Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ST25DV04K-IER6S3 by STMicroelectronics is a 4Kx1 memory circuit with 4096-bit memory density. It operates synchronously at 3.3V, suitable for industrial applications. This small outline IC has a rectangular shape, Gull Wing terminals, and can withstand temperatures from -40 to 85°C.
Median Price
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iodParts Technologies Inc.
Parana Technologies
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PLASTIC/EPOXY is a durable and cost-effective material, making this product reliable for long-term use.
Surface mounting simplifies the assembly process and saves space on the circuit board.
Synchronous operation ensures precise timing and coordination between different components in the system.
The 3.3V supply voltage provides optimal power efficiency for the memory IC.
The small outline package style saves valuable space on the board, ideal for compact electronic devices.
Other Function Memory ICs ST25DV04K-IER6S3 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
ST25DV04K-IER6S3 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - ST25D Marking/Die Chg 9/Jan/2020
PCN Assembly/Origin - Mult DEV Assembly Chg 29/Mar/2018
PCN Packaging - Mult Dev Inner Pkg Chg 30/Oct/2019
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
BAV99
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
FDC5614P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
EU2B-YS3303C
Idec
ROTARY SWITCH;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Comchip Technology
L78L05ABZ-AP
STMicroelectronics
L78L05ABZ-AP by STMicroelectronics is a BIPOLAR fixed positive single output standard regulator with an operating temperature range of -40 to 125°C. It has a nominal output voltage of 5V, max load regulation of 0.06%, and can handle a max output current of 0.07A. Ideal for applications requiring stable voltage regulation in various electronic devices.
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
MBRS360T3G
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
Sensitron Semiconductor
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Diodes Incorporated
SN74LS170NP1
Texas Instruments
SN74LS170NP1 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. This IC is commonly used in commercial applications requiring memory functions due to its temperature range of 0-70°C.
TMS27PC32-150NE
Other Memory ICs;
DS2401X-S+T
Analog Devices
Analog Devices' DS2401X-S+T is a 64-bit MEMORY CIRCUIT with CMOS technology. Operating at 5V, it has a temperature range of -40 to 85 °C and a supply voltage range of 2.8-6V. This PLASTIC/EPOXY IC in RECTANGULAR shape is ideal for industrial applications requiring high memory density and asynchronous operation.
M36LLR8760M1ZAQF
M36LLR8760M1ZAQF by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
DS1207-G2C
Analog Devices' DS1207-G2C is a CMOS MEMORY CIRCUIT with SYNCHRONOUS operation. It has an operating temperature range of 0-70 °C and TIN LEAD terminal finish. Ideal for applications requiring high-speed memory functions in COMMERCIAL grade environments.
TMS27C32NL
M36W108B120ZM1
M36W108B120ZM1 from STMicroelectronics is a low-profile, asynchronous memory IC featuring 8Mbit density with FLASH+SRAM technology. It operates b/w 2.7V and 3.6V, supports up to 70 °C, and has a max access time of 120ns. Ideal for applications requiring efficient data storage in compact designs.
DS1652
DS1652 by Analog Devices is a CMOS MEMORY CIRCUIT with 8 terminals, operating at 0-70 °C. It has a supply voltage of 5V and comes in an IN-LINE package shape made of PLASTIC/EPOXY. Ideal for applications requiring reliable memory storage in commercial-grade environments.
FM33256B-GTR
Infineon Technologies
FM33256B-GTR by Infineon Technologies is a 32KX8 EEPROM+FLASH memory IC with CMOS technology. Operating in synchronous mode, it has a memory density of 262144 bit and supports an organization of 32768 words. This small outline package is ideal for industrial applications requiring a temperature range from -40 to 85 °C.
SN74LS600ADW
SN74LS600ADW by Texas Instruments is a 16KX1 memory circuit IC with TTL technology. Operating at 5V, it has 16384-bit memory density and functions in asynchronous mode. This small outline package is ideal for applications requiring reliable memory storage in commercial temperature environments.
TMS44C251-12SD
TMS44C251-12SD by Texas Instruments is a 256KX4 MEMORY CIRCUIT IC with 1048576 bit Memory Density. It operates at 5V, has a Max Access Time of 120ns, and consumes up to 95mA. This CMOS technology chip is used in applications requiring fast memory access and high data storage capacity.
TMS27P32A45
DS2411R/T&R
DS2411R/T&R by Maxim Integrated is a 64-bit MEMORY CIRCUIT with 64x1 organization. Operating in ASYNCHRONOUS mode, it has a supply voltage range of 1.5V to 5.25V and operates in industrial temperature grade applications. This PLASTIC/EPOXY IC is surface mountable, featuring a small outline package style with dual GULL WING terminals for compact designs.
