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SN74ALS870DW3

Texas Instruments

SN74ALS870DW3 by Texas Instruments

SN74ALS870DW3 by Texas Instruments is a 24-terminal TTL IC in a small outline package. Operating temp range: 0-70°C. Used in commercial applications for memory functions due to its dual terminal position and gull wing form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,468 parts In-Stock

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5,468

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Digiode

USA . 427 parts In-Stock

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427

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,138 parts In-Stock

1+ parts

$2.274

100+ parts

-

1k+ parts

$2.775

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1,138

$2.274

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$2.775

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ChromeModa Solutions

Germany . 420 parts In-Stock

1+ parts

$2.555

100+ parts

$2.095

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420

$2.555

$2.095

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IDEA Electronic Components Group

UK . 106 parts In-Stock

1+ parts

$2.555

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$2.300

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106

$2.555

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$2.300

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AZTECH Wire

Italy . 554 parts In-Stock

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$9.130

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554

$9.130

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One Stop Electronics

USA . 1,135 parts In-Stock

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$17.000

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1,135

$17.000

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DigiPath Technology Company

USA . 2,340 parts In-Stock

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$2.304

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2,340

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$2.304

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Corphita

USA . 126 parts In-Stock

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Overview

Discover the SN74ALS870DW3 by Texas Instruments, a top-quality memory IC with endless possibilities. Manufactured by the trusted brand Texas Instruments, this versatile component is perfect for a wide range of applications. From consumer electronics to industrial automation, this product offers unmatched reliability and performance. Upgrade your designs with ease and confidence knowing that you are getting the best value for your money. Experience the benefits and advantages of the SN74ALS870DW3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring a longer lifespan.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, making it easier to integrate into various electronic devices and systems.

No. of Terminals: 24

With 24 terminals, this product offers sufficient connectivity options for different applications, providing flexibility in usage.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, allowing for more components to be integrated, making it an efficient choice.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability and stability in various operating conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C implies that the product can function effectively in a wide range of environments.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved connectivity, reducing the risk of signal loss or disconnection.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades implies that this product is suitable for standard commercial applications, making it a versatile choice.

Technology: TTL

The use of TTL technology ensures compatibility with a wide range of devices and systems, enhancing the product's usability and versatility.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical connections, reducing the risk of damage or disconnection during operation.

Terminal Pitch: 1.27 mm

The tight terminal pitch of 1.27mm allows for high-density mounting, enabling more components to be packed closely together, improving overall system efficiency.

Technical Specifications

Other Function Memory ICs SN74ALS870DW3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Sub-Category:

Other Memory ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS870DW3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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