Loading...

SN74ACT2151-25JD

Texas Instruments

SN74ACT2151-25JD by Texas Instruments

SN74ACT2151-25JD by Texas Instruments is a 1Kx12 memory circuit IC with a max access time of 25ns. It operates at a nominal voltage of 5V and has a memory density of 12288 bits. This CMOS technology IC is commonly used in applications requiring fast memory access within the commercial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,417

-

-

-

-

Digiode

USA . 3,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,254

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,261 parts In-Stock

1+ parts

$5.279

100+ parts

-

1k+ parts

$5.905

10k+ parts

-

1,261

$5.279

-

$5.905

-

AZTECH Wire

Italy . 401 parts In-Stock

1+ parts

$5.339

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$5.339

-

-

-

DigiPath Technology Company

USA . 1,545 parts In-Stock

1+ parts

$5.813

100+ parts

-

1k+ parts

-

10k+ parts

-

1,545

$5.813

-

-

-

ChromeModa Solutions

Germany . 3,918 parts In-Stock

1+ parts

$5.932

100+ parts

$4.864

1k+ parts

-

10k+ parts

-

3,918

$5.932

$4.864

-

-

IDEA Electronic Components Group

UK . 801 parts In-Stock

1+ parts

$5.932

100+ parts

-

1k+ parts

$5.339

10k+ parts

-

801

$5.932

-

$5.339

-

One Stop Electronics

USA . 1,463 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,463

$20.000

-

-

-

Corphita

USA . 4,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,405

-

-

-

-

Overview

Unlock the potential of your applications with the SN74ACT2151-25JD by Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this Memory Circuit IC offers unparalleled reliability and performance. Ideal for a wide range of applications, this product provides customers with the value and benefits they need to stay ahead in today's competitive market. Trust Texas Instruments to deliver the best in memory ICs for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides better thermal resistance and durability compared to plastic, ensuring reliable performance even in demanding environments.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, making it compatible with most existing systems and easy to integrate.

Organization: 1KX12

Organized as 1K words of 12 bits each, providing a good balance between memory capacity and word size for various applications.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliable operation within standard temperature ranges commonly found in commercial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it efficient and reliable for memory operations.

Technical Specifications

Other Function Memory ICs SN74ACT2151-25JD attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

R-XDIP-T28

Memory Density:

12288 bit

Memory IC Type:

Memory Width:

12

No. of Terminals:

28

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX12

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

SRAMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT2151-25JD Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19