M36LLR8860T1ZAQ
M36LLR8860T1ZAQ by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M x 16 organization with mixed FLASH+PSRAM technology. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
TMS27PC240-10FLN
WD10EZEX
Western Digital
WD10EZEX by Western Digital is a 1TB memory circuit with CMOS technology, operating asynchronously at temperatures from 0 to 60°C. It has an organization of 1TX8, memory width of 8 bits, and a density of 8796093022208 bits. Ideal for applications requiring high-capacity storage in microelectronic assemblies.
M36W108T100ZM5T
STMicroelectronics M36W108T100ZM5T is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. It operates in asynchronous mode, has a supply voltage range of 2.7V to 3.6V, and is suitable for applications requiring low profile grid array packages.
MM5262N
National Semiconductor
MM5262N by National Semiconductor is a 2KX1 memory IC with 2048 bit density and 32 refresh cycles. It operates b/w 0-70 °C, has 22 terminals in an IN-LINE package style, suitable for commercial applications requiring separate I/O.
MR44V064BMAZAATL
Lapis Semiconductor
MR44V064BMAZAATL by Lapis Semiconductor is a synchronous memory IC with 8Kx8 organization and 65536-bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85°C, making it suitable for industrial applications requiring small outline, low profile packages in a rectangular shape.
CC2544RHBT
The Texas Instruments CC2544RHBT is a square chip carrier with a clock frequency of 2496 MHz, suitable for automotive applications. Operating temperature ranges from -40 to 125°C, with supply voltage ranging from 2V to 3.6V. Ideal for memory circuits requiring high-speed performance in compact designs.
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ST25DV04K-IER6T3
ST25DV04K-IER6T3 by STMicroelectronics is a 4Kx1 memory IC with 4096-bit memory density. It operates synchronously at 3.3V, suitable for industrial applications. The small outline package has a rectangular shape, 0.65mm terminal pitch, and dual terminal position for surface mount assembly.
ST25DV64K-IER6S3
ST25DV64K-IER6S3 by STMicroelectronics is a 64Kx1 memory circuit with CMOS technology. It operates at 3.3V, has 8 terminals in a small outline package, and can store 65536 bits of data. Ideal for industrial applications requiring synchronous operation and a temperature range from -40 to 85°C.
ST25DV16K-IER6S3
ST25DV16K-IER6S3 by STMicroelectronics is a 16Kx1 memory IC with CMOS technology. It operates synchronously at 3.3V, suitable for industrial applications. With a compact rectangular package style and gull wing terminals, it offers high memory density of 16384 bits for various functions.
ST25DV64K-IER6T3
ST25DV64K-IER6T3 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and is suitable for industrial applications requiring small outline, thin profile ICs.
ST25DV16K-IER6T3
ST25DV16K-IER6T3 by STMicroelectronics is a 16KX1 MEMORY CIRCUIT with 16384 bit Memory Density. It operates at 3.3V, -40 to 85 °C temperature range, in SYNCHRONOUS mode. Ideal for industrial applications requiring small outline, thin profile ICs with shrink pitch package style.
ST25DV04K-JFR6D3
ST25DV04K-JFR6D3 by STMicroelectronics is a 4Kx1 memory circuit with 4096-bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85°C and comes in a small outline package for industrial applications. With synchronous operation and no-lead terminals, it is suitable for various IoT and RFID systems.
ST25DV04K-IER6C3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
ST25DV64K-JFR6D3
ST25DV64K-JFR6D3 by STMicroelectronics is a 64Kx1 memory IC with CMOS technology. It operates synchronously at 3.3V, suitable for industrial applications. With a small outline package and dual terminals, it offers a memory density of 65536 bits for various electronic devices.
ST25DV16K-JFR6D3
ST25DV16K-JFR6D3 by STMicroelectronics is a 16Kx1 memory IC with CMOS technology. Operating at 3.3V, it has a temperature range of -40 to 85°C and a package style of small outline, heat sink/slug, very thin profile. Ideal for industrial applications requiring high memory density and synchronous operation in a compact square package.
ST25DV04K-JFR6L3
MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ST25DV04K-JFR6U3
ST25DV04K-JFR8C3
MEMORY CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
ST25DV04K-IER8C3
ST25DV16K-IER6C3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
ST25DV16K-IER6D3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 12; Package Code: HVSON; Package Shape: SQUARE; Terminal Position: DUAL;
ST25DV04K-IER6L3
ST25DV04K-JFR6C3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
ST25DV16K-IER6G3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Organization: 16KX1; Memory Width: 1;
ST25DV04K-IER6D3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 12; Package Code: HVSON; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
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