Loading...

ST25DV16K-IER6D3

STMicroelectronics

ST25DV16K-IER6D3 by STMicroelectronics

ST25DV16K-IER6D3 from STMicroelectronics is a 16K-bit CMOS memory IC designed for industrial applications. It operates in synchronous mode with a supply voltage range of 1.8V to 5.5V and features a compact, no-lead package measuring just 3mm x 3mm. With an operating temp range of -40 °C to 85 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,943

-

-

-

-

Vyrian

USA . 2,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,662

-

-

-

-

Anansix

USA . 1,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,910

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 572 parts In-Stock

1+ parts

$4.027

100+ parts

-

1k+ parts

$3.624

10k+ parts

-

572

$4.027

-

$3.624

-

MKK Technologies

India . 1,548 parts In-Stock

1+ parts

$7.572

100+ parts

-

1k+ parts

-

10k+ parts

-

1,548

$7.572

-

-

-

DigiPath Technology Company

USA . 1,548 parts In-Stock

1+ parts

$7.572

100+ parts

-

1k+ parts

-

10k+ parts

-

1,548

$7.572

-

-

-

Corphita

USA . 1,751 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,751

-

-

-

-

Parana Technologies

USA . 527 parts In-Stock

1+ parts

-

100+ parts

$4.815

1k+ parts

-

10k+ parts

-

527

-

$4.815

-

-

Overview

Unlock unparalleled performance with the ST25DV16K-IER6D3 from STMicroelectronics. This compact, high-quality memory IC excels in demanding industrial applications where reliability and efficiency are paramount. With its robust operating range and sleek design, it seamlessly integrates into your projects, offering exceptional speed and durability. Elevate your designs and ensure long-lasting performance with STMicroelectronics—where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body offers good durability and is lightweight, making it suitable for a variety of applications where weight and resilience are important.

Surface Mount: YES

As a surface mount device, this IC can be easily integrated into compact circuit designs, saving space and allowing for efficient manufacturing processes.

Package Shape: SQUARE

The square package shape aids in even heat distribution and facilitates easier layout design on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation provides higher performance and efficiency, reducing overall power consumption during data access.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with a wide range of digital systems, particularly in low-power applications.

No. of Terminals: 12

The 12-terminal configuration allows for increased functionality while maintaining a compact design, making it feasible for space-constrained applications.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile enable high-density mounting on PCBs, making it ideal for modern, compact electronic devices.

Maximum Operating Temperature: 85 °C

This IC can operate at a maximum temperature of 85 °C, making it suitable for a range of industrial and commercial environments.

Organization: 16KX1

The 16Kx1 organization offers a significant amount of memory for various applications, providing flexibility in data storage options.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for harsh environments and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options and may improve signal integrity in circuit designs.

Maximum Seated Height: 0.6 mm

The low seated height of 0.6 mm allows for a low-profile design, accommodating ultra-slim electronic products.

Width: 3 mm

A width of 3 mm contributes to the compact size of the IC, fitting seamlessly into space-restricted designs.

Minimum Supply Voltage (Vsup): 1.8 V

With a minimum supply voltage of 1.8V, this IC can operate efficiently in ultra-low-power applications, extending battery life.

Length: 3 mm

A length of 3 mm, combined with its width, creates a square footprint that is easily manageable on small PCBs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures indicates high reliability and performance in demanding environments.

Technology: CMOS

CMOS technology provides low static power consumption and is ideal for battery-operated devices, ensuring efficiency.

Terminal Form: NO LEAD

The no-lead terminal form reduces the size of the package, facilitating higher density PCB designs.

No. of Words: 16384 words

Offering 16,384 words of storage, this IC supports a variety of data storage needs in embedded applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for a compact layout, making it suitable for densely packed electronic circuits.

No. of Words Code: 16K

The 16K word count provides significant storage capacity, ideal for systems that require extensive data handling.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for flexibility in design, accommodating a range of power supply options.

Memory Density: 16384 bit

A memory density of 16,384 bits offers ample storage for a wide variety of applications, especially in compact designs.

Memory IC Type: MEMORY CIRCUIT

Designated as a memory circuit, this IC serves critical roles in data storage, retrieval, and buffering in numerous electronic systems.

Technical Specifications

Other Function Memory ICs ST25DV16K-IER6D3 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PDSO-N12

Length:

3 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

12

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ST25DV16K-IER6D3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19