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ST25DV16K-IER6G3

STMicroelectronics

ST25DV16K-IER6G3 by STMicroelectronics

ST25DV16K-IER6G3 from STMicroelectronics is a CMOS memory IC with 16K words, operating b/w 1.8V and 5.5V. It features synchronous operation and supports industrial temperature ranges from -40 °C to 85 °C. Ideal for applications requiring reliable non-volatile storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,319 parts In-Stock

1+ parts

-

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2,319

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Anansix

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,500

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Digiode

USA . 1,132 parts In-Stock

1+ parts

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1,132

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,335 parts In-Stock

1+ parts

$5.200

100+ parts

-

1k+ parts

$4.680

10k+ parts

-

1,335

$5.200

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$4.680

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MKK Technologies

India . 1,126 parts In-Stock

1+ parts

$9.778

100+ parts

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1,126

$9.778

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DigiPath Technology Company

USA . 1,126 parts In-Stock

1+ parts

$9.778

100+ parts

-

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10k+ parts

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1,126

$9.778

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Corphita

USA . 827 parts In-Stock

1+ parts

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827

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Parana Technologies

USA . 217 parts In-Stock

1+ parts

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$6.217

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217

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$6.217

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Overview

Unlock innovation with the ST25DV16K-IER6G3 memory IC from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This compact, durable chip operates efficiently across varied temperatures, making it perfect for industrial applications. Experience superior performance and reliability that enhance your designs, streamline production, and reduce time-to-market. Elevate your projects with a product designed to meet the demands of today's advanced technology landscape!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design makes this memory IC easy to integrate into compact electronic devices, providing greater flexibility in circuit board layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, enhancing overall system performance, particularly in high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is standard, allowing for compatibility with a wide range of modern digital circuits and reducing the need for additional voltage regulation.

Package Style (Meter): UNCASED CHIP

As an uncased chip, this product can be directly integrated into various custom applications, offering a cost-effective and space-saving solution.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C ensures reliable performance in a variety of environments, making it suitable for industrial and embedded applications.

Organization: 16KX1

With an organization of 16KX1, this memory IC provides a sufficient data storage solution for many applications, including microcontrollers and small embedded systems.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C makes this IC suitable for harsh environments, ensuring consistent performance in extreme conditions.

Terminal Position: UPPER

Upper terminal positioning allows for easier accessibility during soldering and further integration into PCBs, enhancing manufacturing efficiency.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a minimum supply voltage of 1.8V contributes to lower power consumption, making this IC ideal for battery-operated devices.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this product guarantees durability and reliability in demanding conditions typical of industrial use.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this memory IC suitable for a wide range of electrical applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces footprint and enhances soldering performance, simplifying the assembly process and improving reliability.

No. of Words: 16384 words

Offering 16,384 words of storage, this memory IC is well-suited for applications that require moderate data storage without occupying excessive space.

No. of Words Code: 16K

The 16K words code indicates a practical memory capacity for a variety of applications, balancing performance and space efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC provides flexibility in operation, accommodating systems that might require higher voltages.

Memory Density: 16384 bit

The memory density of 16,384 bits allows for efficient data storage, making it suitable for applications needing fast access and retrieval of stored information.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit, this product is essential for data storage applications, providing reliable and efficient memory solutions for various electronic designs.

Technical Specifications

Other Function Memory ICs ST25DV16K-IER6G3 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

ST25DV16K-IER6G3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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