enhancing flexibility in circuit design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array style provides efficient use of space, while a thin profile and fine pitch aid in high-density applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is reliable for industrial applications in varying conditions.

Organization: 2MX16

An organization of 2M x 16 bits offers sufficient data structure for various applications, ensuring optimal performance.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme environments, making it suitable for industrial applications.

Terminal Finish: TIN SILVER COPPER

A tin-silver-copper finish enhances the solderability and durability of the terminals, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient surface mounting on PCBs, saving space and improving performance.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm provides clearance for compact designs in space-constrained applications.

Width: 8 mm

An 8 mm width aids in fitting into narrower circuit layouts, enhancing versatility.

Minimum Supply Voltage (Vsup): 1.7 V

A minimum supply voltage of 1.7V allows it to function efficiently in low-power applications.

Length: 10 mm

A 10 mm length is practical for various circuit designs, enabling integration into tight spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in challenging environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making this memory IC highly efficient.

Terminal Form: BALL

Ball terminal form facilitates a solid connection with PCB pads, ensuring reliability in high-performance applications.

Maximum Supply Current: 45 mA

A maximum supply current of 45 mA supports power efficiency, allowing for usage in low-power devices.

No. of Words: 2097152 words

With over 2 million words, this memory provides ample storage capacity for extensive data applications.

Memory Width: 16

A memory width of 16 bits allows for efficient data handling and processing in various applications.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is suitable for high-density PCBs, facilitating better space management.

No. of Words Code: 2M

The 2M word count showcases the product’s capability to handle significant amounts of data effectively.

Maximum Supply Voltage (Vsup): 1.95 V

This maximum supply voltage ensures compatibility with a range of power supplies, improving design flexibility.

Memory Density: 33554432 bit

A high memory density of 33M bits allows for storing large amounts of data, making it ideal for data-intensive applications.

Memory IC Type: MEMORY CIRCUIT

Being a dedicated memory circuit optimizes performance and reliability, focusing on data storage and retrieval.

Maximum Standby Current: 0.00005 Amp

A very low maximum standby current enhances the energy efficiency of the overall system, reducing power consumption.

Maximum Access Time: 70 ns

A maximum access time of 70 ns ensures fast data retrieval, which is crucial for high-performance applications.

Technical Specifications

Other Function Memory ICs M36W0R5020T0ZAQF attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

SRAM IS ORGANIZED AS 256K X 16

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+SRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00005 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W0R5020T0ZAQF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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