Loading...

SN74ALS871FN3

Texas Instruments

SN74ALS871FN3 by Texas Instruments

Texas Instruments SN74ALS871FN3 is a TTL memory IC with 28 terminals in a square chip carrier package. Operating temperature range of 0-70°C makes it suitable for commercial applications. Surface mountable, ideal for various electronic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,520

-

-

-

-

Digiode

USA . 4,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,746

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,051 parts In-Stock

1+ parts

$2.089

100+ parts

-

1k+ parts

$2.606

10k+ parts

-

1,051

$2.089

-

$2.606

-

DigiPath Technology Company

USA . 762 parts In-Stock

1+ parts

$2.300

100+ parts

$2.116

1k+ parts

-

10k+ parts

-

762

$2.300

$2.116

-

-

ChromeModa Solutions

Germany . 6,648 parts In-Stock

1+ parts

$2.347

100+ parts

$1.925

1k+ parts

-

10k+ parts

-

6,648

$2.347

$1.925

-

-

IDEA Electronic Components Group

UK . 1,499 parts In-Stock

1+ parts

$2.347

100+ parts

-

1k+ parts

$2.112

10k+ parts

-

1,499

$2.347

-

$2.112

-

AZTECH Wire

Italy . 511 parts In-Stock

1+ parts

$17.579

100+ parts

-

1k+ parts

-

10k+ parts

-

511

$17.579

-

-

-

One Stop Electronics

USA . 776 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

-

10k+ parts

-

776

$22.000

-

-

-

Corphita

USA . 1,255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,255

-

-

-

-

Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SN74ALS871FN3, a cutting-edge Other Function Memory IC. This innovative product offers unmatched value and benefits to customers, providing exceptional performance in a variety of applications. With a focus on excellence, Texas Instruments ensures that each component is designed to exceed expectations, making the SN74ALS871FN3 the ideal choice for your next project. Choose Texas Instruments for superior technology and unrivaled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good strength and durability, making it ideal for use in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape helps with uniform and efficient placement on PCBs, optimizing space and improving overall design aesthetics.

No. of Terminals: 28

28 terminals provide ample connectivity options, allowing for versatile integration into different electronic systems and applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style ensures reliable protection of the memory IC, enhancing its performance and longevity.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature of 70°C indicates good thermal performance, ensuring stable operation even in demanding conditions.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature of 0°C allows for reliable functionality in a wide range of environments, from room temperature to colder conditions.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connections to the circuit, promoting efficient signal transmission and reducing the risk of connectivity issues.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the memory IC is suitable for standard commercial applications, providing reliable performance in typical operating environments.

Technology: TTL

TTL technology offers fast switching speeds and compatibility with a wide range of digital systems, making the memory IC versatile and efficient in various applications.

Terminal Form: J BEND

J bend terminal form allows for secure and stable connections, reducing the risk of signal loss or interruption during operation.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables precise and compact mounting of the memory IC on the circuit board, enhancing overall design flexibility and efficiency.

Technical Specifications

Other Function Memory ICs SN74ALS871FN3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

Other Memory ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74ALS871FN3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19